XS170 is a 350V, 100mA, 50Ω 1-Form-A relay with an
optocoupler in a single package. It provides an economi-
cal solution for cost sensitive applications.
Features
•
Small 8 Pin DIP Package
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
No Moving Parts
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
3750V
RMS
Input/Output Isolation
•
FCC Compatible
•
VDE Compatible
•
No EMI/RFI Generation
•
Machine Insertable, Wave Solderable
•
Surface Mount and Tape & Reel Versions Available
Approvals
•
UL Recognized: File Number E76270
•
CSA Certified: File Number LR 43639-10
•
BSI Certified to:
•
BS EN 60950:1992 (BS7002:1992)
Certificate #: 7344
•
BS EN 41003:1993
Certificate #: 7344
Ordering Information
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket Size)
•
Hookswitch
•
Dial Pulsing
•
Ground Start
•
Ringer Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment-Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Part #
XS170
XS170S
XS170STR
Description
8 Pin DIP (50/Tube)
8 Pin Surface Mount (50/Tube)
8 Pin Surface Mount (1000/Reel)
Pin Configuration
XS170 Pinout
+ LED - Relay
– LED - Relay
Collector - Phototransistor
Emitter - Phototransistor
1
2
3
4
8
7
6
5
Load - Relay (MOSFET Output)
Load - Relay (MOSFET Output)
LED - Phototransistor –/+
LED - Phototransistor +/–
DS-XS170-R1
www.clare.com
1
XS170
Absolute Maximum Ratings (@ 25˚ C)
Parameter
Input Power Dissipation
Input Control Current
Peak (10ms)
Reverse Input Voltage
Total Power Dissipation
Isolation Voltage
Input to Output
Operational Temperature
Storage Temperature
Soldering Temperature
DIP Package
Flatpack/Surface Mount
Package
(10 Seconds Max.)
1
2
Min
-
-
-
-
-
3750
-40
-40
-
-
Typ Max Units
- 150
1
mW
-
50
mA
-
1
A
-
5
V
- 800
2
mW
-
-
-
-
-
-
V
RMS
+85
°C
+125 °C
+260
+220
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses
in excess of these ratings can cause permanent damage
to the device. Functional operation of the device at these
or any other conditions beyond those indicated in the
operational sections of this data sheet is not implied.
Exposure of the device to the absolute maximum ratings
for an extended period may degrade the device and effect
its reliability.
Derate Linearly 1.33 mw/˚C
Derate Linearly 6.67 mw/˚C
Electrical Characteristics
Parameter
Relay Portion (Pins 7, 8)
Output Characteristics @ 25°C
Load Voltage (Peak)
Load Current (Continuous)
Peak Load Current
On-Resistance
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Load Current Limit
Relay Portion (Pins 1, 2)
Input Characteristics @ 25°C
Input Control Current
Input Dropout Current
Input Voltage Drop
Reverse Input Voltage
Reverse Input Current
Conditions
Symbol
Min
Typ
Max
Units
-
-
10ms
I
L
=120mA
V
L
=350V
I
F
=5mA, V
L
=10V
I
F
=5mA, V
L
=10V
50V; f=1MHz
V
L
I
L
I
LPK
R
ON
I
LEAK
T
ON
T
OFF
C
OUT
I
CL
-
-
-
-
-
-
-
-
-
-
-
-
33
-
-
-
25
-
350
100
350
50
1
5
5
-
-
V
mA
mA
Ω
µA
ms
ms
pF
mA
I
L
=120mA
-
I
F
=5mA
-
V
R
=5V
I
F
I
F
V
F
V
R
I
R
2
0.4
0.9
-
-
-
0.7
1.2
-
-
50
-
1.4
5
10
mA
mA
V
V
µA
2
www.clare.com
Rev. 1
XS170
Electrical Characteristics (Continued)
Parameter
Detector Portion (Pins 3, 4)
Output Characteristics @ 25°C
Phototransistor Blocking Voltage
Phototransistor Output Current
Saturation Voltage
Current Transfer Ratio
Detector Portion (Pins 5, 6)
Input Characteristics @ 25°C
Input Control Current
Input Voltage Drop
Input Current
(Detector must be off)
Input to Output Capacitance
(Relay Only)
Capacitance Input to Output
Input to Output Isolation
Conditions
Symbol
Min
Typ
Max
Units
I
C
=10µA
V
CE
=5V, I
F
=0mA
I
C
=2mA, I
F
=16mA
I
F
=6mA, V
CE
=0.5V
BV
CEO
I
CEO
V
SAT
CTR
20
-
-
33
50
50
0.3
100
-
500
0.5
-
V
nA
V
%
I
C
=2mA, V
CE
=0.5V
I
F
=5mA
I
C
=1µA, V
CE
=5V
I
F
V
F
I
F
6
0.9
5
2
1.2
25
100
1.4
-
mA
V
µA
-
-
-
C
I/O
-
V
I/O
-
-
3750
3
3
-
-
-
-
pF
pF
V
RMS
Rev. 1
www.clare.com
3
XS170
PERFORMANCE DATA*
35
30
Device Count (N)
25
20
15
10
5
0
XS170
Typical LED Forward Voltage Drop
(N=50 Ambient Temperature = 25°C)
I
F
= 5mADC
XS170
Typical On-Resistance Distribution
(N=50 Ambient Temperature = 25°C)
(Load Current = 100mADC)
25
20
15
10
5
0
25
20
15
10
5
0
29.09 29.86 30.63 31.40 32.16 32.93 33.70
On-Resistance (Ω)
XS170
Typical Blocking Voltage Distribution
(N=50 Ambient Temperature = 25°C)
Device Count (N)
Device Count (N)
1.17
1.19
1.21
1.23
1.25
424.0 429.3 434.5 439.7 444.9 450.1 455.4
Blocking Voltage (V)
LED Forward Voltage Drop (V)
XS170
Typical I
F
for Switch Operation
(N=50 Ambient Temperature = 25°C)
(Load Current = 100mADC)
25
20
15
10
5
0
0.44
0.50
0.56
0.62
0.69
0.75
0.81
LED Current (mA)
25
20
15
10
5
0
XS170
Typical I
F
for Switch Dropout
(N=50 Ambient Temperature = 25°C)
(Load Current = 100mADC)
25
20
15
10
5
0
0.44
0.50
0.56
0.62
0.69
0.75
0.81
XS170
Typical Turn-On Time
(N=50 Ambient Temperature = 25°C)
(Load Current = 100mADC)
Device Count (N)
Device Count (N)
Device Count (N)
0.67
0.75
0.83
0.91
0.99
1.06
1.14
LED Current (mA)
Turn-On (ms)
XS170
Typical Turn-Off Time
(N=50 Ambient Temperature = 25°C)
(Load Current = 100mADC)
25
Load Current (mA)
20
15
10
5
0
0.11
0.14
0.17
0.19
0.22
0.25
0.28
Turn-Off (ms)
160
140
Device Count (N)
120
100
80
60
40
20
0
XS170
Typical Load Current vs. Temperature
0.016
0.014
Leakage (µA)
0.012
0.010
0.008
0.006
0.004
0.002
0
-40
-20
0
20
40
60
80
100
120
-40
XS170
Typical Leakage vs. Temperature
(Measured across Pins 4 & 6)
10mA
5mA
2mA
-20
0
20
40
60
80
100
Temperature (°C)
Temperature (°C)
XS170
Typical Blocking Voltage
vs. Temperature
455
Blocking Voltage (V
RMS
)
450
Turn-On (ms)
445
440
435
430
425
420
-40
-20
0
20
40
60
80
100
Temperature (°C)
XS170
Typical Turn-On vs. Temperature
(Load Current = 100mADC)
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0
-40
-20
0
20
40
60
80
100 120
Temperature (°C)
10mA
20mA
Turn-Off (ms)
5mA
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-40
XS170
Typical Turn-Off vs. Temperature
(Load Current = 120mADC)
-20
0
20
40
60
80
100
120
Temperature (°C)
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact
our application department.
4
www.clare.com
Rev. 1
XS170
PERFORMANCE DATA*
XS170
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
1.6
Turn-On (ms)
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (°C)
XS170
Typical Turn-On vs. LED Forward Current
(Load Current = 100mADC)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
XS170
Typical Turn-Off vs. LED Forward Current
(Load Current = 120mADC)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
50mA
30mA
20mA
10mA
5mA
70
60
On-Resistance (Ω)
XS170
Typical On-Resistance vs. Temperature
(Load Current = 100mADC; I
F
= 5mADC)
XS170
Typical I
F
for Switch Operation
vs. Temperature
(Load Current = 100mADC)
6.0
5.0
LED Current (mA)
4.0
3.0
2.0
1.0
0
-40
-20
0
20
40
60
80
100 120
LED Current (mA)
6.0
5.0
4.0
3.0
2.0
1.0
0
-40
Turn-Off (ms)
XS170
Typical I
F
for Switch Dropout
vs. Temperature
(Load Current = 100mADC)
50
40
30
20
10
0
-40
-20
0
20
40
60
80
100 120
Temperature (°C)
-20
0
20
40
60
80
100 120
Temperature (°C)
Temperature (°C)
120
100
80
60
40
20
0
-20
-40
-60
-80
-100
-120
XS170
Typical Load Current vs. Load Voltage
(Ambient Temperature = 25°C)
I
F
= 5mADC
XS170
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10µs 100µs 1ms 10ms 100ms
Time
Normalized CTR (%)
XS170
Typical Normalized CTR vs. Forward Current
(V
CE
= 0.5V)
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Load Current (mA)
Load Current (A)
-4
-3
-2
-1
0
1
2
3
4
1s
10s 100s
0
2
4
6
8
10
12
14
16
18
20
Load Voltage (V)
I
F
(mA)
XS170
Typical Normalized CTR vs. Temperature
(V
CE
= 0.5V)
8
Normalized CTR (%)
7
6
I
C
(mA)
5
4
3
2
1
0
-40
-20
0
20
40
60
XS170
Typical Collector Current vs. Forward Current
(V
CE
= 0.5V)
12
10
8
6
4
2
0
0
2
4
6
8
10
12
14
16
18
20
1mA
2mA
5mA
10mA
15mA
20mA
80 100 120
Temperature (°C)
I
F
(mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact
I have made two kinds of boards. Now there are wireless development boards based on 51 single-chip microcomputers and wireless development boards based on MSP430 single-chip microcomputers. Now there ...
[size=4][color=#000000]In the compiler of IAR software 430, we can use its internal delay subroutine to achieve the high-precision software delay we want. The method is as follows: [/color][/size] [si...
[font=宋体][size=12pt]According to the latest Gartner survey, chip design outsourcing grew 20% in 2007. [/size][/font] [font=宋体][size=12pt] Since 2006, Gartner has been tracking and interviewing 62 comp...
Today I saw a chip from Beijing Junzheng on the Internet. It has powerful functions and supports wince. I searched and found that most of its applications are PMP, GPS and the like. I don't know how i...
Marvell today announced the Marvell 88EM8183 deep dimming single-stage AC/DC LED driver integrated circuit (IC). The 88EM8183 LED driver IC offers the industry’s broadest dimmer compatibility with the...
introduction
my country has a vast territory and a large population. The scale of housing construction is huge, and the amount of residential construction is large and wide. It is still on t...[Details]
As LEDs continue to improve in almost every aspect of performance and cost, LED lighting is being used in an increasingly wide range of applications, among which LED street lights are a focus of in...[Details]
To differentiate their products in a crowded and competitive market, manufacturers of handheld devices often consider battery life and power management as key selling points for cell phones, PDAs, ...[Details]
July 11, 2012, Beijing - Altera Corporation (NASDAQ: ALTR) today announced the launch of 40-Gbps Ethernet (40GbE) and 100-Gbps Ethernet (100GbE) intellectual property (IP) core products. These core...[Details]
In the previous series, we have listed some basic knowledge of C language in Tables 1 to 3. We hope that beginners can strengthen their memory of the above tables and gradually learn to use them wh...[Details]
In the single-chip microcomputer system, in addition to display devices, sound devices are often used, and the most common sound device is the buzzer. Buzzers are generally used for some low-demand...[Details]
D5026A is a driver IC designed by Shanghai Debei Electronics for energy-saving LED display screens. Its design concept is energy-saving and compatible with existing solutions, that is, it can be ...[Details]
introduction
At present, measuring instruments are developing towards networking, and each individual embedded instrument will become a node on the Internet. This system realizes the network...[Details]
Distributed Wireless Communication System (DWCS) uses distributed antennas, distributed processing control, joint signal processing and other technologies to improve the system's spectrum efficie...[Details]
For battery-powered portable devices, in addition to breaking through the limitations of processing power, the performance of portable system power supplies also needs to be continuously improved. ...[Details]
1. Tips for charging UPS for the first time
After purchasing a new UPS, plug the UPS into the 220V mains power grid and charge it for at least 12 hours to ensure that the battery is fully char...[Details]
The power consumption of a switching power supply includes fixed losses caused by parasitic resistances such as semiconductor switches, magnetic components, and wiring, as well as switching losses ...[Details]
introduction
Temperature and humidity are the main environmental parameters of industrial and agricultural production. It is of great significance to measure them accurately and timely. Using a s...[Details]
In some motion control systems with simple control or low cost requirements, stepper motors are often used as actuators. The biggest advantage of stepper motors in such applications is that they ca...[Details]
For a long time, my country has implemented "community-style collective heating" for hot water heating, and settled accounts based on the heating area, regardless of whether the user uses heat. Thi...[Details]