EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-T0303AG-02-1320-CJ

Description
Array/Network Resistor, Center Tap, Thin Film, 0.25W, 132ohm, 100V, 0.25% +/-Tol, -50,50ppm/Cel, 0303,
CategoryPassive components    The resistor   
File Size376KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance
Download Datasheet Parametric View All

WBC-T0303AG-02-1320-CJ Overview

Array/Network Resistor, Center Tap, Thin Film, 0.25W, 132ohm, 100V, 0.25% +/-Tol, -50,50ppm/Cel, 0303,

WBC-T0303AG-02-1320-CJ Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid802603701
Reach Compliance Codecompliant
ECCN codeEAR99
structureChip
Network TypeCenter Tap
Number of terminals6
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package length0.762 mm
Package formSMT
Package width0.762 mm
method of packingTray
Rated power dissipation(P)0.25 W
resistance132 Ω
Resistor typeARRAY/NETWORK RESISTOR
seriesWBC(TAPPED)
size code0303
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Tolerance0.25%
Operating Voltage100 V
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC Advanced Film Division
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
R
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
Passivation
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Gold available)
Gold
3KÅ minimum
Silicon Dioxide or
Silicon Nitride
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
R
Top contact
pad chamfered
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
Backside
½R
½R
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue April 2006
Design of PCI Bus Interface Based on FPGA
[b]Abstract[/b]: PCI is a high-performance local bus specification that can implement various functional standard PCI bus cards. This article briefly introduces the characteristics, signals and comman...
maker FPGA/CPLD
Can SensorTile be added to the biometric sensor platform at this time?
SensorTile's environmental sensors are comprehensive and powerful, but if you want to make wearable products, biometric sensors are essential, such as heart rate sensors. Recently, I noticed a piece o...
梁志坚 MEMS sensors
A strange problem, the result of comparing the size of a signed 32-bit number with an unsigned 32-bit number is wrong
A strange problem, the result of comparing a signed 32-bit number with an unsigned 32-bit number is wrong. In the figure below, je=-3, sbsj.baojing2=0. Normally, after the comparison if (je =sbsj.baoj...
一沙一世 stm32/stm8
Meet PADS 9.3
[align=left][color=#000000][b][size=5][font=Times New Roman]PADS 9.3 [/font] Feature Highlights [font=Times New Roman] [/font][/size][/b][/color][/align][align=left][color=#000000][font=Times New Roma...
dontium PCB Design
What software can be used to open files with the DZK suffix?
What software should be used to open files with DZK and HZK suffixes?...
HUI535233725 MCU
Understanding Next-Generation Data Acquisition Technologies
Source: NI:Understanding the Next Generation of Data Acquisition Technologies —The Advantages of USB and Wi-Fi Data Acquisition Graham Green, National Instruments Over the past 20 years, data acquisit...
安_然 Test/Measurement

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 949  792  736  1808  1964  20  16  15  37  40 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号