74HCU04PW,118 datasheet, PDF - EEWORLD Datasheet

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74HCU04PW,118: Descriptioninverters hex inverter (unbuf); Categorylogic logic; File Size138KB，18 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74HCU04PW,118 Overview

inverters hex inverter (unbuf)

74HCU04PW,118 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconductor
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	TSSOP
package instruction	TSSOP-14
Contacts	14
Manufacturer packaging code	SOT402-1
Reach Compliance Code	compliant
series	HC/UH
JESD-30 code	R-PDSO-G14
JESD-609 code	e4
length	5 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	INVERTER
MaximumI(ol)	0.004 A
Humidity sensitivity level	1
Number of functions	6
Number of entries	1
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP14,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260
power supply	2/6 V
Prop。Delay @ Nom-Sup	21 ns
propagation delay (tpd)	21 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	1.1 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	4.4 mm

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74HCU04

Hex inverter

Rev. 6 — 27 December 2012

Product data sheet

1. General description

The 74HCU04 is a hex unbuffered inverter. Inputs include clamp diodes. This enables the

use of current limiting resistors to interface inputs to voltages in excess of V

2. Features and benefits



Complies with JEDEC standard JESD7A



Balanced propagation delays



ESD protection:



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-A exceeds 200 V



Multiple package options



Specified from

40 C

to +125

C

3. Ordering information

Table 1.

Ordering information

Package

Temperature

range

74HCU04N

74HCU04D

74HCU04DB

74HCU04PW

74HCU04BQ

Name

Description

plastic dual in-line package; 14 leads (300 mil)

plastic shrink small outline package; 14 leads; body width

5.3 mm

plastic thin shrink small outline package; 14 leads;

body width 4.4 mm

Version

SOT27-1

SOT337-1

SOT402-1

SOT762-1

Type number

40 C

to +125

C

DIP14

40 C

to +125

C

SO14

40 C

to +125

C

SSOP14

40 C

to +125

C

TSSOP14

plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

40 C

to +125

C

DHVQFN14 plastic dual in-line compatible thermal enhanced very thin

quad flat package; no leads; 14 terminals;

body 2.5



0.85 mm

74HCU04PW,118 Related Products

	74HCU04PW,118	74HCU04PW,112	74HCU04D,652
Description	inverters hex inverter (unbuf)	inverters hex inverter (unbuf)	inverters hex inverter (unbuf)
Brand Name	NXP Semiconductor	NXP Semiconduc	NXP Semiconduc
Is it Rohs certified?	conform to	conform to	conform to
Maker	NXP	NXP	NXP
Parts packaging code	TSSOP	TSSOP	SOIC
package instruction	TSSOP-14	4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14	3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Contacts	14	14	14
Manufacturer packaging code	SOT402-1	SOT402-1	SOT108-1
Reach Compliance Code	compliant	compli	compli
series	HC/UH	HC/UH	HC/UH
JESD-30 code	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14
JESD-609 code	e4	e4	e4
length	5 mm	5 mm	8.65 mm
Load capacitance (CL)	50 pF	50 pF	50 pF
Logic integrated circuit type	INVERTER	INVERTER	INVERTER
MaximumI(ol)	0.004 A	0.004 A	0.004 A
Humidity sensitivity level	1	1	1
Number of functions	6	6	6
Number of entries	1	1	1
Number of terminals	14	14	14
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	TSSOP	SOP
Encapsulate equivalent code	TSSOP14,.25	TSSOP14,.25	SOP14,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE
method of packing	TAPE AND REEL	TUBE	BULK PACK
Peak Reflow Temperature (Celsius)	260	260	260
power supply	2/6 V	2/6 V	2/6 V
propagation delay (tpd)	21 ns	105 ns	105 ns
Certification status	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO
Maximum seat height	1.1 mm	1.1 mm	1.75 mm
Maximum supply voltage (Vsup)	6 V	6 V	6 V
Minimum supply voltage (Vsup)	2 V	2 V	2 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
Terminal form	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30
width	4.4 mm	4.4 mm	3.9 mm
Prop。Delay @ Nom-Su	-	21 ns	21 ns

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