MX66V2000-100SC datasheet, PDF

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MX66V2000-100SC: DescriptionStandard SRAM, 512KX8, 100ns, CMOS, PDSO32; Categorystorage storage; File Size564KB，9 Pages; ManufacturerMacronix; Websitehttp://www.macronix.com/en-us/Pages/default.aspx

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MX66V2000-100SC Overview

Standard SRAM, 512KX8, 100ns, CMOS, PDSO32

MX66V2000-100SC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	1164072197
package instruction	SOP, SOP32,.56
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	100 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP32,.56
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
power supply	3/5 V
Certification status	Not Qualified
Maximum standby current	0.00001 A
Minimum standby current	1.5 V
Maximum slew rate	0.02 mA
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL

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MX66V2000-100SC Related Products

	MX66V2000-100SC	MX66V2000-100TC	MX66V2000-100PC	MX66V2000-100TRC	MX66V2000-70PC	MX66V2000-70SC	MX66V2000-70TC	MX66V2000-70TRC
Description	Standard SRAM, 512KX8, 100ns, CMOS, PDSO32	Standard SRAM, 512KX8, 100ns, CMOS, PDSO32	Standard SRAM, 512KX8, 100ns, CMOS, PDIP32	Standard SRAM, 512KX8, 100ns, CMOS, PDSO32	Standard SRAM, 512KX8, 70ns, CMOS, PDIP32	Standard SRAM, 512KX8, 70ns, CMOS, PDSO32	Standard SRAM, 512KX8, 70ns, CMOS, PDSO32	Standard SRAM, 512KX8, 70ns, CMOS, PDSO32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Objectid	1164072197	1164072200	1164072196	1164072201	1164072202	1164072203	1164072206	1164072207
package instruction	SOP, SOP32,.56	TSSOP, TSSOP32,.8,20	DIP, DIP32,.6	TSSOP, TSSOP32,.8,20	DIP, DIP32,.6	SOP, SOP32,.56	TSSOP, TSSOP32,.8,20	TSSOP, TSSOP32,.8,20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	100 ns	100 ns	100 ns	100 ns	70 ns	70 ns	70 ns	70 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDIP-T32	R-PDSO-G32	R-PDIP-T32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8	8
Number of terminals	32	32	32	32	32	32	32	32
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	TSSOP	DIP	TSSOP	DIP	SOP	TSSOP	TSSOP
Encapsulate equivalent code	SOP32,.56	TSSOP32,.8,20	DIP32,.6	TSSOP32,.8,20	DIP32,.6	SOP32,.56	TSSOP32,.8,20	TSSOP32,.8,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A
Minimum standby current	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
Maximum slew rate	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA
surface mount	YES	YES	NO	YES	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	0.5 mm	2.54 mm	0.5 mm	2.54 mm	1.27 mm	0.5 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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