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IDT70P5258ML55BZ

Description
Standard SRAM, 8KX16, 55ns, PBGA144, 0.50 MM PITCH, FBGA-144
Categorystorage    storage   
File Size189KB,13 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT70P5258ML55BZ Overview

Standard SRAM, 8KX16, 55ns, PBGA144, 0.50 MM PITCH, FBGA-144

IDT70P5258ML55BZ Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionBGA,
Contacts144
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time55 ns
JESD-30 codeS-PBGA-B144
JESD-609 codee0
memory density131072 bit
Memory IC TypeSTANDARD SRAM
memory width16
Number of functions1
Number of terminals144
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8KX16
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
Base Number Matches1
HIGH-SPEED
8K x 16 TriPort
STATIC RAM
Features
IDT70P5258ML
IDT70P525ML
IDT70V525ML
High-speed access
– Industrial: 55ns (max.)
Low-power operation
– IDT70P5258ML and IDT70P525ML
Active: 54mW (typ.)
Standby: 7.2
µ
W (typ.)
– IDT70V525ML
Active: 450mW (typ.)
Standby: 250
µ
W (typ.)
TriPort architecture allows simultaneous access to the
memory from all three ports
Fully asynchronous operation from each of the three
ports: P1, P2, and P3
IDT70P5258 supports 3.0V and 1.8V I/O's
Available in 144-ball 0.5mm-pitch
fpBGA
Industrial temperature range (–40°C to +85°C)
Functional Block Diagram
PORT 2
Address
Decode
BE
0P1,
BE
1P1
R/
W
P1
OE
P1
A
0P2
- A
11P2
CE
P2
R/
W
P2
OE
P2
I/O
0P1
-I/O
15P1
PORT 1
I/O
Control
PORT 2
I/O
Control
I/O
0P2
-I/O
15P2
Memory
Array
A
0P1
- A
11P1
BE
0P1,
BE
1P1
PORT 3
I/O
Control
CE
P3
R/
W
P3
OE
P3
PORT 1
Address
Decode
PORT 3
Address
Decode
BE
0P1,
BE
1P1
I/O
0P3
-I/O
15P3
A
0P3
- A
11P3
R/
W
P1
OE
P1
INT
P1 - P2
INT
P1 - P3
Interrupt
Control
CE
P2,
CE
P3
R/W
P2,
R/W
P3
INT
P3 - P1
INT
P2 - P1
OE
P2,
OE
P3
,
5681 drw 01
MARCH 2004
1
©2004 Integrated Device Technology, Inc.
DSC 5681/2

IDT70P5258ML55BZ Related Products

IDT70P5258ML55BZ IDT70P525ML55BZ IDT70V525ML55BZ
Description Standard SRAM, 8KX16, 55ns, PBGA144, 0.50 MM PITCH, FBGA-144 Standard SRAM, 8KX16, 55ns, PBGA144, 0.50 MM PITCH, FBGA-144 Standard SRAM, 8KX16, 55ns, PBGA144, 0.50 MM PITCH, FBGA-144
Is it lead-free? Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA BGA BGA
package instruction BGA, 0.50 MM PITCH, FBGA-144 0.50 MM PITCH, FBGA-144
Contacts 144 144 144
Reach Compliance Code not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99
Maximum access time 55 ns 55 ns 55 ns
JESD-30 code S-PBGA-B144 S-PBGA-B144 S-PBGA-B144
JESD-609 code e0 e0 e0
memory density 131072 bit 131072 bit 131072 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 16 16 16
Number of functions 1 1 1
Number of terminals 144 144 144
word count 8192 words 8192 words 8192 words
character code 8000 8000 8000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
organize 8KX16 8KX16 8KX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 225
Certification status Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 1.9 V 1.9 V 3.3 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 2.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD TIN LEAD TIN LEAD
Terminal form BALL BALL BALL
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 30
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