refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*This package is inherently Pb−Free.
Preferred
devices are recommended choices for future use
and best overall value.
1
May, 2006 − Rev. 3
Publication Order Number:
80SQ045N/D
80SQ045N
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead
(See Note 2 − Mounting Data)
Thermal Resistance, Junction−to−Ambient (See Note 2 − Mounting Data)
Symbol
R
qJL
R
qJA
0.9 in x 0.9 in
Copper Pad Size
13
50
6.75 in x 6.75 in
Copper Pad Size
12
40
Unit
°C/W
ELECTRICAL CHARACTERISTICS
(T
L
= 25°C unless otherwise noted)
Characteristic
Maximum Instantaneous Forward Voltage (Note 1)
(i
F
= 8.0 A, T
L
= 25°C)
Maximum Instantaneous Reverse Current @ Rated dc Voltage (Note 1)
T
L
= 25°C
T
L
= 100°C
1. Pulse Test: Pulse Width = 300
ms,
Duty Cycle = 2.0%.
Symbol
v
F
0.55
i
R
1.0
50
mA
Max
Unit
V
30
I
F
, INSTANTANEOUS FORWARD
CURRENT (AMPS)
10
I
F
, INSTANTANEOUS FORWARD
CURRENT (AMPS)
30
10
100°C
1
125°C
75°C
MBR845
1
100°C
125°C
25°C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
V
F
, INSTANTANEOUS VOLTAGE (VOLTS)
0.8
75°C
0.1
25°C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
V
F
, INSTANTANEOUS VOLTAGE (VOLTS)
0.8
0.1
Figure 1. Typical Forward Voltage
I
R
, INSTANTANEOUS REVERSE CURRENT (AMPS)
Figure 2. Maximum Forward Voltage
1E−01
125°C
100°C
75°C
10,000
C, CAPACITANCE (pF)
1E−02
1E−03
f = 1 MHz
T
J
= 25°C
1000
1E−04
25°C
1E−05
1E−06
100
0
5
10 15 20
25 30 35 40
V
R
, REVERSE VOLTAGE (VOLTS)
45
50
0.1
1
10
V
R
, REVERSE VOLTAGE (VOLTS)
100
Figure 3. Typical Reverse Current
Figure 4. Typical Capacitance
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2
80SQ045N
75
70
COPPER AREA (sq in)
65
60
55
50
See Note 2
45
40
35
30
0
2
4
6
8
10
R
qJA
(°C/W)
I
F
, AVERAGE FORWARD
CURRENT (AMPS)
9
8
dc
7
6
5
4
3
2
1
0
0
20
40
60
80
100
120
140
T
L
, LEAD TEMPERATURE (°C)
SQUARE
WAVE
R
qJL
= 12°C/W
Figure 5. R
qJA
versus Copper Area
Figure 6. Current Derating − Lead
4.5
NOTE 2 — MOUNTING DATA
4
P
FO
, AVERAGE POWER
DISSIPATION (WATTS)
3.5
3
2.5
2
1.5
1
0.5
0
0
2
4
6
8
10
I
O
, AVERAGE FORWARD CURRENT (AMPS)
dc
SQUARE
WAVE
T
J
= 125°C
Mounting Method
P.C. Board with 6.75 sq. in.
copper surface.
Figure 7. Forward Power Dissipation
r(t), NORMALIZED EFFECTIVE TRANSIENT
THERMAL RESISTANCE
1
D = 0.5
0.2
0.1
0.1
0.05
0.01
P
(pk)
Copper Area = 0.271 sq. in.
R
qJA
= 61.8
°C/W
t
2
DUTY CYCLE, D = t
1
/t
2
10
100
1000
t
1
0.01
SINGLE PULSE
0.0001
0.001
0.01
0.001
0.1
t, TIME (sec)
Figure 8. Thermal Response, Junction−to−Ambient
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3
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
1.0
L = 3/8,
Board Ground Plane
80SQ045N
PACKAGE DIMENSIONS
AXIAL LEAD
CASE 267−05
ISSUE G
K
D
1
A
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
D
K
INCHES
MIN
MAX
0.287
0.374
0.189
0.209
0.047
0.051
1.000
−−−
MILLIMETERS
MIN
MAX
7.30
9.50
4.80
5.30
1.20
1.30
25.40
−−−
B
K
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
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