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WDBR7

Description
Ultra Low Profile Power Resistors
File Size377KB,5 Pages
ManufacturerETC2
Download Datasheet Compare View All

WDBR7 Overview

Ultra Low Profile Power Resistors

Ultra Low Profile
Power Resistors
WDBR Series
·
·
·
·
·
·
·
·
Ultra low profile thick-film on steel
500W to 7kW peak power
Single fixing heatsink mountable
Ideal for dynamic braking, inrush limit and
snubber circuits
Choice of flying lead, push-on or solder terminations
Low inductance design
High isolation, even after failsafe overload fusing
RoHS compliant, non-flammable construction
Electrical Data
WDBR1/2
Resistance range
Resistance tolerance
Pulse power rating
1
Power rating on heatsink
TCR
Maximum element temperature
Ambient temperature range (heatsink)
Dielectric withstand
4
Inductance (typical)
2
WDBR1
WDBR2
WDBR3
WDBR5
WDBR7
ohms
%
kW
W
W
ppm/°C
°C
°C
μH
V (dc/ac peak)
12, 15, 20, 22, 25,
47, 50, 100
0.5
160
300
1.5
180
700
12, 15, 20, 22, 25, 47, 50, 100, 150
10
2.0
200
780
+500 to +600
365
-55 to +200
2500
<3
<4
<5
<6
3.5
260
900
5.0
270
1000
7.0
280
1490
Power rating on fan-cooled heatsink
3
Notes:
1. For details of pulse condition see Fig. 1 in Performance Data.
2. Mounted on a 0.53°C/W heatsink with no forced air cooling, air temperature 25°C.
3. Mounted on a 0.53°C/W heatsink with 5m/s forced air cooling, air temperature 25°C.
4. Based on 100% production test, duration 2s minimum
Physical Data
Dimensions in mm, weight without terminations in g
L ±0.1 W ±0.1 t ±0.1 ØD nom a nom b nom c nom Wt. nom
WDBR1/2
WDBR1
WDBR2
WDBR3
WDBR5
WDBR7
31.9
49.3
61
101.6
122
152.4
28.1
35.9
40.6
70
70
101.6
1.5
0.9
5.3
2.2
3.2
7.5
3.2
4.7
13.5
14.0
15.0
3.1
11.2
13.0
22.0
23.8
51.3
4.3
6.2
5.8
10.2
7.4
9.2
6.5
12.6
17.1
50.8
60.7
181.8
L
Substrate thickness = t
W
D
c
a
b
Fixing hole is located centrally except on WDBR1/2 where the dimension from
the edge by the terminations to the mounting hole centre is 16.68mm
Construction
A high integrity dielectric layer is applied to a machined
stainless steel substrate. Thick-film conductor and resistor
patterns are printed and fired, then protected with a high
temperature overglaze. The termination pads are tinned with
solder and optional terminals or leads are soldered on.
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
2.14

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