EEWORLDEEWORLDEEWORLD

Part Number

Search

4306S-101-2400BAAL

Description
Array/Network Resistor, Bussed, Thin Film, 0.12W, 240ohm, 50V, 0.1% +/-Tol, -100,100ppm/Cel, 5808,
CategoryPassive components    The resistor   
File Size198KB,2 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Environmental Compliance
Download Datasheet Parametric View All

4306S-101-2400BAAL Overview

Array/Network Resistor, Bussed, Thin Film, 0.12W, 240ohm, 50V, 0.1% +/-Tol, -100,100ppm/Cel, 5808,

4306S-101-2400BAAL Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid770436793
Reach Compliance Codenot_compliant
Country Of OriginCosta Rica
ECCN codeEAR99
YTEOL6.9
structureMolded
JESD-609 codee3
Lead length3.43 mm
lead spacing2.54 mm
Network TypeBussed
Number of terminals6
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height4.95 mm
Package length14.83 mm
Package formSIP
Package width2.16 mm
Rated power dissipation(P)0.12 W
resistance240 Ω
Resistor typeARRAY/NETWORK RESISTOR
series4300S
size code5808
technologyTHIN FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceMatte Tin (Sn)
Tolerance0.1%
Operating Voltage50 V
oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
Features
RoHS compliant* (see How to Order
“Termination” option)
Low profile provides compatibility with
DIPs
Also available in medium profile (4300S -
.250 ”) and high profile (4300K - .350 ”)
Marking on contrasting background
Custom circuits available per factory
*R
4300T, S, K Series - Thin Film Molded SIP
Product Characteristics
Resistance Range
Bussed ...................49.9 to 100K ohms
Isolated ......................20 to 200K ohms
Series.........................20 to 100K ohms
Resistance Tolerance
.........................±0.1 %, ±0.5 %, ±1 %
Temperature Coefficient
..................±100 ppm/°C, ±50 ppm/°C,
±25 ppm/°C
Temperature Range ....-55 °C to +125 °C
Insulation Resistance
..................10,000 megohms minimum
TCR Tracking .........................±5 ppm/°C
Maximum Operating Voltage............50 V
Environmental Characteristics
Thermal Shock and
Power Conditioning ...................... 0.1 %
Short Time Overload ..................... 0.1 %
Terminal Strength ........................ 0.25 %
Resistance to Soldering Heat ....... 0.1 %
Moisture Resistance ..................... 0.1 %
Life .............................................. 0.50 %
Physical Characteristics
Body Material Flammability
...........................Conforms to UL94V-0
Lead Frame Material
..........................Copper, solder coated
Body Material ..................Novolac epoxy
How To Order
Package Power Temp. Derating Curve
(Low Profile, 4300T)
(
)
1.75
1.50
4311T
WATTS
1.25
1.00
.75
.50
.25
4310T
4309T
4308T
4306T
Product Dimensions
27.53
MAX.
(1.084)
22.45
MAX.
(.884)
14.83 MAX.
(.584)
24.99
MAX.
(.984)
19.92
MAX.
(.784)
PIN #1 REF.
4.95
(.195)
MAX.
.381 + .127/ - .000
(.015 + .005/ - 000)
2.54
±
.07
(.100
±
.003*)
TYP.
NON-ACCUM.
3.43 + .38/ - .25
(.135 + .015/ - .010)
1.02
±
.12
(.040
±
.005)
.483
±
.050
TYP.
(.020
±
.002)
2.16
±
.10
(.085
±
.004)
25
70
150
125
AMBIENT TEMPERATURE (
°
C )
0
Package Power Ratings at 70°C
T
S
K
4304 .......... ............ 0.60...... 0.80 watts
4306 ...... 0.75.......... 0.90...... 1.20 watts
4308 ...... 1.00.......... 1.20...... 1.60 watts
4309 ...... 1.13 ................................watts
4310 ...... 1.25.......... 1.50...... 2.00 watts
4311 ...... 1.38 ................................watts
1.02
±
.05
(.0425
±
.002)
.254
±
.050
(.010
±
.002)
Governing dimensions are in metric. Dimensions in parentheses
are inches and are approximate.
*Terminal centerline to centerline measurements made at point of
emergence of the lead from the body.
43 11 T - 101 - 2222 F A B __
Model
(43 = Molded SIP)
Number of Pins
Physical Config.
•T = Low Profile Thin Film
•S = Med. Profile Thin Film
•K = High Profile Thin Film
Electrical Configuration
•101 = Bussed
•102 = Isolated
•106 = Series
Resistance Code
•First 3 digits are significant
•Fourth digit represents the
number of zeros to follow.
Absolute Tolerance Code
•B = ±0.1%
•F = ±1%
•D = ±0.5%
Temperature Coefficient Code
•A = ±100ppm/°C •C = ±25ppm/°C
•B = ±50ppm/°C
Ratio Tolerance (Optional)
•A = ±0.05% to R1 •D = ±0.5% to R1
•B = ±0.1% to R1
Terminations
• L = Tin-plated (RoHS compliant version)
• Blank = Tin/Lead-plated
Consult factory for other available options.
Typical Part Marking
Represents total content. Layout may vary.
PART
NUMBER
4311T-101-
1003BB
YYWW
CIRCUIT
RESISTANCE
CODE
DATE CODE
PIN ONE
INDICATOR
MANUFACTURER'S
TRADEMARK
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
I just installed WinCE, and when I used PB to compile the simulator, I couldn't find WZCDeleteIntfObjEx, etc.?
I just installed WinCE. When I used PB to compile the simulator, I couldn't find WZCDeleteIntfObjEx. In which file is WZCDeleteIntfObjEx? Error content: wzctool.lib(wzctool.obj) : error LNK2019: unres...
taoweiwen Embedded System
A simple demo of MCF52259 QSPI reading and writing SD card
Here is a simple program to read and write SD card using QSPI module of MCF52259. The function is very simple. It first obtains the relevant information of SD card (block size, number of blocks), then...
bluehacker NXP MCU
Angle control algorithm of slope sensor
When using the slope sensor, how is the angle controlled? Does anyone have an algorithm for this? Please give me some advice:congratulate:...
jonlovehanxu MCU
Has anyone made a camera driver based on the 2440 camera interface?
As the title says, I am making a camera driver based on camera interface (Samsung has provided a benchmark driver, not USB). Now I can write data to the camera IC through SCCB, and the preview image h...
grace811226 Embedded System
ADuC 814, can I write data into 8kb FLASH, and what instruction can be used to read the data at a specified address?
Now I only found a way to download the program to FLASH through the serial port, and there are instructions to read and write the 640B data storage area. But I want to put both the program and data in...
stone8530 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2673  2927  2893  192  2352  54  59  4  48  44 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号