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NSS3005NZTAG

Description
N-Channel MOSFET Small Signal BJT and MOSFET
File Size123KB,7 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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NSS3005NZTAG Overview

N-Channel MOSFET Small Signal BJT and MOSFET

NSM3005NZ
Small Signal BJT and
MOSFET
30 V, 500 mA, PNP BJT with 20 V, 224 mA,
N−Channel MOSFET
Features
www.onsemi.com
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
6
1
UDFN6
CASE 517AT
mCOOLt
Unit
V
V
V
mA
mA
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
Portable Devices
Q1 MAXIMUM RATINGS
(T
J
= 25°C unless otherwise specified)
Parameter
Collector–Emitter Voltage
Collector–Base Voltage
Emitter–Base Voltage
Collector Current
Base Current
Symbol
V
CEO
V
CBO
V
EBO
I
C
I
B
Value
30
40
5.0
500
50
MARKING DIAGRAM
1
XX MG
G
Q2 MAXIMUM RATINGS
(T
J
= 25°C unless otherwise specified)
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Steady
State
t
5s
Pulsed Drain Current
Source Current (Body Diode)
T
A
= 25°C
T
A
= 85°C
T
A
= 25°C
T
p
= 10
ms
I
DM
I
S
Symbol
V
DSS
V
GS
I
D
Value
20
±8
224
162
241
673
120
mA
mA
Unit
V
V
mA
PIN CONNECTIONS
THERMAL CHARACTERISTICS
Parameter
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T
A
= 25°C
Operating Junction and Storage
Temperature
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Symbol
R
qJA
P
D
T
J
, T
STG
T
L
Value
245
0.8
−55 to
150
260
Unit
°C/W
W
°C
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu. area = 1.127 in sq [1 oz] including traces).
ORDERING INFORMATION
Device
NSS3005NZTAG
Package
UDFN6
(Pb−Free)
Shipping
3000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2016
1
January, 2016 − Rev. 1
Publication Order Number:
NSM3005NZ/D

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