The UT54ACS374 and the UT54ACTS374 are non-inverting
octal D type flip-flops with three-state outputs designed for driv-
ing highly capacitive or relatively low-impedance loads. The
device is suitable for buffer registers, I/O ports, and bidirectional
bus drivers.
The eight flip-flops are edge triggered D-type flip-flops. On the
positive transition of the clock the Q outputs will follow the data
(D) inputs.
An output-control input (OC) places the eight outputs in either
a normal logic state (high or low logic level) or a high-impedance
state. The high-impedance third state and increased drive pro-
vide the capability to drive the bus line in a bus-organized system
without the need for interface or pull-up components.
The output control OC does not affect the internal operations of
the flip-flops. Old data can be retained or new data can be en-
tered while the outputs are off.
The devices are characterized over full military temperature
range of -55°C to +125°C.
FUNCTION TABLE
INPUTS
OC
L
L
L
H
CLK
↑
↑
L
X
nD
H
L
X
X
OUTPUT
nQ
H
L
nQ
0
Z
Note:
1. Logic symbol in accordance with ANSI/IEEE Std 91-1984 and IEC
Publication 617-12.
OC
1Q
1D
2D
2Q
3Q
3D
4D
4Q
V
SS
20-Pin DIP
Top View
OC
1Q
1D
2D
2Q
3Q
3D
4D
4Q
V
SS
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
DD
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
20-Lead Flatpack
Top View
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
DD
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
LOGIC SYMBOL
OC
CLK
(1)
(11)
EN
C1
1D (3)
(4)
2D
3D (7)
(8)
4D
5D (13)
6D (14)
7D (17)
8D (18)
1D
(2)
1Q
(5)
2Q
(6) 3Q
(9)
(12)
(15)
(16)
(19)
4Q
5Q
6Q
7Q
8Q
1
LOGIC DIAGRAM
8D
(18)
7D
(17)
6D
(14)
5D
(13)
4D
(8)
3D
(7)
2D
(4)
1D
(3)
CLK OC
(11) (1)
DC
Q
D C
Q
DC
Q
D C
Q
D C
Q
D C
Q
D C
Q
D C
Q
(19)
8Q
7Q
(16)
(15)
6Q
(12)
5Q
4Q
(9)
3Q
(6)
2Q
(5)
(2)
1Q
2
OPERATIONAL ENVIRONMENT
1
PARAMETER
Total Dose
SEU Threshold
2
SEL Threshold
Neutron Fluence
LIMIT
1.0E6
80
120
1.0E14
UNITS
rads(Si)
MeV-cm
2
/mg
MeV-cm
2
/mg
n/cm
2
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
DD
V
I/O
T
STG
T
J
T
LS
Θ
JC
I
I
P
D
PARAMETER
Supply voltage
Voltage any pin
Storage Temperature range
Maximum junction temperature
Lead temperature (soldering 5 seconds)
Thermal resistance junction to case
DC input current
Maximum power dissipation
LIMIT
-0.3 to 7.0
-.3 to V
DD
+.3
-65 to +150
+175
+300
20
±10
1
UNITS
V
V
°C
°C
°C
°C/W
mA
W
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at
these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
V
DD
V
IN
T
C
PARAMETER
Supply voltage
Input voltage any pin
Temperature range
LIMIT
4.5 to 5.5
0 to V
DD
-55 to + 125
UNITS
V
V
×C
3
DC ELECTRICAL CHARACTERISTICS
7
(V
DD
= 5.0V
±
10%; V
SS
= 0V
6
, -55°C < T
C
< +125°C); Unless otherwise noted, Tc is per the temperature range ordered.
SYMBOL
V
IL
PARAMETER
Low-level input voltage
1
ACTS
ACS
High-level input voltage
1
ACTS
ACS
Input leakage current
ACTS/ACS
Low-level output voltage
3
ACTS
ACS
High-level output voltage
3
ACTS
ACS
Three-state output leakage current
Short-circuit output current
2 ,4
ACTS/ACS
Output current
10
(Sink)
I
OH
Output current
10
(Source)
P
total
I
DDQ
ΔI
DDQ
Power dissipation
2, 8, 9
Quiescent Supply Current
Quiescent Supply Current Delta
ACTS
V
IN
= V
DD
or V
SS
I
OL
= 8.0mA
I
OL
= 100μA
I
OH
= -8.0mA
I
OH
= -100μA
V
O
= V
DD
and V
SS
V
O
= V
DD
and V
SS
V
IN
= V
DD
or V
SS
V
OL
= 0.4V
V
IN
= V
DD
or V
SS
V
OH
= V
DD
- 0.4V
C
L
= 50pF
V
DD
= 5.5V
For input under test
V
IN
= V
DD
- 2.1V
For all other inputs
V
IN
= V
DD
or V
SS
V
DD
= 5.5V
C
IN
C
OUT
Input capacitance
5
Output capacitance
5
ƒ
= 1MHz @ 0V
ƒ
= 1MHz @ 0V
15
15
pF
pF
1.9
10
1.6
mW/
MHz
μA
mA
-8
mA
.7V
DD
V
DD
- 0.25
-20
20
.5V
DD
.7V
DD
-1
1
CONDITION
MIN
MAX
0.8
.3V
DD
UNIT
V
V
IH
V
I
IN
V
OL
μA
0.40
0.25
V
V
OH
V
μA
I
OZ
I
OS
I
OL
-200
8
200
mA
mA
4
Notes:
1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: V
IH
= V
IH
(min) + 20%, - 0%; V
IL
= V
IL
(max) + 0%, -
50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are
guaranteed to V
IH
(min) and V
IL
(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density
≤
5.0E5 amps/cm
2
, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765
pF/MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and V
SS
at
frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All specifications valid for radiation dose
≤
1E6 rads(Si).
8. Power does not include power contribution of any TTL output sink current.
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
Use AT+CMGS to send PDU information, feedback +CMS ERROR: 518 CSCA CSMS CMGF are all set, and the feedback is the expected result. The local SCA and CSMS are 0,1,1,1. I can use CMGL, CMGR, CMGD to lis...
[size=2][color=dimgray] The "Top-E Cup" National Embedded System C Language Programming Competition lasted for more than three months. After thousands of embedded system C language programming masters...
Robert Kollman, TI senior applications manager and senior member of the Technology Council, tells you how
Efficiently driveLED offline lighting.While it may be years before a viable screw-in LED repla...
I want to use qt4+stlib1.4 to run qt program on BoChuang's pxa270-s, but after cross-compiled tslib was transplanted to the development board, the touch screen still has a large deviation after calibr...
I just learned msp430 recently. I want the c program of msp430 about nRF24L01Demo. I would be very grateful. Msp430 data about nRF24L01Demo is also OK. Thank you all masters! !...
I saw a circuit diagram on the Internet and I share it with you. The circuit of the intelligent humidity measuring instrument composed of HM1500/1520 humidity sensor and single chip is shown in the fi...
From being a global leader to losing the market, Korean battery manufacturers have always wanted to regain the lost market and dignity, but facing Chinese battery manufacturers represented by CAT...[Details]
PV DC fuses are safety devices used to protect PV panels, inverters, and DC loads. To ensure their safety and reliability, they must be UL248 certified.
Before applying for UL248 certifi...[Details]
Tesla and BYD, vying for dominance in the global electric vehicle market, are reportedly considering adopting Samsung's AMOLED (active-matrix organic light-emitting diode) technology for their next...[Details]
The problem of dynamic sealing of equipment always exists with the operation of the equipment. Today, we have specially sorted out the various commonly used sealing forms, usage scope and character...[Details]
introduction
With the development of digital and network technologies, broadcasting technology has become increasingly diversified, with the most significant trend being the transition from an...[Details]
Electric vehicles are currently gaining momentum, but this is just a facade. Fuel-powered vehicles remain unchallenged. While electric vehicles boast unique advantages in environmental emissions an...[Details]
In recent years, with the application of the IEC61850 standard and the development and deployment of optoelectronic transformers, the concept of digital substations has been put into practical use ...[Details]
Today's security industry has entered the era of massive networking. Many enterprises, especially financial institutions, have established multi-level video surveillance networking platforms. Lever...[Details]
The structure of an LCD TV primarily consists of the LCD display module, power module, driver module (primarily including the main driver board and tuner board), and keypad module. LCD display modu...[Details]
Logic analyzers are widely used tools in digital design verification and debugging. They can verify the proper functioning of digital circuits and help users identify and troubleshoot faults. They ...[Details]
With the rapid advancement of automation technology, collaboration between robots is no longer just science fiction. Imagine dozens of machines moving goods in a warehouse without interfering with ...[Details]
On August 22, the National Energy Administration released the latest data, showing that by the end of July 2025, China's total number of electric vehicle charging infrastructure will reach 16.696 m...[Details]
The automotive industry in 2025 is undergoing a thorough intelligent reshuffle.
Geely wants to make changes in the field of AI cockpits: in the future, there will be no traditional smart...[Details]
introduction
Sonar imaging is of great significance in marine resource development and defense. Its long range, intuitive display of the observed area, and target identification make it widely...[Details]
Smartphones have become essential digital devices, and the growing number of smartphone-centric applications is enriching people's lives. As users, they desire a better app experience and a wider r...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
