AM29F200BB50SI datasheet, PDF - EEWORLD Datasheet

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AM29F200BB50SI: Description256KX8 FLASH 5V PROM, 50ns, PDSO44, SOP-44; Categorystorage storage; File Size906KB，41 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM29F200BB50SI Overview

256KX8 FLASH 5V PROM, 50ns, PDSO44, SOP-44

AM29F200BB50SI Parametric

Parameter Name	Attribute value
Parts packaging code	SOIC
package instruction	SOP,
Contacts	44
Reach Compliance Code	unknown
Maximum access time	50 ns
Other features	CONFG AS 128K X 16; BOTTOM BOOT BLOCK
JESD-30 code	R-PDSO-G44
memory density	2097152 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	44
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Programming voltage	5 V
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal location	DUAL
Base Number Matches	1

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Am29F200B

Data Sheet

July 2003

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-

inally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appropriate,

and changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order

these products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number

21526

Revision

Amendment

Issue Date

November 29, 2000

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . .

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . .

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . .

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Ordering Information . . . . . . . . . . . . . . . . . . . . . . .

Device Bus Operations . . . . . . . . . . . . . . . . . . . . .

DQ3: Sector Erase Timer ....................................................... 20

Figure 5. Toggle Bit Algorithm........................................................ 20

Table 6. Write Operation Status ..................................................... 21

Table 1. Am29F200B Device Bus Operations ..................................9

Word/Byte Configuration .......................................................... 9

Requirements for Reading Array Data ..................................... 9

Writing Commands/Command Sequences .............................. 9

Program and Erase Operation Status .................................... 10

Standby Mode ........................................................................ 10

RESET#: Hardware Reset Pin ............................................... 10

Output Disable Mode .............................................................. 10

Table 2. Am29F200T Top Boot Block Sector Address Table .........11

Table 3. Am29F200B Bottom Boot Block Sector Address Table ....11

Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 22

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 22

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 23

TTL/NMOS Compatible .......................................................... 23

CMOS Compatible .................................................................. 24

Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 8. Test Setup....................................................................... 25

Table 7. Test Specifications ........................................................... 25

Key to Switching Waveforms. . . . . . . . . . . . . . . . 25

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 26

Read Operations .................................................................... 26

Figure 9. Read Operations Timings ............................................... 26

Hardware Reset (RESET#) .................................................... 27

Figure 10. RESET# Timings .......................................................... 27

Autoselect Mode ..................................................................... 11

Table 4. Am29F200B Autoselect Codes (High Voltage Method) ....12

Word/Byte Configuration (BYTE#)

...................................... 28

Sector Protection/Unprotection ............................................... 12

Temporary Sector Unprotect .................................................. 12

Figure 1. Temporary Sector Unprotect Operation........................... 12

Figure 11. BYTE# Timings for Read Operations............................ 28

Figure 12. BYTE# Timings for Write Operations............................ 28

Erase/Program Operations ..................................................... 29

Figure 13. Program Operation Timings..........................................

Figure 14. Chip/Sector Erase Operation Timings ..........................

Figure 15. Data# Polling Timings (During Embedded Algorithms).

Figure 16. Toggle Bit Timings (During Embedded Algorithms)......

Figure 17. DQ2 vs. DQ6.................................................................

Hardware Data Protection ...................................................... 12

Low V

Write Inhibit ......................................................................13

Write Pulse “Glitch” Protection ........................................................13

Logical Inhibit ..................................................................................13

Power-Up Write Inhibit ....................................................................13

Temporary Sector Unprotect .................................................. 33

Figure 18. Temporary Sector Unprotect Timing Diagram .............. 33

Command Definitions . . . . . . . . . . . . . . . . . . . . . 13

Reading Array Data ................................................................ 13

Reset Command ..................................................................... 13

Autoselect Command Sequence ............................................ 13

Word/Byte Program Command Sequence ............................. 14

Figure 2. Program Operation .......................................................... 14

Alternate CE# Controlled Erase/Program Operations ............ 34

Figure 19. Alternate CE# Controlled Write Operation Timings ...... 35

Chip Erase Command Sequence ........................................... 14

Sector Erase Command Sequence ........................................ 15

Erase Suspend/Erase Resume Commands ........................... 15

Figure 3. Erase Operation............................................................... 16

Command Definitions ............................................................. 17

Table 5. Am29F200B Command Definitions ...................................17

DQ7: Data# Polling ................................................................. 18

Figure 4. Data# Polling Algorithm ................................................... 18

RY/BY#: Ready/Busy# ........................................................... 19

DQ6: Toggle Bit I .................................................................... 19

DQ2: Toggle Bit II ................................................................... 19

Reading Toggle Bits DQ6/DQ2 .............................................. 19

DQ5: Exceeded Timing Limits ................................................ 20

Erase and Programming Performance . . . . . . . . 36

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 36

TSOP and SO Pin Capacitance . . . . . . . . . . . . . . 36

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 37

SO 044—44-Pin Small Outline Package ................................ 37

TS 048—48-Pin Standard Thin Small Outline Package ......... 38

TSR048—48-Pin Reverse Thin Small Outline Package ......... 39

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 40

Revision A (July 1998) ............................................................ 40

Revision B (January 1999) ..................................................... 40

Revision B+1 (April 12, 1999) ................................................. 40

Revision B+2 (July 2, 1999) .................................................... 40

Revision C (November 12, 1999) ........................................... 40

Revision D (November 29, 2000) ........................................... 40

Am29F200B

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