EEWORLDEEWORLDEEWORLD

Part Number

Search

MPR24000E1320HRP00

Description
RESISTOR, THIN FILM, 0.125 W, 0.02 %, 25 ppm, 132 ohm, THROUGH HOLE MOUNT, AXIAL LEADED, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size121KB,7 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance  
Download Datasheet Parametric View All

MPR24000E1320HRP00 Overview

RESISTOR, THIN FILM, 0.125 W, 0.02 %, 25 ppm, 132 ohm, THROUGH HOLE MOUNT, AXIAL LEADED, ROHS COMPLIANT

MPR24000E1320HRP00 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1214497974
package instructionAxial,
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresHIGH PRECISION, RATED AC VOLTAGE: 250V
structureTubular
JESD-609 codee3
Lead diameter0.6 mm
Lead length28 mm
Installation featuresTHROUGH HOLE MOUNT
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package diameter2.5 mm
Package length6.3 mm
Package shapeTUBULAR PACKAGE
Package formAxial
method of packingTR, 12.4 INCH
Rated power dissipation(P)0.125 W
Rated temperature70 °C
resistance132 Ω
Resistor typeFIXED RESISTOR
surface mountNO
technologyTHIN FILM
Temperature Coefficient25 ppm/°C
Terminal surfaceMatte Tin (Sn)
Terminal shapeWIRE
Tolerance0.02%
Operating Voltage250 V
MPR24
Vishay BCcomponents
High Precision Thin Film Leaded Resistors
FEATURES
High precision resistors
(TCR up to ± 5 ppm/K, 0.01 % tol.)
High stability (0.05 %)
Low temperature coefficient (up to ± 5 ppm/K)
Lead (Pb)-free solder contacts
Pure tin plating provides compatibility with lead (Pb)-free
and lead containing soldering processes
Compliant to RoHS directive 2002/95/EC
DESCRIPTION
A homogenous film of metal alloy is deposited on a high
grade ceramic body. After a helical groove has been cut in
the resistive layer, tinned connecting wires of electrolytic
copper are welded to the end-caps. The resistors are coated
with lacquer which provides electrical, mechanical, and
climatic protection.
APPLICATIONS
Test and measurement
Telecom
TECHNICAL SPECIFICATIONS
DESCRIPTION
CECC Size, DIN Size
Resistance Range
Resistance Tolerance
Temperature Coefficient
Climatic Category (LCT/UCT/Days)
Rated Dissipation,
P
70
Operating Voltage,
U
max.
AC/DC
Film Temperature
Max. Resistance Change for Resistance Range,
ΔR
max., After:
Load (1000 h,
P
70
)
Long Term Damp Heat Test (56 Days)
Soldering (10 s, 260 °C)
Permissible Voltage Against Ambient :
1 Minute;
U
ins
Continuous
Failure Rate
500 V
75 V
0.1 x 10
- 9
/h
± (0.05 %
R
+ 0.01
Ω)
± (0.05 %
R
+ 0.01
Ω)
± (0.01 %
R
+ 0.01
Ω)
125
°C
± 0.05 %; ± 0.02 %; ± 0.01 %
MPR24
B, 0207
10
Ω
to 1 MΩ
± 0.5 %; ± 0.25 %; ± 0.1 %
± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K; ± 05 ppm/K
55/125/56
0.125 W
250 V
155
°C
55/155/56
0.25 W
www.vishay.com
80
For technical questions, contact:
filmresistors.leaded@vishay.com
Document Number: 28727
Revision: 06-Oct-09
[Ask] Has anyone ported the Bluetooth protocol stack to uCOS?
The situation is this: I am still a student, a rookie, and I want to learn embedded knowledge by making some small things.I want to port the Bluetooth protocol stack to uCOS and connect a Bluetooth mo...
lwb01 Real-time operating system RTOS
Situational Assessment of Automotive Bus Protocols
This article compares the characteristics of several existing mainstream automotive bus systems in detail. These comparisons will help define the next generation of high-security, high-fault-tolerance...
frozenviolet Automotive Electronics
Germany has the strictest enforcement of REACH and violators face huge fines or even imprisonment
Germany has the strictest REACH enforcement, and violations face huge fines or even imprisonment. The basic principle required by the EU REACH regulations - "no data, no market" is enough to stimulate...
keiyi Embedded System
Using Verilog_HDL language to realize the conversion of parallel-to-serial and serial-to-parallel interfaces
[i=s]This post was last edited by paulhyde on 2014-9-15 03:22[/i] Use Verilog_HDL language to implement parallel-to-serial and serial-to-parallel interface conversion....
fpga126 Electronics Design Contest
Novice Question
A novice is asking for help... How can I flash Lexin's ESP-12F to use it with Arduino?...
wz_fly Microchip MCU
Ask: Problems with creating device file contacts in Linux device driver
The open function code in the driver is as follows: static int wdt_open(struct inode *inode, struct file *file) { struct wdt_dev *dev; dev = container_of(inode->i_cdev, struct wdt_dev, cdev); file->pr...
xyw6813927 Linux and Android

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2798  1560  371  2204  2703  57  32  8  45  55 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号