SN74LVC2G07YEPR datasheet, PDF

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SN74LVC2G07YEPR: DescriptionBuffers & Line Drivers Dual Buffer Driver; Categorylogic logic; File Size2MB，29 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SN74LVC2G07YEPR Overview

Buffers & Line Drivers Dual Buffer Driver

SN74LVC2G07YEPR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	VFBGA, BGA6,2X3,20
Contacts	6
Reach Compliance Code	_compli
Factory Lead Time	1 week
series	LVC/LCX/Z
JESD-30 code	R-XBGA-B6
length	1.4 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.024 A
Number of functions	2
Number of entries	1
Number of terminals	6
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	OPEN-DRAIN
Package body material	UNSPECIFIED
encapsulated code	VFBGA
Encapsulate equivalent code	BGA6,2X3,20
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Prop。Delay @ Nom-Su	3.7 ns
propagation delay (tpd)	8.6 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	0.9 mm

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Description	Buffers & Line Drivers Dual Buffer Driver	Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin SOT-23 T/R	Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin SOT-23 T/R	Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin SC-70 T/R	Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin SC-70 T/R	Dual Buffer/Driver with Open-Drain Output 6-SC70 -40 to 125	Dual Buffer/Driver with Open-Drain Output 6-SC70 -40 to 125	Dual Buffer/Driver with Open-Drain Output 6-SON -40 to 125	Dual Buffer/Driver with Open-Drain Output 6-SON -40 to 125	Dual Buffer/Driver with Open-Drain Output 6-DSBGA -40 to 125
Brand Name	Texas Instruments	-	-	-	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Contains lead	-	-	-	-	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	incompatible	-	-	-	-	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	-	-	-	-	SOIC	SOIC	SON	SON	BGA
package instruction	VFBGA, BGA6,2X3,20	-	-	-	-	TSSOP, TSSOP6,.08	TSSOP, TSSOP6,.08	SON-6	VSON, SOLCC6,.04,14	VFBGA, BGA6,2X3,20
Contacts	6	-	-	-	-	6	6	6	6	6
Reach Compliance Code	_compli	-	-	-	-	compli	compli	compli	compli	compli
series	LVC/LCX/Z	-	-	-	-	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-XBGA-B6	-	-	-	-	R-PDSO-G6	R-PDSO-G6	R-PDSO-N6	S-PDSO-N6	R-XBGA-B6
length	1.4 mm	-	-	-	-	2 mm	2 mm	1.45 mm	1 mm	1.4 mm
Load capacitance (CL)	50 pF	-	-	-	-	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUFFER	-	-	-	-	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER
MaximumI(ol)	0.024 A	-	-	-	-	0.032 A	0.032 A	0.032 A	0.032 A	0.032 A
Number of functions	2	-	-	-	-	2	2	2	2	2
Number of entries	1	-	-	-	-	1	1	1	1	1
Number of terminals	6	-	-	-	-	6	6	6	6	6
Maximum operating temperature	85 °C	-	-	-	-	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-	-	-	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	OPEN-DRAIN	-	-	-	-	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN
Package body material	UNSPECIFIED	-	-	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	VFBGA	-	-	-	-	TSSOP	TSSOP	VSON	VSON	VFBGA
Encapsulate equivalent code	BGA6,2X3,20	-	-	-	-	TSSOP6,.08	TSSOP6,.08	SOLCC6,.04,20	SOLCC6,.04,14	BGA6,2X3,20
Package shape	RECTANGULAR	-	-	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	-	-	-	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TAPE AND REEL	-	-	-	-	TR	TR	TR	TR	TR
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	-	-	-	260	260	260	260	260
power supply	3.3 V	-	-	-	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Prop。Delay @ Nom-Su	3.7 ns	-	-	-	-	3.7 ns	3.7 ns	3.7 ns	3.7 ns	3.7 ns
propagation delay (tpd)	8.6 ns	-	-	-	-	8.6 ns	8.6 ns	8.6 ns	8.6 ns	8.6 ns
Certification status	Not Qualified	-	-	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	-	-	-	-	NO	NO	NO	NO	NO
Maximum seat height	0.5 mm	-	-	-	-	1.1 mm	1.1 mm	0.6 mm	0.4 mm	0.5 mm
Maximum supply voltage (Vsup)	5.5 V	-	-	-	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.65 V	-	-	-	-	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	3.3 V	-	-	-	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	-	-	-	-	YES	YES	YES	YES	YES
technology	CMOS	-	-	-	-	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	-	-	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal form	BALL	-	-	-	-	GULL WING	GULL WING	NO LEAD	NO LEAD	BALL
Terminal pitch	0.5 mm	-	-	-	-	0.65 mm	0.65 mm	0.5 mm	0.35 mm	0.5 mm
Terminal location	BOTTOM	-	-	-	-	DUAL	DUAL	DUAL	DUAL	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	-	-	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	0.9 mm	-	-	-	-	1.25 mm	1.25 mm	1 mm	1 mm	0.9 mm

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