60 V/0.7 Ohm,
General Purpose, 1 Form A,
Solid State Relay
Technical Data
HSSR-8060
Features
• Compact Solid-State
Bidirectional Switch
• Normally-Off Single-Pole
Relay Function (1 Form A)
• 60 V Output Withstand
Voltage in Both Polarities at
25
°
C
• 0.75/1.5 Amp Current
Ratings (See Schematic for
Connections A & B)
• Low Input Current; CMOS
Compatibility
• Very Low On-resistance:
0.4
Ω
Typical at 25
°
C
• ac/dc Signal and Power
Switching
• Input-to-Output Momentary
Withstand Insulation
Voltage: 2500 Vac, 1 Minute
• 16-kV ESD Immunity: MIL-
STD-883, Method 3015
• IEEE Surge Withstand
Capability (IEEE STD
472-1974)
• CSA Approved
• UL 508 Approved
• Telecommunication
Switching Equipment
• Reed Relay Replacement
• 28 Vdc, 24 Vac, 48 Vdc Load
Driver
• Industrial Relay Coil Driver
Description
The HSSR-8060 consists of a
high-voltage circuit, optically
coupled with a light emitting
diode (LED). This device is a
solid-state replacement for single-
pole, normally-open (1 Form A)
electromechanical relays used for
general purpose switching of
signals and low-power loads. The
relay turns on (contact closes)
with a minimum input current, I
F
,
of 5 mA through the input LED.
The relay turns off (contact
opens) with an input voltage, V
F
,
of 0.8 V or less. The detector
contains a high speed photosensi-
tive FET driver circuit and two
high voltage MOSFETs.
This relay’s logic level input con-
trol and very low typical output
on-resistance of 0.4
Ω
makes it
suitable for both ac and dc loads.
Connection A, as shown in the
schematic, allows the relay to
switch either ac or dc loads.
Connection B, with the polarity
and pin configuration as indicated
in the schematic, allows the relay
to switch dc loads only. The
advantage of Connection B is that
the on-resistance is significantly
reduced, and the output current
capability increases by a factor of
two.
The electrical and switching char-
acteristics of the HSSR-8060 are
specified from -40°C to +85°C.
Functional Diagram
Applications
• Programmable Logic
Controllers
TRUTH TABLE
(POSITIVE LOGIC)
LED
OUTPUT
ON
L
OFF
H
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
2
Selection Guide
6-Pin DIP
(300 Mil)
Single
Channel
Package
HSSR-8400
[1]
HSSR-8060
Maximum
Speed
t(ON)
msec
25
°
C
0.95
1.4
1.5
6
Maximum
ON
Resistance
R(ON)
25
°
C
10
0.7
200
1
Maximum
Output
Voltage
VO(off)
V
25
°
C
400
60
200
90
Maximum
Output
Current
Io(ON)
mA
25
°
C
150
750
40
800
Minimum
Input
Current
mA
5
5
1
5
Hermetic
8-Pin
Single
Channel
Packages
Ω
HSSR-7110
[1]
Note:
1. Technical data are on a separate HP publication.
Ordering Information
Specify part number followed by Option Number (if desired).
HSSR-8060#XXX
300 = Gull Wing Surface Mount Lead Option
500 = Tape/Reel Package Option (1 k min.)
Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.
Schematic
6
+
1
I
F
V
F
SWITCH
DRIVER
5
–
2
4
3
Outline Drawing
6-pin DIP Package (HSSR-8060)
9.40 (0.370)
9.90 (0.390)
6
5
4
TYPE
NUMBER
DATE CODE
7.36 (0.290)
7.88 (0.310)
0.20 (0.008)
0.33 (0.013)
HP RXXXX
YYWW
PIN
ONE
DOT
1
2
3
5° TYP.
1.78 (0.070) MAX.
6.10 (0.240)
6.60 (0.260)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
0.45 (0.018)
0.65 (0.025)
2.28 (0.090)
2.80 (0.110)
2.16 (0.085)
2.54 (0.100)
DIMENSIONS IN MILLIMETERS AND (INCHES).
4
6-Pin Device Outline Drawing Option #300 (Gull Wing Surface Mount)
9.65 ± 0.25
(0.380 ± 0.010)
PAD LOCATION (FOR REFERENCE ONLY)
TYPE NUMBER
6.35 ± 0.25
(0.250 ± 0.010)
HP RXXXX
YYWW
DATE CODE
4.826
(0.190)
TYP.
9.398 (0.370)
9.906 (0.390)
1.194 (0.047)
1.778 (0.070)
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
0.381 (0.015)
0.635 (0.025)
1.78
(0.070)
MAX.
4.19
MAX.
(0.165)
0.635 ± 0.130
(0.025 ± 0.005)
0.20 (0.008)
0.30 (0.013)
2.29
(0.090)
2.54
(0.100)
TYP.
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
[3] [5]
DIMENSIONS IN mm (INCHES)
TOLERANCES: xx.xx = 0.01
xx.xxx = 0.001
(unless otherwise specified)
LEAD COPLANARITY
MAXIMUM: 0.102 (0.004)
Thermal Profile (Option #300)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1
Regulatory Information
The HSSR-8060 has been
approved by the following
organizations:
UL
Recognized under UL 508,
Component Recognition Program,
Industrial Control Switches, File
E142465.
CSA
Approved under CAN/CSA-C22.2
No. 14-95, Industrial Control
Equipment, File LR 87683.
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
∆T
= 100°C, 1.5°C/SEC
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
Figure 1. Maximum Solder Reflow Thermal Profile.
(Note: Use of non-chlorine activated fluxes is recommended.)
5
Insulation and Safety Related Specifications
Parameter
Min. External Air Gap
(External Clearance)
Min. External Tracking Path
(External Creepage)
Min. Internal Plastic Gap
(Internal Clearance)
Symbol
L(IO1)
L(IO2)
Value Units
7.0
mm
8.5
0.5
mm
mm
Conditions
Measured from input terminals to output
terminals, shortest distance through air
Measured from input terminals to output
terminals, shortest distance path along body
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity
DIN IEC 112/VDE 0303 PART 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
CTI
200
IIIa
V
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Storage Temperature ................................................... -55°C to+125°C
Operating Temperature - T
A
.......................................... -40°C to +85°C
Case Temperature - T
C
.......................................................... +105°C
[1]
Average Input Current - I
F
............................................................ 20 mA
Repetitive Peak Input Current - I
F
............................................... 40 mA
(Pulse Width
≤
1 ms; duty cycle
≤
50%)
Transient Peak Input Current - I
F
............................................... 100 mA
(Pulse Width
≤
200
µs;
duty cycle
≤
1%)
Reverse Input Voltage - V
R
................................................................ 3 V
Input Power Dissipation .............................................................. 40 mW
Output Voltage (T
A
= 25°C)
Connection A - V
O
......................................................... -60 to +60 V
Connection B - V
O
............................................................. 0 to +60 V
Average Output Current - Figure 3 (T
A
= 25°C, T
C
≤
70°C)
Connection A - I
O
.....................................................................0.75 A
Connection B - I
O
.....................................................................1.50 A
Single Shot Peak Output Current
(100 ms pulse width, T
A
= 25°C, I
F
= 10 mA)
Connection A - I
O
.................................................................... 3.75 A
Connection B - I
O
...................................................................... 7.0 A
Output Power Dissipation ..................................................... 750 mW
[2]
Lead Solder Temperature .... 260°C for 10 S (1.6 mm below seating plane)
Infrared and Vapor Phase Reflow Temperature
(Option #300) ......................................... See Fig. 1, Thermal Profile
Thermal Resistance
Typical Output MOSFET Junction
to Case –
θ
JC
= 55°C/W
Demonstrated ESD
Performance
Human Body Model: MIL-STD-
883 Method 3015.7 - 16 kV
Machine Model: EIAJ 1988.3.28
Version 2), Test Method 20,
Condition C – 1200 V
Surge Withstand
Capability
IEEE STD 472-1974
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