MAX442_C_ _..................................................... 0°C to +70°C
MAX442_E_ _ .................................................. -40°C to +85°C
MAX442_MJA .............................................. -550°C to +125°C
Storage Temperature Range............................ -55°C to +160°C
Maximum Chip Temperature...........................................+150°C
Lead Temperature (soldering, 10 sec) ...........................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
DD
= +4.5V to +18V, T
A
= T
MIN
to T
MAX
, unless otherwise specified.)
PARAMETER
Logic 1 Input Voltage
Logic 0 Input Voltage
Input Current
Output High Voltage
Output Low Voltage
SYMBOL
V
IH
V
IL
I
IN
V
OH
V
OL
V
IN
= 0V to 18V
No load
No load
V
IN
= 0.8V for
inverting stages,
V
IN
= 2.4V for
noninverting
V
DD
= 18V, stages
I
LOAD
=
V
IN
= 2.4V for
10mA
inverting stages,
V
IN
= 0.8V for
noninverting
stages
V
DD
= 18V
V
IN
= +3V for both
inputs
V
IN
= 0V for both
inputs
T
A
= +25NC
T
A
= T
MIN
to T
MAX
T
A
= +25NC
T
A
= T
MIN
to T
MAX
T
A
= +25NC
T
A
= T
MIN
to T
MAX
T
A
= +25NC
T
A
= T
MIN
to T
MAX
T
A
= +25NC
T
A
= T
MIN
to T
MAX
T
A
= +25NC
T
A
= T
MIN
to T
MAX
T
A
= +25NC
T
A
= T
MIN
to
T
MAX
T
A
= +25NC
T
A
= T
MIN
to
T
MAX
4
-1
V
DD
-
25
25
10
CONDITIONS
MIN
2.4
0.8
1
TYP
MAX
UNITS
V
V
µA
mV
mV
5
12
ω
Output Resistance
R
OUT
4
10
5
1.5
1.8
2.5
0.2
0.3
20
25
20
25
10
15
25
30
12
A
4.5
8.0
0.4
0.6
30
40
30
40
30
40
50
60
ns
ns
ns
ns
mA
Peak Output Current
I
PK
Power-Supply Current
I
SUPP
Rise Time (Note 1)
Fall Time (Note 1)
t
R
t
F
t
D1
Delay Time (Note 1)
t
D2
Note 1:
Switching times guaranteed by design, not tested. See Figure 1 for timing measurement circuit.
2
Maxim Integrated
MAX4426/MAX4427/MAX4428
Dual High-Speed 1.5A MOSFET Drivers
Typical Operating Characteristics
MAX4426 RISE AND FALL TIME
vs. SUPPLY VOLTAGE
MAX4426/27/28t oc01
MAX4426 DELAY TIME
vs. SUPPLY VOLTAGE
MAX4426/27/28 toc02
MAX4426 RISE AND FALL TIME
vs. TEMPERATURE
C
L
= 1000pF
V
DD
= +18V
30
TIME (ns)
t
R
, t
F
20
MAX4426/27/28 toc03
70
60
50
TIME (ns)
40
30
20
10
0
5
10
15
t
F
t
R
C
L
= 1000pF
T
A
= +25°C
70
60
50
TIME (ns)
40
30
20
10
0
t
D2
t
D1
C
L
= 1000pF
T
A
= +25°C
40
10
0
20
5
10
15
20
-50
-25
0
25
50
75
100
125
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
MAX4426 DELAY TIME
vs. TEMPERATURE
MAX4426/27/28 toc04
MAX4426 SUPPLY CURRENT
vs. CAPACITIVE LOAD
MAX4426/27/28 toc05
MAX4426 RISE AND FALL TIME
vs. CAPACITIVE LOAD
T
A
= +25°C
V
DD
= +18V
MAX4426/27/28 toc06
35
30
25
TIME (ns)
20
15
10
5
0
-50
-25
0
25
50
75
100
t
D1
C
L
= 1000pF
V
DD
= +18V
t
D2
80
70
SUPPLY CURRENT (mA)
60
50
40
30
20
10
0
200kHz
T
A
= +25°C
V
DD
= +16V
400kHz
1k
100
TIME (ns)
t
R
, t
F
10
20kHz
0
10
100
1000
10,000
10
100
1000
10,000
CAPACITIVE LOAD (pF)
CAPACITIVE LOAD (pF)
125
TEMPERATURE (°C)
MAX4426 SUPPLY CURRENT
vs. FREQUENCY
MAX4426/27/28 toc07
MAX4426 OUTPUT HIGH VOLTAGE
vs. SOURCE CURRENT
MAX4426/27/28 toc08
MAX4426 OUTPUT LOW VOLTAGE
vs. SOURCE CURRENT
T
A
= +25°C
OUPUT VOLTAGE (V)
V
DD
= +8V
MAX4426/27/28 toc09
30
T
A
= +25°C
C
L
= 1000pF
SUPPLY CURRENT (mA)
20
0.6
T
A
= +25°C
V
DD
= +8V
0.6
V
DD
= +18V
(V
DD
- V
OUT
) (V)
V
DD
= +13V
0.3
V
DD
= +13V
0.3
10
V
DD
= +10V
V
DD
= +5V
V
DD
= +18V
V
DD
= +18V
0
1
10
100
1000
FERQUENCY (kHz)
0
0
10 20 30 40 50 60 70 80 90 100
SOURCE CURRENT (mA)
0
0
10 20 30 40 50 60 70 80 90 100
SOURCE CURRENT (mA)
Maxim Integrated
3
MAX4426/MAX4427/MAX4428
Dual High-Speed 1.5A MOSFET Drivers
Applications Information
The MAX4426/MAX4427/MAX4428 have easy-to-drive
inputs. However, these inputs must never be allowed to
stay between V
IH
and V
IL
for more than 50ns. Unused
inputs should always be connected to ground to mini-
mize supply current. Drivers can be paralleled on the
MAX4426 or MAX4427 by tying both Inputs together and
both outputs together.
Supply bypassing and grounding are extremely impor-
tant with the MAX4426/MAX4427/MAX4428, as the peak
supply current can be as high as 3A, which is twice the
peak output current. Ground drops are a form of nega-
tive feedback with inverters, and hence will degrade the
delay and transition time of the MAX4426/MAX4428.
Suggested bypass capacitors are a 4.7µF (low ESR)
capacitor in parallel with a 0.1µF ceramic capaci-
tor, mounted as close as possible to the MAX4426/
MAX4427/MAX4428. Use a ground plane if possible or
separate ground returns for inputs and outputs. Output
voltage ringing can be minimized with a 5Ω to 20Ω resis-
tor in series with the output, but this will degrade output
transition time. Ringing may be undesirable due to the
large current that flows through capacitive loads when
the voltage across these loads transitions quickly.
Operation at the upper end of the supply voltage range
(> 15V) requires that a capacitance of at least 50pF be
present at the outputs. This prevents the supply voltage
provided to the die (which can be different from that
seen at the supply pin) from exceeding the 20V absolute
maximum rating, due to overshoot. Since at least 50pF
of gate capacitance is present in all higher power FETs,
this requirement is easily met.
The MAX4426/MAX4427/MAX4428 power dissipation
consists of input inverter losses, crowbar current through
the output devices, and output current (either capacitive
or resistive). The sum of these must be kept below the
maximum power dissipation limit.
The DC input inverter supply current is 0.2mA when both
inputs are low and 2mA when both inputs are high. The
crowbar current through an output device making a tran-
sition is approximately 100mA for a few nanoseconds.
This is a small portion of the total supply current, except
for high switching frequencies or a small load capaci-
tance (100pF).
The MAX4426/MAX4427/MAX4428 power dissipation
when driving a ground-referenced resistive load is:
P = (D) (r
ON(MAX)
) (I
LOAD
2
)
where D is the percentage of time the MAX4426/
MAX4427/MAX4428 output pulls high, r
ON(MAX)
is the MAX4426/MAX4427/MAX4428 maximum on
resistance, and I
LOAD
is the MAX4426/MAX4427/
MAX4428 load current.
For capacitive loads. the power dissipation is:
P = (C
LOAD
) (V
DD
2
) (FREQ)
where C
LOAD
is the capacitive load. V
DD
is the MAX4426/
MAX4427/MAX4428 supply voltage, and FREQ is the
toggle frequency.
Power Dissipation
4
Maxim Integrated
MAX4426/MAX4427/MAX4428
Dual High-Speed 1.5A MOSFET Drivers
V
DD
= +18V
4.7µF
MAX4428
INPUT
OUTPUT
1000pF
INPUT
OUTPUT
1000pF
0.1µF
Ordering Information (continued)
PART
MAX4427CPA
MAX4427CSA
MAX4427C/D
MAX4427EPA
MAX4427ESA
MAX4427EJA
MAX4427MJA
MAX4428CPA
MAX4428CSA
INPUT
90%
TEMP RANGE
0NC to +70NC
0NC to +70NC
0NC to +70NC
-40NC to +85NC
-40NC to +85NC
-40NC to +85NC
-55NC to +125NC
0NC to +70NC
0NC to +70NC
0NC to +70NC
-40NC to +85NC
-40NC to +85NC
-40NC to +85NC
-55NC to +125NC
PIN-PACKAGE
8 Plastic DIP
8 SO
Dice*
8 Plastic DIP
8 SO
8 CERDIP
8 CERDIP**
8 Plastic DIP
8 SO
Dice*
8 Plastic DIP
8 SO
8 CERDIP
8 CERDIP**
INPUT RISE
AND FALL +5V
TIMES = 5ns
+0.4V
+18V
INVERTING
OUTPUT
0V
+18V
NONINVERTING
OUTPUT
0V
10%
t
D1
90%
MAX4428C/D
MAX4428EPA
MAX4428ESA
MAX4428EJA
90%
t
D2
MAX4428MJA
10%
t
F
t
D1
90%
10%
t
R
90%
10%
t
R
t
D2
10%
t
F
*Dice
are tested at T
A
= +25°C.
**Contact
factory for availability and processing to MIL-STD-883.
According to the Australian Broadcasting Corporation (ABC), researchers pointed out that in the next few years, cars will be able to detect damaged parts and estimate how long the car's life will last...
As the title says, seeing the various always in the Verilog code,At first glance, it seems to be synchronous timing logic related to the clock, but later I found that there is a lot of asynchronous lo...
I recently made an AD sampling board to replace the previous PLC AD module (the module was too expensive). I used a 12-bit AD, but the measured value was 16-bit. I guess the value was processed. There...
[i=s]This post was last edited by gmchen on 2017-6-4 16:19[/i] I have recently repaired two motors. One is for an electronic clock and the other is for a computer fan. The electronic clock at home oft...
I have burned the eboot to the development board and am ready to port the kernel image. In PB4.2, I clicked on the target->configure remote connection, in the services tab, selected ethernet under bot...
Emergency hand-held lamps powered by 6V maintenance-free batteries are widely used in rural areas. The charger used is a transformer step-down and single diode half-wave rectifier, and the charging...[Details]
Traditional broadcasting systems generally need to be operated manually at a fixed time, and can only realize one-way broadcasting with few functions. Traditional bell ringing equipment has a singl...[Details]
A single-chip microcomputer is also called a single-chip microcontroller. It is not a chip that completes a certain logical function, but a computer system integrated into one chip. In general, a c...[Details]
1. Introduction
RFID (radio frequency identification) is a non-contact automatic identification technology that emerged in the 1990s. It uses the characteristics of radio frequency signal prop...[Details]
1. Circuit composition
The whole circuit consists of two parts:
1. Power saving control circuit
As shown in the figure below. Including delay circuit and drive circuit.
(1) Delay ci...[Details]
This article discusses how to wake up a touch-sensitive device such as a tablet without touching the device, using basic gesture recognition and novel proximity sensors. The article discusses the p...[Details]
1. Introduction
With the growth of parking demand, the scale of parking lots is becoming larger and larger. A lot of research has been done on intelligent parking lots in China, but most of th...[Details]
Converged processors meet scalability requirements
In current embedded system design, solutions based on MCU, DSP, FPGA and ASIC account for more than 90% of the market share. These solutions ...[Details]
In recent years, the market for mobile/portable devices such as smartphones and laptops has continued to grow rapidly. While these products continue to integrate more new features to enhance the ...[Details]
System design is a complex process. It is not enough to just use ICs. There are many details to consider. This article uses a high-fidelity music playback system as an example to introduce how to s...[Details]
1. Introduction
Light control circuit plays a vital role in urban street lamps or corridor lighting. With light control circuit, the lights can be automatically turned on and off according to ...[Details]
When choosing a laptop battery, you should consider several factors, such as power, appearance, and quality.
Regarding power, we often see that a manufacturer uses values such as the number ...[Details]
Electronic systems are located at different points on the automotive power bus and therefore often need to operate under very stringent power requirements. These include load dump, cold crank, very lo...[Details]
Power management solutions for today's portable application processors are becoming increasingly integrated. Total power consumption, standby and sleep current consumption affect battery size, bill...[Details]
1. Introduction to CIF Board
Fieldbus integration based on PC system
Whether it is a master or a slave, fieldbus has won unanimous praise in the field of PC-based automation. For more...[Details]
Automotive Electronics
京公网安备 11010802033920号
EEWORLD
