BOARD-TO-BOARD/WIRE-TO-BOARD
CONNECTORS
1.25mm Wire-To-Board System
DESCRIPTION
FCI’s 1.25mm pitch wire-to-board connector
series is designed for a wide variety of
applications in Industrial, Automotive and
Consumer.
The range consists of terminals, crimp housings
and PCB headers in straight and right angle,
surface mount and through mount
configurations. It is a single row design,
available with from 2 to 15 circuits. A crimping
application tool is also available for wire
harness assembly.
Unlike many other products for the same
applications, FCI’s 1.25mm wire-to-board range
conforms to the EU Industry Safety Standard,
PCB header material meets halogen free
requirements and the products can be operated
in the temperature range from -40℃ to +105℃.
FEATURES & BENEFITS
Operating temperature: -40°C to +105°C
Plating options：gold flash or tin
Circuits: #2~#15 positions available, extension up to 20 positions
Current rating: 1 Amp
Polarized Mating Geometry: crimping housing is polarized to
prevent mis-mating with PCB header
Friction lock: crimping housing is equipped with friction locks to
secure retention force with PCB header
PCB header material (resin) meets halogen free requirement
Housing meets EU Industry Safety Standard
RoHS compliance and UL approved
Tape and reel packaging befits pick and place of SMT production
process.
TARGET MARKETS & APPLICATIONS
www.fciconnect.com
1.25mm Wire-To-Board System
TECHNICAL INFORMATION
MATERIALS
Contact: copper alloy
Plating: matt tin or gold flash over nickel
Housing: Thermoplastic or Thermoplastic
high temperature, UL94V-0
Metal hold down: copper alloy
Plating: matt tin
ENVIRONMENTAL
Resistance to Reflow Soldering Heat:
• Pre-heat: 150°C to 180°C, 60 - 90 seconds
• Heat: 230°C minimum, 40 seconds minimum
• Peak temperature: 260°C maximum, 10seconds maximum
Resistance to Hand Soldering Heat:
• Soldering iron: 350±10°C
• Duration: 3 - 4 seconds minimum
Thermal shock (temperature cycling): conforms to EIA-364-32A
Humidity (temperature cycling): conforms to EIA-361-31A
Temperature life (heat aging):
conforms to EIA-361-17A, 105°C for 96 hours
Salt spray: conforms to EIA-364-26B
Solderability: solderable area to have minimum 95% solder
coverage
ELECTRICAL PERFORMANCE
Contact Resistance: 20mΩ (maximum)
Insulation Resistance: 100MΩ (minimum)
Voltage Rating: 125 Volts AC,DC
Current Rating: 1 Amp (0.8 A --32 AWG)
Dielectric Withstand Voltage: 500 VAC/minute
APPROVALS AND CERTIFICATIONS
RoHS conforms to EU Directive 2002/95/EC
UL approval
Housing connector conforms to IEC 60695-2 Industry Safety
Standard (Glow Wire test)
MECHANICAL PERFORMANCES
Mating & un-mating force: conforms to EIA-364-13
Contact retention force: 0.5Kgf (minimum)
Hold down/Housing retention force: 1.0Kgf (minimum)
Wire retention force: 0.5Kgf (minimum)
Terminal/ Housing retention force: 0.5Kgf (minimum)
Vibration: 1µs (maximum), EIA-364-28 Condition I
Shock: 1µs (maximum), EIA-364-27A
Durability: 30 cycles
PACKAGING
PCB Header: tape and reel
Crimping Housing: bag
Terminal: reel
SPECIFICATIONS
Product Spec.: GS-12-675
Packaging Spec.: GS-14-1592; GS-14-1593
PART NUMBERS
101148XX-X X X XX LF
28 = SMT vertical header
29 = Through hole vertical header
30 = SMT right angle header
31 = Through hole right angle header
1 = LCP
Lead Free
Total number of positions (2 to 15)
Packing
1 = tape and reel
Resin Material
Plating
0 = tin
1= gold flash
101148XX-X 0 X XX LF
26 = housing
101148XX-00X
27 = Terminal
Resin Material
0 = PA66
Lead Free
Total number of
positions (2 to 15)
Packing
0 = Bulk
Plating
1 = Matt Tin
2 = Gold Flash
www.fciconnect.com/electronics
For more information, please contact: elxcommunications@fci.com
ELXWTBSY0711EA4
Printed on recyclable paper
Embedded System
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