OR Gate, F/FAST Series, 4-Func, 2-Input, TTL, CDIP14, CERAMIC, DIP-14
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | DIP, DIP14,.3 |
| Contacts | 14 |
| Reach Compliance Code | unknow |
| series | F/FAST |
| JESD-30 code | R-GDIP-T14 |
| JESD-609 code | e0 |
| length | 19.43 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | OR GATE |
| Number of functions | 4 |
| Number of entries | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Maximum supply current (ICC) | 15.5 mA |
| propagation delay (tpd) | 7.5 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 54F32DM | 54F32DMQB | 54F32FM | 54F32LMQB | 54F32FMQB | 54F32LM | |
|---|---|---|---|---|---|---|
| Description | OR Gate, F/FAST Series, 4-Func, 2-Input, TTL, CDIP14, CERAMIC, DIP-14 | OR Gate, F/FAST Series, 4-Func, 2-Input, TTL, CDIP14, CERAMIC, DIP-14 | OR Gate, F/FAST Series, 4-Func, 2-Input, TTL, CDFP14, CERPACK-14 | OR Gate, F/FAST Series, 4-Func, 2-Input, TTL, CQCC20, CERAMIC, LCC-20 | OR Gate, F/FAST Series, 4-Func, 2-Input, TTL, CDFP14, CERPACK-14 | OR Gate, F/FAST Series, 4-Func, 2-Input, TTL, CQCC20, CERAMIC, LCC-20 |
| Parts packaging code | DIP | DIP | DFP | QLCC | DFP | QLCC |
| package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | QCCN, LCC20,.35SQ | DFP, FL14,.3 | CERAMIC, LCC-20 |
| Contacts | 14 | 14 | 14 | 20 | 14 | 20 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown |
| series | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 code | R-GDIP-T14 | R-GDIP-T14 | R-GDFP-F14 | S-CQCC-N20 | R-GDFP-F14 | S-CQCC-N20 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE |
| Number of functions | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of entries | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 14 | 14 | 14 | 20 | 14 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | DFP | QCCN | DFP | QCCN |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| Package form | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER | FLATPACK | CHIP CARRIER |
| Maximum supply current (ICC) | 15.5 mA | 15.5 mA | 15.5 mA | 15.5 mA | 15.5 mA | 15.5 mA |
| propagation delay (tpd) | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm | 2.032 mm | 1.905 mm | 2.032 mm | 1.905 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES | YES | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD | FLAT | NO LEAD |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD |
| width | 7.62 mm | 7.62 mm | 6.2865 mm | 8.89 mm | 6.2865 mm | 8.89 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | - |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | - |
| length | 19.43 mm | 19.43 mm | - | 8.89 mm | - | 8.89 mm |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | FL14,.3 | LCC20,.35SQ | FL14,.3 | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| Schmitt trigger | NO | NO | NO | NO | NO | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
Embedded System
DSP and ARM Processors
DIY/Open Source Hardware
MCU
Microchip MCU
Domestic Chip Exchange
京公网安备 11010802033920号
EEWORLD
