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74HCU04PW,112

Description
inverters hex inverter (unbuf)
Categorylogic    logic   
File Size138KB,18 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74HCU04PW,112 Overview

inverters hex inverter (unbuf)

74HCU04PW,112 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeTSSOP
package instruction4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
Contacts14
Manufacturer packaging codeSOT402-1
Reach Compliance Codecompli
seriesHC/UH
JESD-30 codeR-PDSO-G14
JESD-609 codee4
length5 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeINVERTER
MaximumI(ol)0.004 A
Humidity sensitivity level1
Number of functions6
Number of entries1
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP14,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTUBE
Peak Reflow Temperature (Celsius)260
power supply2/6 V
Prop。Delay @ Nom-Su21 ns
propagation delay (tpd)105 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width4.4 mm
74HCU04
Hex inverter
Rev. 6 — 27 December 2012
Product data sheet
1. General description
The 74HCU04 is a hex unbuffered inverter. Inputs include clamp diodes. This enables the
use of current limiting resistors to interface inputs to voltages in excess of V
CC
.
2. Features and benefits
Complies with JEDEC standard JESD7A
Balanced propagation delays
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature
range
74HCU04N
74HCU04D
74HCU04DB
74HCU04PW
74HCU04BQ
Name
Description
plastic dual in-line package; 14 leads (300 mil)
plastic shrink small outline package; 14 leads; body width
5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
Version
SOT27-1
SOT337-1
SOT402-1
SOT762-1
Type number
40 C
to +125
C
DIP14
40 C
to +125
C
SO14
40 C
to +125
C
SSOP14
40 C
to +125
C
TSSOP14
plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
40 C
to +125
C
DHVQFN14 plastic dual in-line compatible thermal enhanced very thin
quad flat package; no leads; 14 terminals;
body 2.5
3
0.85 mm

74HCU04PW,112 Related Products

74HCU04PW,112 74HCU04D,652 74HCU04PW,118
Description inverters hex inverter (unbuf) inverters hex inverter (unbuf) inverters hex inverter (unbuf)
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconductor
Is it Rohs certified? conform to conform to conform to
Maker NXP NXP NXP
Parts packaging code TSSOP SOIC TSSOP
package instruction 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 TSSOP-14
Contacts 14 14 14
Manufacturer packaging code SOT402-1 SOT108-1 SOT402-1
Reach Compliance Code compli compli compliant
series HC/UH HC/UH HC/UH
JESD-30 code R-PDSO-G14 R-PDSO-G14 R-PDSO-G14
JESD-609 code e4 e4 e4
length 5 mm 8.65 mm 5 mm
Load capacitance (CL) 50 pF 50 pF 50 pF
Logic integrated circuit type INVERTER INVERTER INVERTER
MaximumI(ol) 0.004 A 0.004 A 0.004 A
Humidity sensitivity level 1 1 1
Number of functions 6 6 6
Number of entries 1 1 1
Number of terminals 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SOP TSSOP
Encapsulate equivalent code TSSOP14,.25 SOP14,.25 TSSOP14,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TUBE BULK PACK TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 260
power supply 2/6 V 2/6 V 2/6 V
propagation delay (tpd) 105 ns 105 ns 21 ns
Certification status Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO
Maximum seat height 1.1 mm 1.75 mm 1.1 mm
Maximum supply voltage (Vsup) 6 V 6 V 6 V
Minimum supply voltage (Vsup) 2 V 2 V 2 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm 0.65 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30
width 4.4 mm 3.9 mm 4.4 mm
Prop。Delay @ Nom-Su 21 ns 21 ns -

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