IC,MEMORY MANAGEMENT UNIT,MOS,DIP,48PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Objectid | 1435298768 |
| package instruction | DIP, DIP48,.6 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T48 |
| JESD-609 code | e0 |
| Number of terminals | 48 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP48,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | MOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| uPs/uCs/peripheral integrated circuit type | MEMORY MANAGEMENT UNIT |
| NS32082N6 | NS32082D-10 | NS32082N-10 | NS32082N8 | NS32082D | NS32082D8 | |
|---|---|---|---|---|---|---|
| Description | IC,MEMORY MANAGEMENT UNIT,MOS,DIP,48PIN,PLASTIC | 16-BIT, MEMORY MANAGEMENT UNIT, CDIP48, HERMETIC SEALED, DIP-48 | IC,MEMORY MANAGEMENT UNIT,MOS,DIP,48PIN,PLASTIC | IC,MEMORY MANAGEMENT UNIT,MOS,DIP,48PIN,PLASTIC | IC,MEMORY MANAGEMENT UNIT,MOS,DIP,48PIN,CERAMIC | IC,MEMORY MANAGEMENT UNIT,MOS,DIP,48PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP48,.6 | DIP, DIP48,.6 | DIP, DIP48,.6 | DIP, DIP48,.6 | DIP, DIP48,.6 | DIP, DIP48,.6 |
| Reach Compliance Code | unknown | unknown | unknow | unknow | unknown | unknown |
| JESD-30 code | R-PDIP-T48 | R-CDIP-T48 | R-PDIP-T48 | R-PDIP-T48 | R-XDIP-T48 | R-XDIP-T48 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 48 | 48 | 48 | 48 | 48 | 48 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP48,.6 | DIP48,.6 | DIP48,.6 | DIP48,.6 | DIP48,.6 | DIP48,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | MOS | CMOS | MOS | MOS | MOS | MOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| uPs/uCs/peripheral integrated circuit type | MEMORY MANAGEMENT UNIT | MEMORY MANAGEMENT UNIT | MEMORY MANAGEMENT UNIT | MEMORY MANAGEMENT UNIT | MEMORY MANAGEMENT UNIT | MEMORY MANAGEMENT UNIT |
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