C0805A271M2XAH7189 datasheet, PDF

Datasheet> All Categories > Passive components> capacitor> C0805A271M2XAH7189

C0805A271M2XAH7189: DescriptionCeramic Capacitor, Ceramic, 200V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.00027uF, 0805,; CategoryPassive components capacitor; File Size1MB，8 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

Download Datasheet Parametric View All

C0805A271M2XAH7189 Overview

Ceramic Capacitor, Ceramic, 200V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.00027uF, 0805,

C0805A271M2XAH7189 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	709402320
package instruction	, 0805
Reach Compliance Code	not_compliant
ECCN code	EAR99
capacitance	0.00027 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	1.4 mm
JESD-609 code	e0
length	2.03 mm
negative tolerance	20%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package form	SMT
method of packing	TR, Plastic, 7 Inch
positive tolerance	20%
Rated (DC) voltage (URdc)	200 V
series	C(SIZE)A
size code	0805
Temperature characteristic code	X7R
Temperature Coefficient	-/+15ppm/Cel ppm/°C
Terminal surface	Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
width	1.27 mm

Preview

Download Datasheet

View All

CERAMIC HIGH RELIABILITY

GENERAL INFORMATION GR900 SERIES

HIGH RELIABILITY — GR900

/ Q-SPEC

GR900 capacitors are intended for use in any application where the

chance of failure must be reduced to the lowest possible level. While

any well-made multilayer ceramic capacitor is an inherently reliable

device, GR900 capacitors receive special attention in all phases of

manufacture including:

•

Raw Materials Selection

•

Clean Room Production

•

Individual Batch Testing

•

C-SAM (when applicable)

•

Singular Batch Identity is Maintained

•

Destructive Physical Analysis

•

These parts are well worth the added investment in comparison to the

cost of a device or system failure.

Typical applications include: Medical, Aerospace, Communication

Satellites, Radar and Guidance Systems.

SCREENING AND SAMPLE TESTS

Each batch receives the following testing/inspections:

In Process Inspection (Per MIL-PRF-123):

100% Visual Inspection.

Destructive Physical Analysis: (DPA) - A sample is pulled from

each lot and examined per EIA-469 and KEMET’s strict internal

void and delamination criteria. Sampling plan is per MIL-PRF-123.

C-SAM (GR900 / “A” in the fifth character position of the ordering

code): May be performed on batches failing to meet the DPA

criteria for removal of marginal product. Not required on each lot.

C-SAM (Q-SPEC / “Q” in the fifth character position of the ordering

code): Receive 100% C-SAM of lot prior to application of end

metallization.

Group A

1. Thermal Shock:

Materials used in the construction of multilayer

ceramic capacitors possess various thermal coefficients of expansion.

To assure maximum uniformity, each part is temperature cycled in

accordance to MIL-STD-202, Method 107, Condition A with Step 3

being 125°C. Number of cycles shall be 20 (100% of lot).

2. Voltage Conditioning:

One of the most strenuous environments for

any capacitor is the high temperature/high voltage test. All units are

subject to twice-rated voltage to the units at the maximum rated

temperature of 125°C for a minimum of 168 hours and a maximum of

264 hours. The voltage conditioning may be terminated at any time

during 168 hours to 264 hours time interval that confirmed failures meet

the requirements of the PDA during the last 48 hours of 1 unit or .4%

(100% of lot).

Optional Voltage Conditioning (Accelerated Voltage

Conditioning):

All conditions of the standard voltage conditioning

apply with the exception of increased voltage and decreased test time.

Refer to MIL-PRF-123 for the proper formula.

*Step 5 is performed on chips at this point (100% of lot).

3. Dielectric Withstanding Voltage:

250% of the DC rated voltage at

25°C (100% of lot).

9. Percent Defective Allowable (PDA):

The overall PDA is 8% for

parts outside the MIL-PRF-123 values. The PDA is per MIL-PRF-

123 for all parts that are valid MIL-PRF-123 values. The PD

includes steps 1 through 8 above with the following exceptions.

Capacitance exclusion - capacitance values no more than 5% or

.5pF, whichever is greater for BX characteristic or 1% or .3pF,

whichever is greater for BP characteristic beyond specified

tolerance limit, shall be removed from the lot but shall not be

considered defective for determination of the PD.

Insulation Resistance at 25°C — Product which is not acceptable

for twice the military limit but is acceptable per the military limit, is

removed from the lot but shall not be considered defective for

determination of the PD.

10. Visual and Mechanical Examination:

Performed per MIL-

PRF-123 criteria.

11. Radiographic Examination (Leaded Devices Only):

Radial

devices receive a one-plane X-ray.

12. Destructive Physical Analysis (DPA):

A sample is examined

on each lot per EIA-469. Sampling Plan is per MIL-PRF-123.

STANDARD PACKAGING

All products are packaged in trays except C512 capacitors which

are packaged 1 piece per bag.

*Note: All packaging is ESD protected.

DATA PACKAGE

A data package is sent with each shipment which contains:

1. Final Destructive Physical Analysis (DPA) report.

2. Certificate of Compliance stating that the parts meet all

applicable requirements of the appropriate military specification to

the best failure level to which KEMET is approved.

3. Summary of Group A Testing.

Group B

MIL-PRF-123 Group B testing is available with special order.

Please contact KEMET for additional information and ordering

details.

4. Insulation Resistance:

The 25°C measurement with rated

voltage applied shall be the lesser of 100 GΩ or 1000 Megohm -

Microfarads (100% of lot).

*5. Insulation Resistance:

The 125°C measurement with rated

voltage applied shall be the lesser of 10 GΩ or 100 Megohm -

Microfarads (100% of lot). For chips, 125°C IR is performed prior to

Step 3 above.

6. Storage

at 150°C for 2 hours minimum without voltage applied

followed by a 12-hour minimum stabilization period (temperature

characteristic BX only).

7. Capacitance:

Shall be within specified tolerance at 25°C (100%

of lot). (Aging phenomenon is taken into account for BX dielectric

to obtain capacitance.)

8. Dissipation Factor:

Shall not exceed 2.5% for X7R (BX)

dielectric, 0.15% for C0G (BP) dielectric at 25°C. (100% of lot.)

Recommended Resources

Driving circuit diagram of a low-power LED bulb

STK1045 power amplifier circuit diagram

Small DC booster circuit diagram

Pulse telephone outgoing call limiter circuit diagram

Parallel regulated power supply composed of LM109

LCD electronic thermometer circuit

[STM32F7 League of Legends Contest] Internet Radio RadioYuN-Design Summary: The design has come to an end. I was delayed by various things and didn't spend too much time on the project. There were only three members in the team. In the end, freebsder completed the core functi...; lyzhangxiang stm32/stm8

Urgently looking for protocol stack sleep wake-up mode: I recently encountered a problem. The terminal successfully connected to the router, and then left the router for a period of time and was offline. The terminal started a timer inside to monitor wheth...; f3597908 RF/Wirelessly

DDR3特點和設計指導/Hardware and Layout Design Considerations for DDR3 SDRAM M...: DDR方面教學...; hwan67 PCB Design

Please help me look at this circuit diagram: I want to make a triple DC boost circuit. When I simulate it on EWB, the output voltage cannot reach the target, but I can't find the boost network. Can the expert help me analyze and improve it? It w...; hailang Power technology

Does anyone have a good price for TI2541?: Looking for chip TI2541, DA14580, large quantity, QQ710997...; kavier RF/Wirelessly

RK3288 baseboard + core board design process: RK 3288 baseboard + core board design process The first step is to get the customer demand document. The following are the requirements put forward by the customer: 001.png (98.02 KB, Downloads: 0)Dow...; qq7643066 PCB Design

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components