ECP052D
Product Features
•
800 – 1000 MHz
•
18 dB Gain @ 900 MHz
•
+28.5 dBm P1dB
•
+44 dBm Output IP3
•
Single Positive Supply (+5V)
½ Watt, High Linearity InGaP HBT Amplifier
Product Description
The ECP052D is a high dynamic range driver amplifier
in a low-cost surface mount package. The InGaP/GaAs
HBT is able to achieve high performance for various
narrowband-tuned application circuits with up to +44
dBm OIP3 and +28.5 dBm of compressed 1dB power.
It is housed in an industry standard in a lead-free/
green/RoHS-compliant 16-pin 4x4mm QFN surface-
mount package. All devices are 100% RF and DC
tested.
The ECP052D is targeted for use as a driver amplifier in
wireless infrastructure where high linearity and medium
power is required. An internal active bias allows the
ECP052D to maintain high linearity over temperature
and operate directly off a single +5V supply. This
combination makes the device an excellent candidate for
transceiver line cards in current and next generation
multi-carrier 3G base stations.
Functional Diagram
Vbias
N/C
N/C
14
16
Vref 1
N/C 2
RF IN 3
N/C 4
5
N/C
6
N/C
7
N/C
8
N/C
15
N/C
13
12 N/C
11 RF OUT
10 RF OUT
9 N/C
•
Lead-free/green/RoHS-compliant
16-pin 4x4mm QFN package
Applications
•
Final stage amplifiers for
Repeaters
•
Mobile Infrastructure
Function
Vref
RF Input
RF Output
Vbias
GND
N/C or GND
Pin No.
1
3
10, 11
16
Backside Paddle
2, 4-9, 12-15
Specifications
Parameter
Operational Bandwidth
Test Frequency
Gain
Output P1dB
Output IP3
(2)
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
(2)
IS-95A Channel Power
@ -45 dBc ACPR, 1960 MHz
Units Min
MHz
MHz
dB
dBm
dBm
MHz
dB
dB
dB
dBm
dBm
dBm
dB
mA
V
200
800
Typ
850
17
+28
+44
900
17.8
18
7
+28.7
+43
+23
7
250
+5
Max
1000
15.5
+27
+42.5
Noise Figure
Quiescent Current, Icq
Device Voltage, Vcc
300
1. Test conditions unless otherwise noted: 25 ºC, Vsupply = +5 V, in tuned application circuit.
2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. It is expected that the current can increase by an additional 50 mA at P1dB. Pin 1 is used as a
reference voltage for the internal biasing circuitry. It is expected that Pin 1 will pull 12mA of current when used with a series bias resistor of R1=100Ω. (ie. total device current typically will be 262 mA.)
Absolute Maximum Rating
Parameter
Storage Temperature
RF Input Power (continuous)
Device Voltage
Device Current
Device Power
Thermal Resistance, Rth
Junction Temperature
-65 to +150
°C
+22 dBm
+8 V
400 mA
2W
60°C/W
+200°C
Rating
Ordering Information
Part No.
ECP052D-G
ECP052D-PCB900
Description
½-Watt, High Linearity InGaP HBT Amplifier
(lead-free/green/RoHS-compliant 16-pin 4x4mm QFN package)
900 MHz Evaluation Board
Operation of this device above any of these parameters may cause permanent damage.
Standard tape / reel size = 1000 pieces on a 7” reel
Specifications and information are subject to change without notice
Page 1 of 4
July 2010
TriQuint Semiconductor Inc
•
Phone 1-503-615-9000
•
FAX: 503-615-8900
•
e-mail: info-sales@tqs.com
•
Web site: www.TriQuint.com
ECP052D
40
½ Watt, High Linearity InGaP HBT Amplifier
S-Parameters (V
cc
= +5 V, I
cc
= 250 mA, T = 25
°C,
unmatched 50 ohm system)
S11
0.8
Typical Device Data
1.0
6
0.
S22
Swp Max
1000MHz
0
0.
6
0.8
1.0
Gain / Maximum Stable Gain
35
30
Gain (dB)
25
20
0.2
0
0.2
Swp Max
1000MHz
2.
0
DB(|S(2,1)|)
DB(GMax())
0.
4
2.
0
3.
0
4.
5.0
0 .2
10.0
10.0
10.0
0.4
0.6
0.8
1.0
2.0
4.0
0.2
0.4
0.6
0.8
1.0
2.0
3.0
4.0
15
10
-0.
2
-10. 0
0
50
550
1050
1550
Frequency (MHz)
2050
2500
-0
.4
-0
.4
0
.
-2
.6
-0
-0
.6
-0.8
Swp Min
50MHz
-0.8
-2
.0
Swp Min
50MHz
Notes:
The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency,
it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line.
The return loss plots are shown from 50 – 1000 MHz, with markers placed at .05, 0.1 and 0.2 – 1 GHz in 0.2 GHz increments.
S-Parameters (V
cc
= +5 V, I
cc
= 250 mA, T = 25
°C,
unmatched 50 ohm system, calibrated to device leads)
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50
100
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
2600
2800
3000
-2.08
-1.60
-1.55
-1.57
-1.76
-1.97
-2.43
-3.12
-4.43
-7.08
-14.24
-16.59
-7.06
-3.67
-2.10
-1.47
-1.06
-167.47
-176.25
177.39
168.97
160.42
153.20
145.24
137.49
127.55
115.61
109.36
-142.19
-146.15
-163.93
179.98
166.40
153.09
25.81
21.21
17.43
14.31
13.39
12.83
12.08
11.67
11.46
11.47
11.30
10.56
8.89
6.53
3.89
1.31
-1.27
121.88
119.02
119.68
113.15
106.07
91.91
78.04
64.05
48.41
30.39
7.39
-17.73
-43.22
-65.55
-83.84
-98.81
-112.21
-1.0
-34.39
-33.70
-34.57
-35.33
-33.51
-33.13
-30.97
-30.23
-30.25
-29.61
-28.18
-28.42
-29.33
-30.99
-32.78
-36.21
-36.60
20.06
10.30
-0.55
-4.58
-4.12
-16.00
-28.08
-36.11
-46.25
-62.25
-82.41
-109.55
-134.21
-158.32
179.11
169.00
140.50
-2.85
-3.46
-3.77
-3.57
-1.91
-1.70
-2.05
-2.30
-2.36
-2.41
-2.06
-1.64
-1.22
-1.18
-1.43
-1.39
-1.60
-1.0
-128.57
-152.91
-165.97
-165.83
-168.71
-177.38
177.99
175.47
174.66
173.61
171.18
168.93
162.93
155.95
149.66
144.07
138.31
Application Circuit PC Board Layout
Circuit Board Material: .014” Getek, 4 - layer, 1 oz copper, Microstrip line details: width = .026”, spacing = .026”
The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning
Shunt capacitors – C8, C9 and C10. The markers and vias are spaced in .050” increments.
Specifications and information are subject to change without notice
TriQuint Semiconductor Inc
•
Phone 1-503-615-9000
•
FAX: 503-615-8900
•
e-mail: info-sales@tqs.com
•
Web site: www.TriQuint.com
Page 2 of 4
July 2010
-4
.0
5
- 5.
0
- 0.
2
5.0
3.0
5.0
0
-3
.0
0.
4
3.
0
4.
0
5 .0
10.0
-10.0
-4
.0
-5.
0
-3
.0
ECP052D
Frequency
S21 – Gain
S11 – Input Return Loss
S22 – Output Return Loss
Output P1dB
Output IP3
(+11 dBm / tone, 1 MHz spacing)
½ Watt, High Linearity InGaP HBT Amplifier
900 MHz Application Circuit (ECP052D-PCB900)
Typical RF Performance at 25
°C
900 MHz
17.5 dB
-18 dB
-7 dB
+28.7 dBm
+43 dBm
ID=C1
C=22 pF
ID=R3
R=51 Ohm
ID=C11
R=0 Ohm
ID=C2
C=22 pF
ID=C5
C=1000 pF
ID=R2
R=22 Ohm
ID=C4
C=1e7 pF
ID=C7
C=1000 pF
ID=R1
R=100 Ohm
Vsupply = +5V
+5.6V Zener
ID=C6
C=10 pF
16
1
15
14
13
12
2
ID=ECP52D
11
ID=L1
L=33 nH
size 1008
Channel Power
(@-45 dBc ACPR, IS-95 9 channels fwd)
+23 dBm
7 dB
+5 V
250 mA
ID=C3
C=56 pF
3
10
Noise Figure
Device / Supply Voltage
Quiescent Current
4
9
The transmission line lengths are from the edge of the device
pins to the center of the component.
All passive components are size 0603 unless otherwise noted.
5
6
7
8
TLINP
ID=TL2
Z0=50 Ohm
L=600 mil
Eeff=3.16
Loss=0
F0=0 GHz
ID=C9
C=2 pF
The center of C9 should be
placed at silkscreen marker '12'
on the WJ evaluation board.
S21 vs Frequency
20
18
S 2 1 (d B )
S 1 1 (d B )
16
14
12
10
840
+25°C
+85°C
-40°C
860
880
900
920
940
0
-5
-10
-15
-20
-25
-30
-35
840
860
S11 vs. Frequency
0
-5
-10
S 2 2 (d B )
-15
-20
-25
-30
940
-35
840
S22 vs. Frequency
+25°C
+85°C
-40°C
880
900
920
+25°C
+85°C
-40°C
860
880
900
920
940
Frequency (MHz)
Frequency (MHz)
Frequency (MHz)
Noise Figure vs. Frequency
10
8
P 1 d B (d B m )
N F (d B )
6
4
2
0
840
+25°C
+80°C
-40°C
860
880
900
920
940
20
840
860
30
28
26
24
22
P1 dB vs. Frequency
-40
-45
-50
-55
-60
-65
-70
-75
-80
18
19
ACPR vs. Channel Power
IS-95, 9 Ch. Fwd, ±885KHz Meas BW, 900 MHz
+25°C
+85°C
-40°C
A C P R (d B m )
+25°C
+85°C
-40°C
20
21
22
23
24
880
900
920
940
Frequency (MHz)
Frequency (MHz)
Output Channel Power (dBm)
OIP3 vs. Temperature
freq. = 900, 901 MHz, +13 dBm /tone
OIP3 vs. Output Power
freq. = 900, 901 MHz, +25°C
OIP3 vs. Frequency
+25°, +13 dBm / tone
45
43
O I P 3 (d B m )
45
O IP 3 (d B m )
45
43
41
39
37
35
840
43
O IP 3 (d B m )
41
39
37
35
-40
-15
10
35
Temperature (°C)
60
85
41
39
37
35
8
10
12
14
16
18
20
Output Power (dBm)
860
880
900
920
940
Frequency (MHz)
Specifications and information are subject to change without notice
TriQuint Semiconductor Inc
•
Phone 1-503-615-9000
•
FAX: 503-615-8900
•
e-mail: info-sales@tqs.com
•
Web site: www.TriQuint.com
Page 3 of 4
July 2010
ECP052D
½ Watt, High Linearity InGaP HBT Amplifier
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
°C
reflow temperature) and leaded
(maximum 245
°C
reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper.
ECP052D-G Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an
“E052G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“ECP052D” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
E052G
ESD / MSL Information
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 2 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1.
2.
A heatsink underneath the area of the PCB for the mounted
device is recommended for proper thermal operation.
Damage to the device can occur without the use of one.
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
All dimensions are in millimeters (inches). Angles are in
degrees.
3.
4.
5.
6.
7.
8.
Specifications and information are subject to change without notice
TriQuint Semiconductor Inc
•
Phone 1-503-615-9000
•
FAX: 503-615-8900
•
e-mail: info-sales@tqs.com
•
Web site: www.TriQuint.com
Page 4 of 4
July 2010
京公网安备 11010802033920号
EEWORLD
