4 Pad Ceramic Crystal, 2.0 mm x 2.5 mm
Product Feature:
SMD Package
Small package Foot Print
Supplied in Tape and Reel
Compatible with Leadfree Processing
Fundamental Mode up to 80.0 MHz
ILCX18 Series
Applications:
PCMCIA Cards
Storage
PC’s
GSM Cell Phone
Wireless Lan
USB
GSM Cell Phone
2.50±0.10
MARKING
(TOP VIEW)
2.00±0.10
Frequency
ESR (Equivalent Series
Resistance)
12 MHz – 19.9 MHz
20 MHz – 29.9 MHz
30 MHz – 39.9 MHz
40 MHz – 60.0 MHz
60 MHz – 80.0 MHz
Shunt Capacitance (C0)
Frequency Tolerance @ 25
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
12.0 MHz to 80.0 MHz
CASE LID
.065 max
100
Max.
80
Max.
60
Max.
40
Max.
40
Max
3.5 pF Max.
30
ppm Standard (see Part Number Guide for more
options)
50
ppm Standard (see Part Number Guide for more
options)
AT Cut
18 pF Standard (see Part Number Guide for more options)
100 µW Max.
3
ppm Max. / Year Standard
0.58
0.90
1
2*
0.70
4*
3
0.75
*PIN 2 AND 4 ARE INTERNALLY
CONNECTED TO CASE LID AND SHOULD
BE CONNECTED TO GROUND.
1.70
1.30
1.00
0 C to +70 C Standard (see Part Number Guide for more
options)
-40 C to +85 C Standard
1.20
RECOMMEND
LAND PATTERN
DIMENSION IN mm
Storage
Notes:
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
ILCX18 -
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
ILCX18 - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
D = -10°C to +105°C*
E = -40°C to +105°C*
F = Fundamental
18 pF Standard
Or Specify
- 20.000 MHz
Mode
(overtone)
Load
Capacitance
(pF)
Frequency
** Not available for all temperature ranges.
ILSI America Phone 775-851-8880
●
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 05/06/16_G
Page 1 of 2
4 Pad Ceramic Crystal, 2.0 mm x 2.5 mm
Pb Free Solder Reflow Profile:
Typical Application:
ILCX18 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
Environmental Specifications:
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
3000
8.0 ±0.3
4.0 ±0.2
3.5 ±0.2
9.0±1.0 or 12.0 ±3.0
60 / 80
180
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking:
Line 1: I-Date Code (yww)
Line 2: Frequency
ILSI America Phone 775-851-8880
●
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 05/06/16_G
Page 2 of 2
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