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NVLUS4C12N

Description
Single N-Channel Power MOSFET
File Size86KB,6 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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NVLUS4C12N Overview

Single N-Channel Power MOSFET

NVLUS4C12N
Power MOSFET
30 V, 10.7 A, Single N−Channel,
2.0x2.0x0.55 mm
mCoolt
UDFN6 Package
Features
Low Profile UDFN 2.0 x 2.0 x 0.55 mm for Board Space Saving with
Exposed Drain Pads for Excellent Thermal Conduction
Ultra Low R
DS(on)
to Reduce Conduction Losses
Optimized Gate Charge to Reduce Switching Losses
Low Capacitance to Minimize Driver Losses
NV Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
www.onsemi.com
MOSFET
V
(BR)DSS
R
DS(on)
MAX
9 mW @ 10 V
30 V
12 mW @ 4.5 V
15 mW @ 3.7 V
19 mW @ 3.3 V
10.7 A
I
D
MAX
Applications
D
Power Load Switch
Synch DC−DC Converters
Wireless Charging Circuit
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise stated)
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain
Current (Note 1)
Steady
State
t
5s
Power Dissipa-
tion (Note 1)
Steady
State
t
5s
Continuous Drain
Current (Note 2)
Steady
State
T
A
= 25°C
T
A
= 85°C
T
A
= 25°C
T
A
= 25°C
T
A
= 25°C
T
A
= 25°C
T
A
= 85°C
T
A
= 25°C
t
p
= 10
ms
P
D
I
DM
T
J
,
T
STG
I
S
T
L
I
D
P
D
Symbol
V
DSS
V
GS
I
D
Value
30
±20
10.7
7.7
15.1
1.54
3.1
6.8
4.9
0.63
43
-55 to
150
1.55
260
W
A
°C
A
°C
G
D
A
W
Pin 1
Unit
V
V
A
S
G
S
N−CHANNEL MOSFET
MARKING DIAGRAM
D
1
UDFN6
(mCOOL])
CASE 517BG
AGMG
G
AG = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
Power Dissipation (Note 2)
Pulsed Drain Current
MOSFET Operating Junction and Storage
Temperature
Source Current (Body Diode) (Note 1)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
1
D
6
D
D
2
5
D
3
S
(Top View)
4
S
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface-mounted on FR4 board using the minimum recommended pad size,
2 oz. Cu.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
©
Semiconductor Components Industries, LLC, 2014
1
December, 2014 − Rev. 0
Publication Order Number:
NVLUS4C12N/D

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