Nibble Mode DRAM, 1MX1, 80ns, CMOS, PZIP19, PLASTIC, ZIP-20/19
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | SAMSUNG |
| Parts packaging code | ZIP |
| package instruction | ZIP, ZIP20,.1 |
| Contacts | 20 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| access mode | NIBBLE |
| Maximum access time | 80 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O type | SEPARATE |
| JESD-30 code | R-PZIP-T19 |
| JESD-609 code | e0 |
| length | 26.165 mm |
| memory density | 1048576 bi |
| Memory IC Type | NIBBLE MODE DRAM |
| memory width | 1 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 19 |
| word count | 1048576 words |
| character code | 1000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1MX1 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | ZIP |
| Encapsulate equivalent code | ZIP20,.1 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| refresh cycle | 512 |
| Maximum seat height | 10.16 mm |
| Maximum standby current | 0.001 A |
| Maximum slew rate | 0.075 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.27 mm |
| Terminal location | ZIG-ZAG |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 2.96 mm |
| Base Number Matches | 1 |
| KM41C1001BZ-8 | KM41C1001BZ-10 | KM41C1001BJ-10 | KM41C1001BJ-8 | KM41C1001BJ-6 | KM41C1001BZ-6 | KM41C1001BJ-7 | KM41C1001BP-10 | KM41C1001BP-6 | KM41C1001BP-7 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Nibble Mode DRAM, 1MX1, 80ns, CMOS, PZIP19, PLASTIC, ZIP-20/19 | Nibble Mode DRAM, 1MX1, 100ns, CMOS, PZIP19, PLASTIC, ZIP-20/19 | Nibble Mode DRAM, 1MX1, 100ns, CMOS, PDSO20, PLASTIC, SOJ-26/20 | Nibble Mode DRAM, 1MX1, 80ns, CMOS, PDSO20, PLASTIC, SOJ-26/20 | Nibble Mode DRAM, 1MX1, 60ns, CMOS, PDSO20, PLASTIC, SOJ-26/20 | Nibble Mode DRAM, 1MX1, 60ns, CMOS, PZIP19, PLASTIC, ZIP-20/19 | Nibble Mode DRAM, 1MX1, 70ns, CMOS, PDSO20, PLASTIC, SOJ-26/20 | Nibble Mode DRAM, 1MX1, 100ns, CMOS, PDIP18, PLASTIC, DIP-18 | Nibble Mode DRAM, 1MX1, 60ns, CMOS, PDIP18, PLASTIC, DIP-18 | Nibble Mode DRAM, 1MX1, 70ns, CMOS, PDIP18, PLASTIC, DIP-18 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |
| Parts packaging code | ZIP | ZIP | SOJ | SOJ | SOJ | ZIP | SOJ | DIP | DIP | DIP |
| package instruction | ZIP, ZIP20,.1 | ZIP, ZIP20,.1 | SOJ, SOJ20/26,.34 | SOJ, SOJ20/26,.34 | SOJ, SOJ20/26,.34 | ZIP, ZIP20,.1 | SOJ, SOJ20/26,.34 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 |
| Contacts | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 18 | 18 | 18 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE | NIBBLE |
| Maximum access time | 80 ns | 100 ns | 100 ns | 80 ns | 60 ns | 60 ns | 70 ns | 100 ns | 60 ns | 70 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O type | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 code | R-PZIP-T19 | R-PZIP-T19 | R-PDSO-J20 | R-PDSO-J20 | R-PDSO-J20 | R-PZIP-T19 | R-PDSO-J20 | R-PDIP-T18 | R-PDIP-T18 | R-PDIP-T18 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 26.165 mm | 26.165 mm | 17.145 mm | 17.145 mm | 17.145 mm | 26.165 mm | 17.145 mm | 22.02 mm | 22.02 mm | 22.02 mm |
| memory density | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM |
| memory width | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 19 | 19 | 20 | 20 | 20 | 19 | 20 | 18 | 18 | 18 |
| word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | ZIP | ZIP | SOJ | SOJ | SOJ | ZIP | SOJ | DIP | DIP | DIP |
| Encapsulate equivalent code | ZIP20,.1 | ZIP20,.1 | SOJ20/26,.34 | SOJ20/26,.34 | SOJ20/26,.34 | ZIP20,.1 | SOJ20/26,.34 | DIP18,.3 | DIP18,.3 | DIP18,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| Maximum seat height | 10.16 mm | 10.16 mm | 3.68 mm | 3.68 mm | 3.68 mm | 10.16 mm | 3.68 mm | 4.65 mm | 4.65 mm | 4.65 mm |
| Maximum standby current | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
| Maximum slew rate | 0.075 mA | 0.065 mA | 0.065 mA | 0.075 mA | 0.095 mA | 0.095 mA | 0.085 mA | 0.065 mA | 0.095 mA | 0.085 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES | YES | NO | YES | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | ZIG-ZAG | ZIG-ZAG | DUAL | DUAL | DUAL | ZIG-ZAG | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 2.96 mm | 2.96 mm | 7.62 mm | 7.62 mm | 7.62 mm | 2.96 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
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