|
SN74LVC2G07DSFR |
SN74LVC2G07DBVRE4 |
SN74LVC2G07DBVRG4 |
SN74LVC2G07DCKRE4 |
SN74LVC2G07DCKRG4 |
SN74LVC2G07DCKT |
SN74LVC2G07DCKTG4 |
SN74LVC2G07DRYR |
SN74LVC2G07YEPR |
SN74LVC2G07YZPR |
| Description |
Dual Buffer/Driver with Open-Drain Output 6-SON -40 to 125 |
Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin SOT-23 T/R |
Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin SOT-23 T/R |
Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin SC-70 T/R |
Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin SC-70 T/R |
Dual Buffer/Driver with Open-Drain Output 6-SC70 -40 to 125 |
Dual Buffer/Driver with Open-Drain Output 6-SC70 -40 to 125 |
Dual Buffer/Driver with Open-Drain Output 6-SON -40 to 125 |
Buffers & Line Drivers Dual Buffer Driver |
Dual Buffer/Driver with Open-Drain Output 6-DSBGA -40 to 125 |
| Brand Name |
Texas Instruments |
- |
- |
- |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
Lead free |
- |
- |
- |
- |
Lead free |
Lead free |
Lead free |
Contains lead |
Lead free |
| Is it Rohs certified? |
conform to |
- |
- |
- |
- |
conform to |
conform to |
conform to |
incompatible |
conform to |
| Parts packaging code |
SON |
- |
- |
- |
- |
SOIC |
SOIC |
SON |
BGA |
BGA |
| package instruction |
VSON, SOLCC6,.04,14 |
- |
- |
- |
- |
TSSOP, TSSOP6,.08 |
TSSOP, TSSOP6,.08 |
SON-6 |
VFBGA, BGA6,2X3,20 |
VFBGA, BGA6,2X3,20 |
| Contacts |
6 |
- |
- |
- |
- |
6 |
6 |
6 |
6 |
6 |
| Reach Compliance Code |
compli |
- |
- |
- |
- |
compli |
compli |
compli |
_compli |
compli |
| series |
LVC/LCX/Z |
- |
- |
- |
- |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
| JESD-30 code |
S-PDSO-N6 |
- |
- |
- |
- |
R-PDSO-G6 |
R-PDSO-G6 |
R-PDSO-N6 |
R-XBGA-B6 |
R-XBGA-B6 |
| length |
1 mm |
- |
- |
- |
- |
2 mm |
2 mm |
1.45 mm |
1.4 mm |
1.4 mm |
| Load capacitance (CL) |
50 pF |
- |
- |
- |
- |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
| Logic integrated circuit type |
BUFFER |
- |
- |
- |
- |
BUFFER |
BUFFER |
BUFFER |
BUFFER |
BUFFER |
| MaximumI(ol) |
0.032 A |
- |
- |
- |
- |
0.032 A |
0.032 A |
0.032 A |
0.024 A |
0.032 A |
| Number of functions |
2 |
- |
- |
- |
- |
2 |
2 |
2 |
2 |
2 |
| Number of entries |
1 |
- |
- |
- |
- |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
6 |
- |
- |
- |
- |
6 |
6 |
6 |
6 |
6 |
| Maximum operating temperature |
125 °C |
- |
- |
- |
- |
125 °C |
125 °C |
125 °C |
85 °C |
125 °C |
| Minimum operating temperature |
-40 °C |
- |
- |
- |
- |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Output characteristics |
OPEN-DRAIN |
- |
- |
- |
- |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
| Package body material |
PLASTIC/EPOXY |
- |
- |
- |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
UNSPECIFIED |
UNSPECIFIED |
| encapsulated code |
VSON |
- |
- |
- |
- |
TSSOP |
TSSOP |
VSON |
VFBGA |
VFBGA |
| Encapsulate equivalent code |
SOLCC6,.04,14 |
- |
- |
- |
- |
TSSOP6,.08 |
TSSOP6,.08 |
SOLCC6,.04,20 |
BGA6,2X3,20 |
BGA6,2X3,20 |
| Package shape |
SQUARE |
- |
- |
- |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE, VERY THIN PROFILE |
- |
- |
- |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, VERY THIN PROFILE |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| method of packing |
TR |
- |
- |
- |
- |
TR |
TR |
TR |
TAPE AND REEL |
TR |
| Peak Reflow Temperature (Celsius) |
260 |
- |
- |
- |
- |
260 |
260 |
260 |
NOT SPECIFIED |
260 |
| power supply |
3.3 V |
- |
- |
- |
- |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
| Prop。Delay @ Nom-Su |
3.7 ns |
- |
- |
- |
- |
3.7 ns |
3.7 ns |
3.7 ns |
3.7 ns |
3.7 ns |
| propagation delay (tpd) |
8.6 ns |
- |
- |
- |
- |
8.6 ns |
8.6 ns |
8.6 ns |
8.6 ns |
8.6 ns |
| Certification status |
Not Qualified |
- |
- |
- |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Schmitt trigger |
NO |
- |
- |
- |
- |
NO |
NO |
NO |
NO |
NO |
| Maximum seat height |
0.4 mm |
- |
- |
- |
- |
1.1 mm |
1.1 mm |
0.6 mm |
0.5 mm |
0.5 mm |
| Maximum supply voltage (Vsup) |
5.5 V |
- |
- |
- |
- |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
1.65 V |
- |
- |
- |
- |
1.65 V |
1.65 V |
1.65 V |
1.65 V |
1.65 V |
| Nominal supply voltage (Vsup) |
3.3 V |
- |
- |
- |
- |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
| surface mount |
YES |
- |
- |
- |
- |
YES |
YES |
YES |
YES |
YES |
| technology |
CMOS |
- |
- |
- |
- |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
AUTOMOTIVE |
- |
- |
- |
- |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
INDUSTRIAL |
AUTOMOTIVE |
| Terminal form |
NO LEAD |
- |
- |
- |
- |
GULL WING |
GULL WING |
NO LEAD |
BALL |
BALL |
| Terminal pitch |
0.35 mm |
- |
- |
- |
- |
0.65 mm |
0.65 mm |
0.5 mm |
0.5 mm |
0.5 mm |
| Terminal location |
DUAL |
- |
- |
- |
- |
DUAL |
DUAL |
DUAL |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
- |
- |
- |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
1 mm |
- |
- |
- |
- |
1.25 mm |
1.25 mm |
1 mm |
0.9 mm |
0.9 mm |