Jbar-Kbar Flip-Flop, 9-Func, Positive Edge Triggered, CMOS, PDIP24
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Objectid | 1157440845 |
| Reach Compliance Code | not_compliant |
| JESD-30 code | R-PDIP-T24 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | JBAR-KBAR FLIP-FLOP |
| Maximum Frequency@Nom-Sup | 71400000 Hz |
| MaximumI(ol) | 0.012 A |
| Number of functions | 9 |
| Number of terminals | 24 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Prop。Delay @ Nom-Sup | 10 ns |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn85Pb15) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Trigger type | POSITIVE EDGE |
| 74FCT2823ATP | 54FCT2823BTEB | 74FCT2823CTSO | 54FCT2823BTLB | 74FCT2823ATPY | 74FCT2823CTP | 74FCT2823CTPY | 54FCT2825CTLB | |
|---|---|---|---|---|---|---|---|---|
| Description | Jbar-Kbar Flip-Flop, 9-Func, Positive Edge Triggered, CMOS, PDIP24 | Jbar-Kbar Flip-Flop, 9-Func, Positive Edge Triggered, CMOS, CDFP24 | Jbar-Kbar Flip-Flop, 9-Func, Positive Edge Triggered, CMOS, PDSO24 | Jbar-Kbar Flip-Flop, 9-Func, Positive Edge Triggered, CMOS, CQCC28 | Jbar-Kbar Flip-Flop, 9-Func, Positive Edge Triggered, CMOS, PDSO24 | Jbar-Kbar Flip-Flop, 9-Func, Positive Edge Triggered, CMOS, PDIP24 | Jbar-Kbar Flip-Flop, 9-Func, Positive Edge Triggered, CMOS, PDSO24 | Jbar-Kbar Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CQCC28 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 code | R-PDIP-T24 | R-XDFP-F24 | R-PDSO-G24 | S-XQCC-N28 | R-PDSO-G24 | R-PDIP-T24 | R-PDSO-G24 | S-XQCC-N28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | JBAR-KBAR FLIP-FLOP | JBAR-KBAR FLIP-FLOP | JBAR-KBAR FLIP-FLOP | JBAR-KBAR FLIP-FLOP | JBAR-KBAR FLIP-FLOP | JBAR-KBAR FLIP-FLOP | JBAR-KBAR FLIP-FLOP | JBAR-KBAR FLIP-FLOP |
| Maximum Frequency@Nom-Sup | 71400000 Hz | 83300000 Hz | 83300000 Hz | 83300000 Hz | 71400000 Hz | 83300000 Hz | 83300000 Hz | 83300000 Hz |
| MaximumI(ol) | 0.012 A | 0.012 A | 0.012 A | 0.012 A | 0.012 A | 0.012 A | 0.012 A | 0.012 A |
| Number of functions | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 8 |
| Number of terminals | 24 | 24 | 24 | 28 | 24 | 24 | 24 | 28 |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | DFP | SOP | QCCN | SSOP | DIP | SSOP | QCCN |
| Encapsulate equivalent code | DIP24,.3 | FL24,.4 | SOP24,.4 | LCC28,.45SQ | SSOP24,.3 | DIP24,.3 | SSOP24,.3 | LCC28,.45SQ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | IN-LINE | FLATPACK | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 240 | NOT SPECIFIED | 240 | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 10 ns | 8.5 ns | 6 ns | 8.5 ns | 10 ns | 6 ns | 6 ns | 7 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | YES | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | FLAT | GULL WING | NO LEAD | GULL WING | THROUGH-HOLE | GULL WING | NO LEAD |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.635 mm | 2.54 mm | 0.635 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 20 | NOT SPECIFIED | 20 | NOT SPECIFIED |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Objectid | 1157440845 | - | - | 1157440506 | 1157440844 | 1157440853 | 1157440852 | 1157440514 |
| package instruction | - | - | SOP, SOP24,.4 | QCCN, LCC28,.45SQ | SSOP, SSOP24,.3 | - | SSOP, SSOP24,.3 | QCCN, LCC28,.45SQ |
Analog electronics
Talking
LED Zone
FPGA/CPLD
Embedded System
DSP and ARM Processors
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