5962-9167703MXX datasheet, PDF

5962-9167703MXX: DescriptionFIFO, 8KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, THIN, CERAMIC, DIP-28; Categorystorage storage; File Size415KB，13 Pages; ManufacturerIDT (Integrated Device Technology)

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5962-9167703MXX Overview

FIFO, 8KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, THIN, CERAMIC, DIP-28

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	compliant
ECCN code	EAR99
Is Samacsys	N
Maximum access time	30 ns
Other features	RETRANSMIT
period time	40 ns
JESD-30 code	R-GDIP-T28
length	37.1475 mm
memory density	73728 bit
memory width	9
Number of functions	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX9
Exportable	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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