BXC80646G1820/SR1CN datasheet, PDF

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> BXC80646G1820/SR1CN

BXC80646G1820/SR1CN: DescriptionMicroprocessor; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，120 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

Download Datasheet Parametric View All

BXC80646G1820/SR1CN Overview

Microprocessor

BXC80646G1820/SR1CN Parametric

Parameter Name	Attribute value
package instruction	,
Reach Compliance Code	compli
Base Number Matches	1

Preview

Download Datasheet

View All

Desktop 4th Generation Intel

Core

™

Processor Family, Desktop Intel

Pentium

Processor Family, and

Desktop Intel

Celeron

Processor

Family

Datasheet – Volume 1 of 2

December 2013

Order No.: 328897-004

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND

CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED

WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A

PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death.

SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND

ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL

CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF

PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL

OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or

characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no

responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without

notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published

specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling

1-800-548-4725, or go to:

http://www.intel.com/design/literature.htm

Any software source code reprinted in this document is furnished for informational purposes only and may only be used or copied and no license,

express or implied, by estoppel or otherwise, to any of the reprinted source code is granted by this document.

Any software source code reprinted in this document is furnished under a software license and may only be used or copied in accordance with the

terms of that license.

This document contains information on products in the design phase of development.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different

processor families: Go to:

http://www.intel.com/products/processor_number

Code Names are only for use by Intel to identify products, platforms, programs, services, etc. ("products") in development by Intel that have not been

made commercially available to the public, i.e., announced, launched or shipped. They are never to be used as "commercial" names for products. Also,

they are not intended to function as trademarks.

Intel

Hyper-Threading Technology (Intel

HT Technology) is available on select Intel

Core

™

processors. It requires an Intel

HT Technology enabled

system. Consult your PC manufacturer. Performance will vary depending on the specific hardware and software used. Not available on Intel

Core

™

i5-750. For more information including details on which processors support Intel

HT Technology, visit

http://www.intel.com/info/hyperthreading.

Intel

64 architecture requires a system with a 64-bit enabled processor, chipset, BIOS and software. Performance will vary depending on the specific

hardware and software you use. Consult your PC manufacturer for more information. For more information, visit

http://www.intel.com/

content/www/us/en/architecture-and-technology/microarchitecture/intel-64-architecture-general.html.

No computer system can provide absolute security under all conditions. Intel

Trusted Execution Technology (Intel

TXT) requires a computer with

Intel

Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible measured

launched environment (MLE). Intel TXT also requires the system to contain a TPM v1.s. For more information, visit

http://www.intel.com/technology/

security.

Intel

Virtualization Technology (Intel

VT) requires a computer system with an enabled Intel

processor, BIOS, and virtual machine monitor (VMM).

Functionality, performance or other benefits will vary depending on hardware and software configurations. Software applications may not be

compatible with all operating systems. Consult your PC manufacturer. For more information, visit

http://www.intel.com/go/virtualization.

Requires a system with Intel

Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select

Intel

processors. Consult your PC manufacturer. Performance varies depending on hardware, software, and system configuration. For more

information, visit

http://www.intel.com/go/turbo.

Requires activation and a system with a corporate network connection, an Intel

AMT-enabled chipset, network hardware and software. For notebooks,

Intel AMT may be unavailable or limited over a host OS-based VPN, when connecting wirelessly, on battery power, sleeping, hibernating or powered

off. Results dependent upon hardware, setup and configuration.

Intel, Intel Core, Celeron, Pentium and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries.

*Other names and brands may be claimed as the property of others.

Desktop 4th Generation Intel

Core

™

Processor Family, Desktop Intel

Pentium

Processor Family, and Desktop Intel

Celeron

Processor Family

Datasheet – Volume 1 of 2

December 2013

Order No.: 328897-004

Contents—Processor

Contents

Revision History..................................................................................................................9

1.0 Introduction................................................................................................................10

1.1

1.2

1.3

1.4

1.5

1.6

1.7

Supported Technologies.........................................................................................11

Interfaces............................................................................................................ 12

Power Management Support...................................................................................12

Thermal Management Support................................................................................13

Package Support...................................................................................................13

Terminology.........................................................................................................13

Related Documents............................................................................................... 16

2.0 Interfaces................................................................................................................... 18

2.1 System Memory Interface...................................................................................... 18

2.1.1 System Memory Technology Supported.......................................................19

2.1.2 System Memory Timing Support................................................................. 20

2.1.3 System Memory Organization Modes........................................................... 21

2.2 PCI Express* Interface.......................................................................................... 23

2.2.1 PCI Express* Support................................................................................ 23

2.2.2 PCI Express* Architecture.......................................................................... 24

2.2.3 PCI Express* Configuration Mechanism........................................................ 24

2.3 Direct Media Interface (DMI).................................................................................. 26

2.4 Processor Graphics................................................................................................28

2.5 Processor Graphics Controller (GT)..........................................................................28

2.5.1 3D and Video Engines for Graphics Processing.............................................. 29

2.5.2 Multi Graphics Controllers Multi-Monitor Support........................................... 31

2.6 Digital Display Interface (DDI)................................................................................31

2.7 Intel

Flexible Display Interface (Intel

FDI)............................................................ 37

2.8 Platform Environmental Control Interface (PECI)....................................................... 37

2.8.1 PECI Bus Architecture................................................................................37

3.0 Technologies............................................................................................................... 39

3.1 Intel

Virtualization Technology (Intel

VT)............................................................. 39

3.2 Intel

Trusted Execution Technology (Intel

TXT)..................................................... 43

3.3 Intel

Hyper-Threading Technology (Intel

HT Technology)....................................... 44

3.4 Intel

Turbo Boost Technology 2.0..........................................................................45

3.5 Intel

Advanced Vector Extensions 2.0 (Intel

AVX2)................................................45

3.6 Intel

Advanced Encryption Standard New Instructions (Intel

AES-NI).......................46

3.7 Intel

Transactional Synchronization Extensions - New Instructions (Intel

TSX-NI)..... 46

3.8 Intel

64 Architecture x2APIC................................................................................ 47

3.9 Power Aware Interrupt Routing (PAIR).................................................................... 48

3.10 Execute Disable Bit..............................................................................................48

3.11 Supervisor Mode Execution Protection (SMEP)........................................................48

4.0 Power Management.................................................................................................... 49

4.1 Advanced Configuration and Power Interface (ACPI) States Supported......................... 50

4.2 Processor Core Power Management......................................................................... 51

4.2.1 Enhanced Intel

SpeedStep

Technology Key Features..................................51

4.2.2 Low-Power Idle States............................................................................... 52

Desktop 4th Generation Intel

Core

™

Processor Family, Desktop Intel

Pentium

Processor Family, and Desktop Intel

Celeron

Processor Family

December 2013

Datasheet – Volume 1 of 2

Order No.: 328897-004

Processor—Contents

4.3

4.4

4.5

4.6

4.2.3 Requesting Low-Power Idle States...............................................................53

4.2.4 Core C-State Rules....................................................................................54

4.2.5 Package C-States......................................................................................55

4.2.6 Package C-States and Display Resolutions.................................................... 59

Integrated Memory Controller (IMC) Power Management............................................60

4.3.1 Disabling Unused System Memory Outputs................................................... 60

4.3.2 DRAM Power Management and Initialization..................................................61

4.3.3 DRAM Running Average Power Limitation (RAPL) .........................................63

4.3.4 DDR Electrical Power Gating (EPG).............................................................. 63

PCI Express* Power Management............................................................................63

Direct Media Interface (DMI) Power Management...................................................... 63

Graphics Power Management..................................................................................64

4.6.1 Intel

Rapid Memory Power Management (Intel

RMPM)................................64

4.6.2 Graphics Render C-State............................................................................64

4.6.3 Intel

Graphics Dynamic Frequency............................................................ 64

5.0 Thermal Management................................................................................................. 65

5.1 Desktop Processor Thermal Profiles......................................................................... 66

5.1.1 Processor (PCG 2013D) Thermal Profile........................................................67

5.1.2 Processor (PCG 2013C) Thermal Profile........................................................68

5.1.3 Processor (PCG 2013B) Thermal Profile........................................................ 69

5.1.4 Processor (PCG 2013A) Thermal Profile........................................................ 70

5.2 Thermal Metrology................................................................................................ 71

5.3 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 1.1.............................. 71

5.4 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0.............................. 73

5.5 Processor Temperature..........................................................................................74

5.6 Adaptive Thermal Monitor...................................................................................... 75

5.7 THERMTRIP# Signal.............................................................................................. 78

5.8 Digital Thermal Sensor.......................................................................................... 78

5.8.1 Digital Thermal Sensor Accuracy (Taccuracy)................................................79

5.9 Intel

Turbo Boost Technology Thermal Considerations..............................................79

5.9.1 Intel

Turbo Boost Technology Power Control and Reporting.......................... 79

5.9.2 Package Power Control.............................................................................. 80

5.9.3 Turbo Time Parameter............................................................................... 81

6.0 Signal Description....................................................................................................... 82

6.1 System Memory Interface Signals........................................................................... 82

6.2 Memory Reference and Compensation Signals.......................................................... 84

6.3 Reset and Miscellaneous Signals............................................................................. 85

6.4 PCI Express*-Based Interface Signals......................................................................86

6.5 Display Interface Signals....................................................................................... 86

6.6 Direct Media Interface (DMI).................................................................................. 86

6.7 Phase Locked Loop (PLL) Signals.............................................................................87

6.8 Testability Signals.................................................................................................87

6.9 Error and Thermal Protection Signals....................................................................... 88

6.10 Power Sequencing Signals.................................................................................... 88

6.11 Processor Power Signals.......................................................................................89

6.12 Sense Signals..................................................................................................... 89

6.13 Ground and Non-Critical to Function (NCTF) Signals.................................................89

6.14 Processor Internal Pull-Up / Pull-Down Terminations................................................ 89

Desktop 4th Generation Intel

Core

™

Processor Family, Desktop Intel

Pentium

Processor Family, and Desktop Intel

Celeron

Processor Family

Datasheet – Volume 1 of 2

December 2013

Order No.: 328897-004

Contents—Processor

7.0 Electrical Specifications.............................................................................................. 90

7.1

7.2

7.3

7.4

7.5

7.6

7.7

7.8

Integrated Voltage Regulator..................................................................................90

Power and Ground Lands ...................................................................................... 90

Voltage Identification (VID).............................................................................. 90

Reserved or Unused Signals................................................................................... 95

Signal Groups.......................................................................................................95

Test Access Port (TAP) Connection.......................................................................... 97

DC Specifications................................................................................................. 97

Voltage and Current Specifications.......................................................................... 98

7.8.1 Platform Environment Control Interface (PECI) DC Characteristics................. 103

7.8.2 Input Device Hysteresis........................................................................... 104

Processor Component Keep-Out Zone.................................................................... 105

Package Loading Specifications............................................................................. 105

Package Handling Guidelines................................................................................ 106

Package Insertion Specifications............................................................................106

Processor Mass Specification.................................................................................106

Processor Materials............................................................................................. 106

Processor Markings............................................................................................. 107

Processor Land Coordinates.................................................................................. 107

Processor Storage Specifications........................................................................... 108

8.0 Package Mechanical Specifications........................................................................... 105

8.1

8.2

8.3

8.4

8.5

8.6

8.7

8.8

8.9

9.0 Processor Ball and Signal Information...................................................................... 110

Desktop 4th Generation Intel

Core

™

Processor Family, Desktop Intel

Pentium

Processor Family, and Desktop Intel

Celeron

Processor Family

December 2013

Datasheet – Volume 1 of 2

Order No.: 328897-004

Recommended Resources

Low supply voltage diode temperature measurement circuit

Multifunctional conductivity tester circuit

Circuit to prevent bird pecks on low voltage relay contacts

Amplifier timer.gif

90W audio power amplifier with safety protection.gif

CH208 color channel indication circuit

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components