TMS320C5421GGUR200 datasheet, PDF

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TMS320C5421GGUR200: DescriptionDigital Signal Processor 144-BGA MICROSTAR; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，105 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TMS320C5421GGUR200 Overview

Digital Signal Processor 144-BGA MICROSTAR

TMS320C5421GGUR200 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	LFBGA, BGA144,13X13,32
Contacts	144
Reach Compliance Code	_compli
ECCN code	3A001.A.3
Other features	ALSO REQUIRES 3.3V SUPPLY
Address bus width	19
barrel shifter	YES
bit size	16
boundary scan	YES
maximum clock frequency	50 MHz
External data bus width	16
Format	FIXED POINT
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B144
JESD-609 code	e0
length	12 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	144
Maximum operating temperature	85 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA144,13X13,32
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	220
power supply	1.8,3.3 V
Certification status	Not Qualified
RAM (number of words)	65536
Maximum seat height	1.4 mm
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	12 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER

TMS320C5421GGUR200 Related Products

	TMS320C5421GGUR200	TMS320VC5421GGU200	TMS320VC5421PGE200	TMS320VC5421ZGU200
Description	Digital Signal Processor 144-BGA MICROSTAR	Digital Signal Processor 144-BGA MICROSTAR 0 to 0	Digital Signal Processor 144-LQFP 0 to 0	Digital Signal Processor 144-BGA MICROSTAR
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it Rohs certified?	incompatible	incompatible	conform to	conform to
Parts packaging code	BGA	BGA	QFP	BGA
package instruction	LFBGA, BGA144,13X13,32	LFBGA, BGA144,13X13,32	LFQFP, QFP144,.87SQ,20	LFBGA, BGA144,13X13,32
Contacts	144	144	144	144
Reach Compliance Code	_compli	_compli	compli	compli
ECCN code	3A001.A.3	3A001.A.3	3A991.A.2	3A001.A.3
Other features	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY
Address bus width	19	19	19	19
barrel shifter	YES	YES	YES	YES
bit size	16	32	32	32
boundary scan	YES	YES	YES	YES
maximum clock frequency	50 MHz	50 MHz	50 MHz	50 MHz
External data bus width	16	16	16	16
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Internal bus architecture	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B144	S-PBGA-B144	S-PQFP-G144	S-PBGA-B144
JESD-609 code	e0	e0	e4	e1
length	12 mm	12 mm	20 mm	12 mm
low power mode	YES	YES	YES	YES
Humidity sensitivity level	3	3	1	3
Number of terminals	144	144	144	144
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFQFP	LFBGA
Encapsulate equivalent code	BGA144,13X13,32	BGA144,13X13,32	QFP144,.87SQ,20	BGA144,13X13,32
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	220	220	260	260
power supply	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	65536	65536	65536	65536
Maximum seat height	1.4 mm	1.4 mm	1.6 mm	1.4 mm
Maximum supply voltage	5.25 V	1.98 V	1.98 V	1.98 V
Minimum supply voltage	4.75 V	1.75 V	1.75 V	1.75 V
Nominal supply voltage	5 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL	GULL WING	BALL
Terminal pitch	0.8 mm	0.8 mm	0.5 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	QUAD	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	12 mm	12 mm	20 mm	12 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Maker	Texas Instruments	-	Texas Instruments	Texas Instruments

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