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Datasheet> All Categories > Buffer and line drives> SN74LVC2G07DCKRG4
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SN74LVC2G07DCKRG4

Description
Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin SC-70 T/R
CategoryBuffer and line drives   
File Size2MB，29 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
Stay tuned Parametric Compare

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SN74LVC2G07DCKRG4 Overview

Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin SC-70 T/R

SN74LVC2G07DCKRG4 Parametric

Parameter NameAttribute value
EU restricts the use of certain hazardous substancesCompliant
ECCN (US)EAR99
Part StatusActive
HTS8542.39.00.01
SVHCYes
Minimum Operating Temperature (°C)-40
Maximum Operating Temperature (°C)125
Standard Package NameSC
Pin Count6
Supplier PackageSC-70
MountingSurface Mount
Package Height1(Max)
Package Length2.15(Max)
Package Width1.4(Max)
PCB changed6
Lead ShapeGull-wing

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Description Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin SC-70 T/R Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin SOT-23 T/R Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin SOT-23 T/R Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin SC-70 T/R Dual Buffer/Driver with Open-Drain Output 6-SC70 -40 to 125 Dual Buffer/Driver with Open-Drain Output 6-SC70 -40 to 125 Dual Buffer/Driver with Open-Drain Output 6-SON -40 to 125 Dual Buffer/Driver with Open-Drain Output 6-SON -40 to 125 Buffers & Line Drivers Dual Buffer Driver Dual Buffer/Driver with Open-Drain Output 6-DSBGA -40 to 125
Brand Name - - - - Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? - - - - Lead free Lead free Lead free Lead free Contains lead Lead free
Is it Rohs certified? - - - - conform to conform to conform to conform to incompatible conform to
Parts packaging code - - - - SOIC SOIC SON SON BGA BGA
package instruction - - - - TSSOP, TSSOP6,.08 TSSOP, TSSOP6,.08 SON-6 VSON, SOLCC6,.04,14 VFBGA, BGA6,2X3,20 VFBGA, BGA6,2X3,20
Contacts - - - - 6 6 6 6 6 6
Reach Compliance Code - - - - compli compli compli compli _compli compli
series - - - - LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code - - - - R-PDSO-G6 R-PDSO-G6 R-PDSO-N6 S-PDSO-N6 R-XBGA-B6 R-XBGA-B6
length - - - - 2 mm 2 mm 1.45 mm 1 mm 1.4 mm 1.4 mm
Load capacitance (CL) - - - - 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type - - - - BUFFER BUFFER BUFFER BUFFER BUFFER BUFFER
MaximumI(ol) - - - - 0.032 A 0.032 A 0.032 A 0.032 A 0.024 A 0.032 A
Number of functions - - - - 2 2 2 2 2 2
Number of entries - - - - 1 1 1 1 1 1
Number of terminals - - - - 6 6 6 6 6 6
Maximum operating temperature - - - - 125 °C 125 °C 125 °C 125 °C 85 °C 125 °C
Minimum operating temperature - - - - -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics - - - - OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN
Package body material - - - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED
encapsulated code - - - - TSSOP TSSOP VSON VSON VFBGA VFBGA
Encapsulate equivalent code - - - - TSSOP6,.08 TSSOP6,.08 SOLCC6,.04,20 SOLCC6,.04,14 BGA6,2X3,20 BGA6,2X3,20
Package shape - - - - RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
Package form - - - - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing - - - - TR TR TR TR TAPE AND REEL TR
Peak Reflow Temperature (Celsius) - - - - 260 260 260 260 NOT SPECIFIED 260
power supply - - - - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Su - - - - 3.7 ns 3.7 ns 3.7 ns 3.7 ns 3.7 ns 3.7 ns
propagation delay (tpd) - - - - 8.6 ns 8.6 ns 8.6 ns 8.6 ns 8.6 ns 8.6 ns
Certification status - - - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger - - - - NO NO NO NO NO NO
Maximum seat height - - - - 1.1 mm 1.1 mm 0.6 mm 0.4 mm 0.5 mm 0.5 mm
Maximum supply voltage (Vsup) - - - - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) - - - - 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V
Nominal supply voltage (Vsup) - - - - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount - - - - YES YES YES YES YES YES
technology - - - - CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level - - - - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE INDUSTRIAL AUTOMOTIVE
Terminal form - - - - GULL WING GULL WING NO LEAD NO LEAD BALL BALL
Terminal pitch - - - - 0.65 mm 0.65 mm 0.5 mm 0.35 mm 0.5 mm 0.5 mm
Terminal location - - - - DUAL DUAL DUAL DUAL BOTTOM BOTTOM
Maximum time at peak reflow temperature - - - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - - - - 1.25 mm 1.25 mm 1 mm 1 mm 0.9 mm 0.9 mm

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