Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
*As
per JEDEC51 Standard (multilayer board).
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note 1:
LX_ has internal clamp diodes for PGND_ and PV_. Applications that forward bias these diodes should take care not to
exceed the IC’s package power-dissipation limits.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) ..........40NC/W
Junction-to-Case Thermal Resistance (B
JC
) .................6NC/W
TSSOP
Junction-to-Ambient Thermal Resistance (B
JA
) .......38.3NC/W
Junction-to-Case Thermal Resistance (B
JC
) .................3NC/W
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
PV
= V
PV1
= V
PV2
= 5V, V
EN_
= 5V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 3)
PARAMETER
Supply Voltage Range
Supply Current
Shutdown Supply Current
Undervoltage Lockout Threshold
Low
Undervoltage Lockout Threshold
High
Undervoltage Lockout Hysteresis
SYNCHRONOUS STEP-DOWN DC-DC CONVERTER 1
FB Regulation Voltage
Feedback Set-Point Accuracy
pMOS On-Resistance
nMOS On-Resistance
Maximum pMOS Current-Limit
Threshold
Maxim Integrated
SYMBOL
V
PV
I
PV
I
SHDN
V
UVLO_L
V
UVLO_H
CONDITIONS
Normal operation
No load, V
PWM
= 0V
V
EN1
= V
EN2
= 0V, T
A
= +25
°
C
MIN
2.7
16
TYP
36
1
MAX
5.5
60
5
UNITS
V
FA
FA
V
2.37
2.6
0.07
V
V
V
OUTS1
V
OUTS1
R
DSON_P1
I
LIMP1
I
LOAD
= 4% to 100%
I
LOAD
= 0%
V
PV1
= 5V, I
LX1
= 0.4A
1.95
-3
-0.5
800
0
+2
90
68
2.35
+3
+3
148
128
3.15
mV
%
%
mI
mI
A
2
R
DSON_N1
V
PV1
= 5V, I
LX1
= 0.8A
MAX16963
Dual 2.2MHz, Low-Voltage Step-Down
DC-DC Converter
ELECTRICAL CHARACTERISTICS (continued)
(V
PV
= V
PV1
= V
PV2
= 5V, V
EN_
= 5V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 3)
PARAMETER
Maximum Output Current
OUTS1 Bias Current
LX1 Leakage Current
Minimum On-Time
LX1 Discharge Resistance
Maximum Short-Circuit Current
SYNCHRONOUS STEP-DOWN DC-DC CONVERTER 2
FB Regulation Voltage
Feedback Set-Point Accuracy
pMOS On-Resistance
nMOS On-Resistance
Maximum pMOS Current-Limit
Threshold
Maximum Output Current
OUTS2 Bias Current
LX2 Leakage Current
Minimum On-Time
LX2 Discharge Resistance
Maximum Short-Circuit Current
OSCILLATOR
Oscillator Frequency
Spread Spectrum
SYNC Input Frequency Range
THERMAL OVERLOAD
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
POWER-GOOD OUTPUTS (PG1, PG2)
PG_ Overvoltage Threshold
PG_ Undervoltage Threshold
Active Timeout Period
PG
OVTH
PG
UVTH
Percentage of nominal output
Percentage of nominal output
106
89.5
110
92
16
114
94
%
%
ms
165
15
°C
°C
f
SW
Df/f
f
SYNC
Spread spectrum enabled
50% duty cycle (Note 5)
1.7
2.0
2.2
+6
2.4
2.4
MHz
%
MHz
V
OUTS2
V
OUTS2
R
DSON_P2
I
LIMP2
I
OUT2
I
B_OUTS2
I
LX2_LEAK
t
ON_MIN
R
LX2
V
EN2
= 0V, through the OUTS_ pin
15
(V
OUT2
+ 0.5V
P
V
IN2
P
5.5V) (Note 4)
Fixed output-voltage variants
Adjustable output variants
V
PV2
= 6V, LX2 =
PGND2 or PV2
T
A
= +25°C
T
A
= +125°C
-1
-5
60
24
55
3.9
I
LOAD
= 4% to 100%
I
LOAD
= 0%
V
PV2
= 5V, I
LX2
= 0.4A
1.95
1.5
1
2
5
1
+1
+5
-3
+1
800
0
+2
90
68
2.55
+3
+3
148
128
3.15
mV
%
mI
mI
A
A
FA
FA
ns
I
A
SYMBOL
I
OUT1
I
B_OUTS1
I
LX1_LEAK
t
ON_MIN
R
LX1
V
EN1
= 0V, through the OUTS_ pin
15
CONDITIONS
(V
OUT1
+ 0.5V
P
V
PV1
P
5.5V) (Note 4)
Fixed output-voltage variants
Adjustable output variants
V
PV1
= 6V, LX1 =
PGND1 or PV1
T
A
= +25°C
T
A
= +125°C
MIN
1.5
-1
-1
-1
-5
60
24
55
3.9
+1
+1
+1
+5
TYP
MAX
UNITS
A
FA
FA
ns
I
A
R
DSON_N2
V
PV2
= 5V, I
LX2
= 0.8A
Maxim Integrated
3
MAX16963
Dual 2.2MHz, Low-Voltage Step-Down
DC-DC Converter
ELECTRICAL CHARACTERISTICS (continued)
(V
PV
= V
PV1
= V
PV2
= 5V, V
EN_
= 5V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 3)
PARAMETER
Undervoltage/Overvoltage
Propagation Delay
Output High Leakage Current
PG1 Output Low Voltage
PG2 Output Low Voltage
ENABLE INPUTS (EN1, EN2)
Input Voltage High
Input Voltage Low
Input Hysteresis
Input Current
Pulldown Resistor
DIGITAL INPUTS (SYNC, PWM)
Input Voltage High
Input Voltage Low
Input Voltage Hysteresis
Pulldown Resistor
DIGITAL OUTPUT (SYNC)
SYNC Output Voltage Low
SYNC Output Voltage High
V
OL
V
OH
I
SINK
= 3mA
V
PV_
= 5V, I
SOURCE
= 3mA
4.2
0.4
V
V
50
V
INH
V
INL
50
100
200
1.8
0.4
V
V
mV
kI
V
EN_
= high
V
EN_
= low
0.1
50
V
INH
V
INL
Input rising
Input falling
2.4
0.5
1.7
0.85
0.85
1.0
100
2
200
2.4
0.5
V
V
V
FA
kI
T
A
= +25
°
C
2.6V ≤ V
PV1
≤ 5.5V, I
SINK
= 3mA
V
PV1
= 1.2V, I
SINK
= 100FA
2.6V ≤ V
PV2
≤ 5.5V, I
SINK
= 3mA
V
PV2
= 1.2V, I
SINK
= 100FA
SYMBOL
CONDITIONS
MIN
TYP
28
0.2
0.4
0.4
0.4
0.4
MAX
UNITS
Fs
FA
V
V
Note 3:
All limits are 100% production tested at +25°C. Limits over temperature are guaranteed by design.
Note 4:
Calculated value based on an assumed inductor ripple of 30%.
Note 5:
For SYNC frequency outside (1.7, 2.4)MHz, contact the factory.
[i=s]This post was last edited by chenzhouyu on 2020-11-21 15:07[/i]Hello everyone!
I have a question. I used TPS61040 to make a boost circuit to power an LCD.
LVDS_AVDD is designed to output 12.4V, a...
[i=s]This post was last edited by fxyc87 on 2022-1-21 16:47[/i]My related historical posts:
[National Technology N32G457 Review] 1. Data Preparation
[National Technology N32G457 Review] 2. Unboxing + ...
Some time ago, I saw Samsung's 4510. Finally, I got to know something about ARM... I feel that it is impossible to learn such pure technical things in a short time. So, I only seek to know half of it....
这个是错误提示root@t-VirtualBox:~/libnfc-1.7.0# nfc-listdebuglibnfc.generallog_level is set to 3
debuglibnfc.generalallow_autoscan is set to true
debuglibnfc.generalallow_intrusive_scan is set to false
debug...
From: https://www.cnx-software.com/2021/11/28/toit-open-source-language-claims-to-be-30x-faster-than-micropython-on-esp32/Toit is a complete IoT platform developed by a team of former Google employees...
introduction
With the continuous optimization of surface mount technology (SMT) and the rapid development of chip component manufacturing technology, the application of chip mounters in the el...[Details]
1. Introduction
Automobile pollution is one of the most important issues that people are most concerned about and need to solve urgently. As an important method for detecting automobile exhau...[Details]
0 Introduction
With the development of my country's economy, the number of motor vehicles continues to increase. The growth of existing roads and other hardware facilities can no longer meet t...[Details]
At present, the traffic congestion in cities is quite serious. According to relevant news reports: In China, the traffic congestion has expanded from megacities such as Beijing, Shanghai, and Guang...[Details]
System design is a complex process. It is not enough to just use ICs. There are many details to consider. This article uses a high-fidelity music playback system as an example to introduce how to s...[Details]
We know that microcontroller development tools generally include real-time online emulators and programmers. Among them, online emulators are very good tools, but they are also more expensive...[Details]
1. System Structure
This system is a simulation system of indoor air-conditioning temperature/humidity control system. The data acquisition and control center collects temperature/humidity...[Details]
1 Introduction
PROFIBUS is an international, open, and manufacturer-independent fieldbus standard. It is widely used in manufacturing automation, process industry automation, and automatio...[Details]
With the rapid development of intelligent control technology, computers and information technology, the trend of information appliances IA (Information Application), computers and communications integ...[Details]
Experimental tasks
A DS18B20 is used to form a temperature measurement system. The temperature measurement accuracy reaches 0.1 degrees. The temperature range is between -20 degrees and +50 de...[Details]
12v Lead Acid batteries used in trucks, cars, RVs and uninterruptible power supplies are usually rated at 12V. This circuit monitors the battery, the charge and discharge curves, gives the cu...[Details]
Problems such as the depletion of natural resources, air pollution, traffic congestion, and rising fossil fuel prices have forced societies and individuals to seek alternative means of transportati...[Details]
Motors, especially those with brushes, generate a lot of noise. This noise must be dealt with if the appliance is to meet the requirements of EMC standards. The means to solve EMC are nothing more ...[Details]
In 2012, more than half of the cars in the European, Japanese and American car markets will be equipped with color displays, navigation systems, satellite communications and other in-vehicle infota...[Details]
Power technology
京公网安备 11010802033920号
EEWORLD
