datasheet
EEWORLDEEWORLDEEWORLD
Datasheet
Part Number

Keyword

Search
Keyword

Part Number

Search
Datasheet> All Categories > Passive components> The resistor> HCHP0505K2294DNTB
PDF
Preview

HCHP0505K2294DNTB

Description
Fixed Resistor, Metal Glaze/thick Film, 0.125W, 2290000ohm, 50V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 0505, CHIP
CategoryPassive components    The resistor   
File Size156KB，9 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

HCHP0505K2294DNTB Overview

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 2290000ohm, 50V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 0505, CHIP

HCHP0505K2294DNTB Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid145115136818
package instructionSMT, 0505
Reach Compliance Codeunknown
ECCN codeEAR99
structureRECTANGULAR PACKAGE
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.38 mm
Package length1.25 mm
Package formSMT
Package width1.22 mm
method of packingTR, PLASTIC
Rated power dissipation(P)0.125 W
Rated temperature70 °C
resistance2290000 Ω
Resistor typeFIXED RESISTOR
size code0505
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal shapeWRAPAROUND
Tolerance0.5%
Operating Voltage50 V

HCHP0505K2294DNTB Preview

CHP, HCHP
www.vishay.com
Vishay Sfernice
High Stability Resistor Chips
(< 0.25 % at Pn at 70 °C during 1000 h) Thick Film Technology
FEATURES
• CHP: standard passivated version for
industrial, professional and military applications
Available
• Robust terminations
• Large ohmic value range 0.1
to 100 M
• Tight tolerance to 0.5 %
• HCHP: for high frequency applications
• ESCC approved see CHPHR
Available
DESIGN SUPPORT TOOLS
Models
Available
click logo to get started
• High temperature (245 °C) see CHPHT
• SMD wraparound chip resistor
• Halogen-free according to IEC 61249-2-21 definition
• Withstand moisture resistance test of AEC-Q200
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
Vishay Sfernice thick film resistor chips are specially
designed to meet very stringent specifications in terms
of reliability, stability < 0.25 % at Pn at +70 °C during
1000 h, homogeneity, reproducibility and quality.
They conform to specifications NFC 83-240 and
MIL-R-55342 D.
Evaluated to ESCC 4001/026 (see CHPHR datasheet).
Sputtered Thin Film terminations, with nickel barrier, are
very convenient for high operating conditions. They can
withstand thousands of very severe thermal shocks.
B (W/A), N (W/A), and F (one face) types are for solder reflow
assembly.
G (W/A) and W (one face) types are for wire bonding, gluing
and even high temperature solder reflow.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
SIZE
RATED
POWER
Pn
W
LIMITING
ELEMENT
VOLTAGE
V
MAX. OVERLOAD RESISTANCE
TEMPERATURE UNIT
TOLERANCE
VOLTAGE
RANGE
(1)
COEFFICIENT WEIGHT
±%
V
± ppm/°C
mg
1
3
2
4
5
8
8
26
25
21
42
12
CHP0502
0.050
50
100
0.1 to 25M
0.5, 1, 2, 5
100, 200
HCHP0502 0502
CHP0505
0505
0.125
50
100
0.1 to 10M
0.5, 1, 2, 5
100, 200
HCHP0505
CHP0603
0603
0.125
50
100
0.1 to 25M
0.5, 1, 2, 5
100, 200
HCHP0603
CHP0805
(2)
0.200
150
300
0.1 to 25M
0.5, 1, 2, 5
100, 200
HCHP0805 0805
CHP1005
1005
0.250
150
300
0.1 to 50M
0.5, 1, 2, 5
100, 200
HCHP1005
CHP1206
1206
0.250
200
400
0.1 to 50M
0.5, 1, 2, 5
100, 200
HCHP1206
CHP1505
0.500
200
400
0.1 to 75M
0.5, 1, 2, 5
100, 200
HCHP1505 1505
CHP2010
2010
1.000
(3)
200
400
0.1 to 100M
0.5, 1, 2, 5
100, 200
HCHP2010
CHP1020
1020
1.000
(3)
200
400
0.1 to 10M
0.5, 1, 2, 5
100, 200
HCHP1020
CHP2208
0.750
200
400
0.1 to 100M
0.5, 1, 2, 5
100, 200
HCHP2208 2208
CHP2512
2512
2.000
(3)
250
500
0.1 to 100M
0.5, 1, 2, 5
100, 200
CHP2512
CHP1010
1010
0.500
200
400
0.1 to 25M
0.5, 1, 2, 5
100, 200
CHP1010
Notes
(1)
Shall be read in conjunction with other tables
(2)
Model CHP0805 being same size than case 0705 with same performances, only codification of CHP0805 remains
(3)
With special assembly care
Revision: 24-Jan-18
Document Number: 52023
1
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
Vishay Sfernice
DIMENSIONS
in millimeters
(F) and (W)
(B), (G), and (N)
D
C
D
C
B
B
E
A
E
A
CASE
SIZE
0502
0505
0603
0805
1005
1010
1020
1206
1505
2010
2208
2512
A
± 0.152
1.22
1.22
1.60
1.85
2.49
2.49
2.49
3.00
3.70
5.03
5.53
6.30
B
± 0.127
0.70
1.25
0.90
1.25
1.25
2.64
5.18
1.73
1.25
2.64
2.05
3.30
C
± 0.127
0.38
0.38
0.38
0.38
0.38
0.38
0.50
0.38
0.50
0.50
0.50
0.50
D
± 0.127
0.20
0.20
0.31
0.31
0.31
0.31
0.31
0.40
0.50
0.50
0.50
0.50
E
± 0.127
0.31
0.31
0.40
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
SUGGESTED LAND PATTERN
(to IPC-7351A) in millimeters
G
min.
X
max.
Z
max.
CASE SIZE
0502
0505
0603
0805
1005
1010
1020
1206
1505
2010
2208
2512
Z
max.
1.77
1.77
2.15
2.70
3.34
3.34
3.34
3.85
4.55
5.88
6.38
7.15
G
min.
0.19
0.19
0.39
0.44
1.08
1.08
1.08
1.59
2.29
3.62
4.12
4.89
X
max.
0.83
1.38
1.03
1.38
1.38
2.77
5.31
1.85
1.38
2.77
2.18
3.43
Revision: 24-Jan-18
Document Number: 52023
2
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
POWER DERATING CURVE
Rated Power (%)
100
80
60
40
20
0
Vishay Sfernice
MECHANICAL SPECIFICATIONS
Substrate
Technology
Protection
Alumina
Thick film (ruthenium oxide)
0.5
<
R
< 100 M: epoxy coating
R
0.5
:
overglaze protection
(no epoxy coating)
B (W/A):
SnPb over nickel barrier
for solder reflow
N (W/A):
SnAg over nickel barrier
for solder reflow
F (Flip Chip):
SnAg over nickel barrier
for solder reflow
W (one face) and G (W/A) type:
gold over nickel barrier
for other applications
Terminations
0
20
40
60 70 80
100
120
140 155
Ambient Temperature in °C
PACKAGING
ESD packaging available: Waffle pack and plastic tape and
reel (low conductivity). Paper tapes available on request
(ESD only).
NUMBER OF PIECES PER
WAFFLE
TAPE AND
PACK
MIN. MAX.
400
4000
100
221
140
60
100
60
60
50
5000
8 mm
4000
100
2000
2500
4000
1000
2000
8 mm
8 mm
8 mm
8 mm
8 mm
Note
• Refer to Application Note “Guidelines for Vishay
Sfernice
Resistive
and
Inductive
Components”
(www.vishay.com/doc?52029) for recommended reflow profile.
Profile #3 applies
SIZE
MOQ
TAPE
WIDTH
CLIMATIC SPECIFICATIONS
Operating temperature
range
-55 °C; +155 °C
0502
0505
0603
0805
1005
1206
1505
2010
1010
2208
1020
2512
Note
• For temperature up to 215 °C please consult Vishay Sfernice
BEST TOL. AND TCR VS. OHMIC VALUE
OHMIC VALUE
RANGE in
10
<
R
< 5M
5
<
R
< 10M
1
<
R
<
R
max.
0.1
<
R
<
R
max.
TIGHTEST
TOLERANCE
(%)
0.5 % (D)
1 % (F)
2 % (G)
5 % (J)
(1)
100
BEST
TCR
(ppm/°C)
100 (K)
100 (K)
200 (L)
200 (L)
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the
top of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay Sfernice for specific ordering
code
Tape and Reel
See Part Numbering information to get the quantity desired
by tape.
Note
(1)
Improved performance on request
CHIPS FOR HIGH FREQUENCY APPLICATIONS
The HF performance of flip chip and W/A types can be
improved on request.
Please ask for HCHP
Revision: 24-Jan-18
Document Number: 52023
3
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
TYPICAL HF PERFORMANCE OF HCHP
2.0
1.8
1.6
1.4
1.2
2.0
1
Ω
10
Ω
1.8
1.6
1.4
1.2
1
Ω
10
Ω
Vishay Sfernice
|Z|/R
|Z|/R
1.0
0.8
0.6
0.4
0.2
0
1
10
100
1000
1 MΩ
100 kΩ
10 kΩ
100
Ω
200
Ω
1.0
0.8
0.6
100
Ω
1 kΩ
200
Ω
1 kΩ
0.4
0.2
0
10 000
1
10
100
1000
1 MΩ
100 kΩ
10 kΩ
10 000
Size 0603 (W/A)
f (MHz)
Size 0603 (Flip chip)
f (MHz)
POPULAR OPTIONS
For any option it is recommended to consult Vishay Sfernice for availability first.
Option: Enlarged terminations:
0063
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat
sinks (see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film,
PRA Arrays, CHP Thick Film)
www.vishay.com/doc?53048.
Option to order: 0063 (applies to size 1206 / 1505 / 1020 / 2010 / 2512).
DIMENSIONS
(Option 0063) in millimeters
Bottom view for mounting
Uncoated
ceramic
Enlarged
termination
C
E
B
D
A
CASE
SIZE
1206
1505
2010
1020
2208
2512
A
± 0.152
3.00
3.70
5.03
2.49
5.53
6.30
B
± 0.127
1.73
1.25
2.64
5.18
2.05
3.30
C
± 0.127
0.38
0.50
0.50
0.50
0.50
0.50
D
± 0.127
0.40
0.50
0.50
0.31
0.50
0.50
E
± 0.127
1.19
1.54
2.20
0.93
2.45
2.84
Revision: 24-Jan-18
Document Number: 52023
4
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
Vishay Sfernice
SUGGESTED LAND PATTERN
(Option 0063)
G
min.
X
max.
Z
max.
CASE SIZE
1206
1505
2010
1020
2208
2512
DIMENSIONS (IN MILLIMETERS)
Z
max.
3.85
4.55
5.88
3.34
6.38
7.15
G
min.
0.50
0.50
0.50
0.50
0.50
0.50
X
max.
1.86
1.38
2.77
5.31
2.18
3.43
OPTION: MARKING
Option to order 0013:
Marking of ohmic value and tolerance:
Sizes: 0805 to 1005: 3 digits marking (according to EIA-96)
Sizes: 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)
Tolerance indicated by a color dot.
Option to order 0014:
Marking of ohmic value:
Sizes 0805 to 1005: 3 digits marking (according to EIA-96)
Sizes 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)
No standard marking available for smaller sizes.
A price adder will apply to the unit price of the parts for options 0013 and 0014.
PERFORMANCE
TESTS
Termination adhesion
Resistance to solder heat
CONDITIONS
5N for 10 s
Immersion 10 s
in Sn/Pb 60/40
at +260 °C
5 cycles
-55 °C
+155 °C
Phase A dry heat
Phase B damp heat
Phase C cold -55 °C
Phase D damp heat 5 cycles
56 days
AEC-Q200
85 °C / 85 % RH / Pn / 10
1000 h
6.25 Pr
for 2 s
1000 h at rated power
90’/30’ at +70 °C
REQUIREMENTS
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
TYPICAL VALUES
AND DRIFTS
< ± 0.1 %
< ± 0.1 %
Rapid temperature change
< ± 0.1 %
Climatic sequence
Humidity (steady state)
Moisture resistance
Short time overload
Load life
± (1 % + 0.05
)
± (1 % + 0.05
)
5 % + 0.05
± (0.25 % + 0.05
)
1000 h
± (1 % + 0.05
)
1000 h
< 0.25 %
< ± 0.2 %
< ± 0.2 %
Max. < 3 % + 0.05
< ± 0.1 %
2000 h
< 0.5 %
10 000 h
<1%
Revision: 24-Jan-18
Document Number: 52023
5
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

Recommended Resources

DDR memory power supply circuit

Attenuation-feedback tone control circuit

Incandescent lamp life extension switch circuit (5)

Low voltage linear regulator LR602

Password electronic lock circuit

100kHz crystal-unijunction transistor relaxation oscillator

Recommend CPLD+MCU development board. . .
[b][size=4]Lianhua Zhongke CPLD Development Board[/size][/b] [b][size=4]CA127[/size][/b] [img]http://www.lianhua-zhongke.com.cn/CA127-Brief.files/image001.jpg[/img] [b][size=2]Beijing Lianhua Zhongke ...
saleslhzk001 MCU
Ask the experts for analog electronics knowledge
The title and the question are in the attachment. Please give me some advice and break it down in detail. Thank you....
whwshiyuan1984 Analog electronics
Send a few infrared decoding programs
Send a few infrared decoding programs...
ljf0215 MCU
Cross-compilation question: On Windows PC, using ADS (ARM development environment), using gcc and armcc compilers
Development environment: On Windows PC, use ADS (ARM development environment), use gcc and armcc compilers; Check the makefile file in the compilation command, the useful one is "gcc ******" (the comp...
gf0608 ARM Technology
[TI recommended course] #Boost and buck-boost DCDC converters help wireless charging design#
//training.eeworld.com.cn/TI/show/course/5501...
well_kim TI Technology Forum
About learning ARM embedded
1. Prerequisites for learning embedded systems( 1 ) Language foundation: relatively familiar with C language development, such as the writing and management of header files, and experience in coordina...
piggyfeng ARM Technology
Shortcut:   E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components

  1. D55342E07B49E9RTF
  2. VI-24M-IW-F4
  3. ABL3001-890
  4. 611-303-22-15
  5. CA3106E18-10S-B-02
  6. VVC2-C1B-16M000
  7. FDZ25SPG1S-K1019
  8. 13522-2491-FTW
  9. SBL2040CT
  10. 1SMA4733
  11. D3961HA-14P-WH
  12. A2541HWV-2x39P-T

Popular Articles

  1. BYD hits pause on IPO failure of “first car chip stock”
  2. Daily maintenance of high voltage wireless nuclear phase instrument
  3. Design of Fully Automatic Washing Machine Based on 51 Single Chip Microcomputer
  4. BMW implements five major measures to establish a sustainable closed-loop material cycle for battery cells
  5. Is Intel sure to bet on smart cars?
  6. Gartner identifies four trends driving near-term AI innovation
  7. STM8S Self-study Notes-006 GPIO input: key input and key filtering
  8. Samsung Galaxy Z Fold3 5G removes restrictions, unlocking bootloader will not disable camera
  9. AVR MCU fuse configuration and related solutions
  10. iWave Systems Launches New V2X Connectivity Hub and Telematics Gateway

Technical ResourceMore

  1. High efficiency and low power consumption DC voltage converter chip design and implementation
  2. Characteristic Analysis of PWM Mode of Soft-Switching Three-Phase Inverter
  3. Design of VC++ Photo Browser
  4. Intelligent Assisted Driving ADAS Blue Book
  5. Research on designing Hall effect sensor systems for industrial measurement and nondestructive testing
  6. Weather Radar Principles Textbook
  7. Moving Target Position Estimation for IoT Target Applications Using GPU-Based Particle Filter
  8. MATLAB Case 2 BP Neural Network Nonlinear System Modeling-Nonlinear Function Fitting.rar
  9. Use STM32 secure boot and firmware update step by step
  10. Design of AGV 3D real-time simulation control system based on wireless network

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Index Files: 2361  421  1775  327  2278  48  9  36  7  46 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号