HY5116100BR-70 datasheet, PDF - EEWORLD Datasheet

HY5116100BR-70: DescriptionFast Page DRAM, 16MX1, 70ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, REVERSE, TSOP2-26/24; Categorystorage storage; File Size217KB，8 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY5116100BR-70 Overview

Fast Page DRAM, 16MX1, 70ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, REVERSE, TSOP2-26/24

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SK Hynix
Parts packaging code	TSOP2
package instruction	TSOP2-R, TSOP24/26,.36
Contacts	26
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	70 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	SEPARATE
JESD-30 code	R-PDSO-G24
JESD-609 code	e0
length	17.14 mm
memory density	16777216 bit
Memory IC Type	FAST PAGE DRAM
memory width	1
Number of functions	1
Number of ports	1
Number of terminals	24
word count	16777216 words
character code	16000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX1
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2-R
Encapsulate equivalent code	TSOP24/26,.36
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
refresh cycle	4096
reverse pinout	YES
Maximum seat height	1.2 mm
self refresh	NO
Maximum standby current	0.001 A
Maximum slew rate	0.08 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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