Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
*As
per JEDEC51 Standard (multilayer board).
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note 1:
LX_ has internal clamp diodes for PGND_ and PV_. Applications that forward bias these diodes should take care not to
exceed the IC’s package power-dissipation limits.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) ..........40NC/W
Junction-to-Case Thermal Resistance (B
JC
) .................6NC/W
TSSOP
Junction-to-Ambient Thermal Resistance (B
JA
) .......38.3NC/W
Junction-to-Case Thermal Resistance (B
JC
) .................3NC/W
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
PV
= V
PV1
= V
PV2
= 5V, V
EN_
= 5V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 3)
PARAMETER
Supply Voltage Range
Supply Current
Shutdown Supply Current
Undervoltage Lockout Threshold
Low
Undervoltage Lockout Threshold
High
Undervoltage Lockout Hysteresis
SYNCHRONOUS STEP-DOWN DC-DC CONVERTER 1
FB Regulation Voltage
Feedback Set-Point Accuracy
pMOS On-Resistance
nMOS On-Resistance
Maximum pMOS Current-Limit
Threshold
Maxim Integrated
SYMBOL
V
PV
I
PV
I
SHDN
V
UVLO_L
V
UVLO_H
CONDITIONS
Normal operation
No load, V
PWM
= 0V
V
EN1
= V
EN2
= 0V, T
A
= +25
°
C
MIN
2.7
16
TYP
36
1
MAX
5.5
60
5
UNITS
V
FA
FA
V
2.37
2.6
0.07
V
V
V
OUTS1
V
OUTS1
R
DSON_P1
I
LIMP1
I
LOAD
= 4% to 100%
I
LOAD
= 0%
V
PV1
= 5V, I
LX1
= 0.4A
1.95
-3
-0.5
800
0
+2
90
68
2.35
+3
+3
148
128
3.15
mV
%
%
mI
mI
A
2
R
DSON_N1
V
PV1
= 5V, I
LX1
= 0.8A
MAX16963
Dual 2.2MHz, Low-Voltage Step-Down
DC-DC Converter
ELECTRICAL CHARACTERISTICS (continued)
(V
PV
= V
PV1
= V
PV2
= 5V, V
EN_
= 5V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 3)
PARAMETER
Maximum Output Current
OUTS1 Bias Current
LX1 Leakage Current
Minimum On-Time
LX1 Discharge Resistance
Maximum Short-Circuit Current
SYNCHRONOUS STEP-DOWN DC-DC CONVERTER 2
FB Regulation Voltage
Feedback Set-Point Accuracy
pMOS On-Resistance
nMOS On-Resistance
Maximum pMOS Current-Limit
Threshold
Maximum Output Current
OUTS2 Bias Current
LX2 Leakage Current
Minimum On-Time
LX2 Discharge Resistance
Maximum Short-Circuit Current
OSCILLATOR
Oscillator Frequency
Spread Spectrum
SYNC Input Frequency Range
THERMAL OVERLOAD
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
POWER-GOOD OUTPUTS (PG1, PG2)
PG_ Overvoltage Threshold
PG_ Undervoltage Threshold
Active Timeout Period
PG
OVTH
PG
UVTH
Percentage of nominal output
Percentage of nominal output
106
89.5
110
92
16
114
94
%
%
ms
165
15
°C
°C
f
SW
Df/f
f
SYNC
Spread spectrum enabled
50% duty cycle (Note 5)
1.7
2.0
2.2
+6
2.4
2.4
MHz
%
MHz
V
OUTS2
V
OUTS2
R
DSON_P2
I
LIMP2
I
OUT2
I
B_OUTS2
I
LX2_LEAK
t
ON_MIN
R
LX2
V
EN2
= 0V, through the OUTS_ pin
15
(V
OUT2
+ 0.5V
P
V
IN2
P
5.5V) (Note 4)
Fixed output-voltage variants
Adjustable output variants
V
PV2
= 6V, LX2 =
PGND2 or PV2
T
A
= +25°C
T
A
= +125°C
-1
-5
60
24
55
3.9
I
LOAD
= 4% to 100%
I
LOAD
= 0%
V
PV2
= 5V, I
LX2
= 0.4A
1.95
1.5
1
2
5
1
+1
+5
-3
+1
800
0
+2
90
68
2.55
+3
+3
148
128
3.15
mV
%
mI
mI
A
A
FA
FA
ns
I
A
SYMBOL
I
OUT1
I
B_OUTS1
I
LX1_LEAK
t
ON_MIN
R
LX1
V
EN1
= 0V, through the OUTS_ pin
15
CONDITIONS
(V
OUT1
+ 0.5V
P
V
PV1
P
5.5V) (Note 4)
Fixed output-voltage variants
Adjustable output variants
V
PV1
= 6V, LX1 =
PGND1 or PV1
T
A
= +25°C
T
A
= +125°C
MIN
1.5
-1
-1
-1
-5
60
24
55
3.9
+1
+1
+1
+5
TYP
MAX
UNITS
A
FA
FA
ns
I
A
R
DSON_N2
V
PV2
= 5V, I
LX2
= 0.8A
Maxim Integrated
3
MAX16963
Dual 2.2MHz, Low-Voltage Step-Down
DC-DC Converter
ELECTRICAL CHARACTERISTICS (continued)
(V
PV
= V
PV1
= V
PV2
= 5V, V
EN_
= 5V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 3)
PARAMETER
Undervoltage/Overvoltage
Propagation Delay
Output High Leakage Current
PG1 Output Low Voltage
PG2 Output Low Voltage
ENABLE INPUTS (EN1, EN2)
Input Voltage High
Input Voltage Low
Input Hysteresis
Input Current
Pulldown Resistor
DIGITAL INPUTS (SYNC, PWM)
Input Voltage High
Input Voltage Low
Input Voltage Hysteresis
Pulldown Resistor
DIGITAL OUTPUT (SYNC)
SYNC Output Voltage Low
SYNC Output Voltage High
V
OL
V
OH
I
SINK
= 3mA
V
PV_
= 5V, I
SOURCE
= 3mA
4.2
0.4
V
V
50
V
INH
V
INL
50
100
200
1.8
0.4
V
V
mV
kI
V
EN_
= high
V
EN_
= low
0.1
50
V
INH
V
INL
Input rising
Input falling
2.4
0.5
1.7
0.85
0.85
1.0
100
2
200
2.4
0.5
V
V
V
FA
kI
T
A
= +25
°
C
2.6V ≤ V
PV1
≤ 5.5V, I
SINK
= 3mA
V
PV1
= 1.2V, I
SINK
= 100FA
2.6V ≤ V
PV2
≤ 5.5V, I
SINK
= 3mA
V
PV2
= 1.2V, I
SINK
= 100FA
SYMBOL
CONDITIONS
MIN
TYP
28
0.2
0.4
0.4
0.4
0.4
MAX
UNITS
Fs
FA
V
V
Note 3:
All limits are 100% production tested at +25°C. Limits over temperature are guaranteed by design.
Note 4:
Calculated value based on an assumed inductor ripple of 30%.
Note 5:
For SYNC frequency outside (1.7, 2.4)MHz, contact the factory.
[color=black][font=Verdana] In the production of [/font][font=Verdana] electronics, in order to reduce the volume and reduce the cost, the capacitor step-down method is often used to replace the bulky...
I want to make an automatic tracking smart car with black lead wires. Is it better to use a three-way infrared tube or a photoelectric sensor chip RPR220? I initially plan to use C51 to write it. Whic...
This is a triode circuit. When the LOCK signal is input, the relay is closed through this triode. This circuit has been used before, and another board was made. However, when the lock signal is input,...
Debugging STM32F723 Using the official program: stm32cube_fw_f7_v160\STM32Cube_FW_F7_V1.7.0\Projects\STM32F723E-Discovery\Examples\BSP The following problems occur: 1. Warning is prompted during burni...
568760310ST Sensors & Low Power Wireless Technology Forum
Traditional broadcasting systems generally need to be operated manually at a fixed time, and can only realize one-way broadcasting with few functions. Traditional bell ringing equipment has a singl...[Details]
1. Circuit composition
The whole circuit consists of two parts:
1. Power saving control circuit
As shown in the figure below. Including delay circuit and drive circuit.
(1) Delay ci...[Details]
Today, with the increasing integration of functions, mobile phones can also be used as portable media players (PMP), digital cameras, handheld computers (PDAs), and even global positioning systems ...[Details]
1. Introduction
With the growth of parking demand, the scale of parking lots is becoming larger and larger. A lot of research has been done on intelligent parking lots in China, but most of th...[Details]
introduction
Throughout the history of automotive lighting, power has always played an important role. Initially, cars only needed headlights to see the road in the dark. Later, other light so...[Details]
Converged processors meet scalability requirements
In current embedded system design, solutions based on MCU, DSP, FPGA and ASIC account for more than 90% of the market share. These solutions ...[Details]
Instrument stepper motor
The stepper motor is an open-loop control element that converts electrical pulse signals into angular displacement or linear displacement. In the case of non...[Details]
A standard cell
is an electrochemical
cell
used as a voltage reference standard in many electrical standards laboratories
. If properly maintained, standard cells are very stable. The ...[Details]
I've been studying dot matrix recently. It looks simple, but it takes a while to master it completely! The 8*8 dot matrix hardware circuit I'm making now is like this. The row is driven by 74HC138 + t...[Details]
1. Overview
At present, an information revolution is in the ascendant around the world, led by microelectronics, computers and communication technologies, and centered on information technolog...[Details]
1 Introduction
With the improvement of people's quality of life, lamps are no longer just basic indoor lighting tools, but also a kind of practical art for architectural decoration. When ther...[Details]
Overview
By transmitting ultrasonic energy into the human body and receiving and processing the returning reflected signals, phased array ultrasound systems can generate images of organs and s...[Details]
1 Introduction to LED
With the development of science and technology, people have higher and higher requirements on automobile light sources. LED (Light Emitting Diode) has gradually attracted...[Details]
Every time I go home and walk up the stairs, I am always scared. The corridor lights are often broken, and no one changes the bulbs, or they are not smart enough and need to be operated manually. E...[Details]
introduction
When it comes to the production of mobile phone lithium-ion batteries, the first thing that comes to mind is Japan's industrialized mechanical assembly line, NOKIO, MOTOLROLA's st...[Details]
Analogue and Mixed Signal
京公网安备 11010802033920号
EEWORLD
