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MAX2309

Description
TELECOM, CELLULAR, BASEBAND CIRCUIT, QCC28
CategoryTopical application    Wireless rf/communication   
File Size232KB,20 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Download Datasheet Parametric Compare View All

MAX2309 Overview

TELECOM, CELLULAR, BASEBAND CIRCUIT, QCC28

MAX2309 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals28
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Rated supply voltage2.75 V
Processing package description5 × 5 MM, 0.90 MM HEIGHT, QFN-28
stateDISCONTINUED
packaging shapeSQUARE
Package SizeChip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
surface mountYes
Terminal formNO
Terminal spacing0.5000 mm
terminal coatingtin lead
Terminal locationFour
Packaging MaterialsUNSPECIFIED
Temperature levelINDUSTRIAL
Communication typebaseband circuit
19-2014; Rev 2; 7/01
E
AVAILABL
ATION KIT
EVALU
CDMA IF VGAs and I/Q Demodulators
with VCO and Synthesizer
General Description
The MAX2306/MAX2308/MAX2309 are IF receivers
designed for dual-band, dual-mode, and single-mode
N-CDMA and W-CDMA cellular phone systems. The
signal path consists of a variable-gain amplifier (VGA)
and I/Q demodulator. The devices feature guaranteed
+2.7V operation, a gain control range of over 110dB,
and high input IP3 (-31dBm at 35dB gain, 3.4dBm at
-35dB gain).
Unlike similar devices, the MAX2306 family of receivers
includes dual oscillators and synthesizers to form a
self-contained IF subsystem. The synthesizer’s refer-
ence and RF dividers are fully programmable through a
3-wire serial bus, enabling dual-band system architec-
tures using any common reference and IF frequency.
The differential baseband outputs have enough band-
width to suit both N-CDMA and W-CDMA systems, and
offer saturated output levels of 2.7Vp-p at a low +2.75V
supply voltage. Including the low-noise voltage-con-
trolled oscillator (VCO) and synthesizer, the MAX2306
draws only 26mA from a +2.75V supply in CDMA (dif-
ferential IF) mode.
The MAX2306/MAX2308/MAX2309 are available in 28-
pin QFN packages.
Features
o
Complete IF Subsystem Includes VCO and
Synthesizer
o
Supports Dual-Band, Triple-Mode Operation
o
VGA with >110dB Gain Control
o
Quadrature Demodulator
o
High Output Level (2.7V)
o
Programmable Charge-Pump Current
o
Supports Any IF Frequency Between 40MHz and
300MHz
o
3-Wire Programmable Interface
o
Low Supply Voltage (+2.7V)
MAX2306/MAX2308/MAX2309
Ordering Information
PART
MAX2306EGI
MAX2308EGI
MAX2309EGI
TEMP. RANGE
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
28 QFN-EP*
28 QFN-EP*
28 QFN-EP*
Applications
Single/Dual/Triple-Mode CDMA Handsets
Globalstar Dual-Mode Handsets
Wireless Data Links
W-CDMA Handsets
Wireless Local Loop (WLL)
*Exposed paddle
Pin Configurations appear at end of data sheet.
Block Diagram appears at end of data sheet.
Selector Guide
PART
MODE
AMPS,
Cellular CDMA,
PCS CDMA
AMPS,
Cellular CDMA,
PCS CDMA
External AMPS,
Cellular CDMA,
PCS CDMA
DESCRIPTION
Dual Band, Triple Mode with Two
IF VCOs
INPUT RANGE
MAX2306
40MHz to 300MHz
MAX2308
Dual Band, Triple Mode with Common
IF VCO
70MHz to 300MHz
MAX2309
Dual Band, Triple Mode (Drives External
AMPS Discriminator)
70MHz to 300MHz
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX2309 Related Products

MAX2309 MAX2306-MAX2309 MAX2306
Description TELECOM, CELLULAR, BASEBAND CIRCUIT, QCC28 TELECOM, CELLULAR, BASEBAND CIRCUIT, QCC28 TELECOM, CELLULAR, BASEBAND CIRCUIT, QCC28
Number of functions 1 1 1
Number of terminals 28 28 28
Maximum operating temperature 85 Cel 85 Cel 85 Cel
Minimum operating temperature -40 Cel -40 Cel -40 Cel
Rated supply voltage 2.75 V 2.75 V 2.75 V
Processing package description 5 × 5 MM, 0.90 MM HEIGHT, QFN-28 5 × 5 MM, 0.90 MM HEIGHT, QFN-28 5 × 5 MM, 0.90 MM HEIGHT, QFN-28
state DISCONTINUED DISCONTINUED DISCONTINUED
packaging shape SQUARE SQUARE SQUARE
Package Size Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
surface mount Yes Yes Yes
Terminal form NO NO NO
Terminal spacing 0.5000 mm 0.5000 mm 0.5000 mm
terminal coating tin lead tin lead tin lead
Terminal location Four Four Four
Packaging Materials UNSPECIFIED UNSPECIFIED UNSPECIFIED
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Communication type baseband circuit baseband circuit baseband circuit
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