TELECOM-LINE EQUALIZER, QCC20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor(TI ) |
| package instruction | 4 X 4 MM, LLP-16 |
| Reach Compliance Code | not_compliant |
| JESD-30 code | S-XQCC-N20 |
| JESD-609 code | e0 |
| length | 4 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | HVQCCN |
| Encapsulate equivalent code | LCC16,.16SQ,25 |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.8 mm |
| Maximum slew rate | 0.1 mA |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| Telecom integrated circuit types | LINE EQUALIZER |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn85Pb15) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 4 mm |
| LMH0344SQ | LMH0344 | LMH0344GR | LMH0344_09 | |
|---|---|---|---|---|
| Description | TELECOM-LINE EQUALIZER, QCC20 | TELECOM-LINE EQUALIZER, PBGA25 | TELECOM-LINE EQUALIZER, PBGA25 | TELECOM-LINE EQUALIZER, PBGA25 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 25 | 25 | 25 |
| Maximum operating temperature | 85 °C | 85 Cel | 85 °C | 85 Cel |
| Minimum operating temperature | -40 °C | -40 Cel | -40 °C | -40 Cel |
| surface mount | YES | Yes | YES | Yes |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | NO LEAD | BALL | BALL | BALL |
| Terminal location | QUAD | BOTTOM | BOTTOM | BOTTOM |