NS32082N-10 datasheet, PDF - EEWORLD Datasheet

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NS32082N-10: DescriptionIC,MEMORY MANAGEMENT UNIT,MOS,DIP,48PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，39 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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NS32082N-10 Overview

IC,MEMORY MANAGEMENT UNIT,MOS,DIP,48PIN,PLASTIC

NS32082N-10 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP48,.6
Reach Compliance Code	unknow
JESD-30 code	R-PDIP-T48
JESD-609 code	e0
Number of terminals	48
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP48,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
surface mount	NO
technology	MOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
uPs/uCs/peripheral integrated circuit type	MEMORY MANAGEMENT UNIT

NS32082N-10 Related Products

	NS32082N-10	NS32082D-10	NS32082N8	NS32082D	NS32082D8	NS32082N6
Description	IC,MEMORY MANAGEMENT UNIT,MOS,DIP,48PIN,PLASTIC	16-BIT, MEMORY MANAGEMENT UNIT, CDIP48, HERMETIC SEALED, DIP-48	IC,MEMORY MANAGEMENT UNIT,MOS,DIP,48PIN,PLASTIC	IC,MEMORY MANAGEMENT UNIT,MOS,DIP,48PIN,CERAMIC	IC,MEMORY MANAGEMENT UNIT,MOS,DIP,48PIN,CERAMIC	IC,MEMORY MANAGEMENT UNIT,MOS,DIP,48PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP48,.6	DIP, DIP48,.6	DIP, DIP48,.6	DIP, DIP48,.6	DIP, DIP48,.6	DIP, DIP48,.6
Reach Compliance Code	unknow	unknown	unknow	unknown	unknown	unknown
JESD-30 code	R-PDIP-T48	R-CDIP-T48	R-PDIP-T48	R-XDIP-T48	R-XDIP-T48	R-PDIP-T48
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of terminals	48	48	48	48	48	48
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP48,.6	DIP48,.6	DIP48,.6	DIP48,.6	DIP48,.6	DIP48,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	NO
technology	MOS	CMOS	MOS	MOS	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
uPs/uCs/peripheral integrated circuit type	MEMORY MANAGEMENT UNIT	MEMORY MANAGEMENT UNIT	MEMORY MANAGEMENT UNIT	MEMORY MANAGEMENT UNIT	MEMORY MANAGEMENT UNIT	MEMORY MANAGEMENT UNIT

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