AYF32
FPC CONNECTORS
FOR FPC CONNECTION
FPC CONNECTORS
Y3F
(0.3 mm pitch) without FPC tabs
(Former Name: YF32)
3. Equipped with soldering terminals
for higher mounting strength
4. Easy-to-handle front lock structure
5. Wiring patterns can be located
underneath the connector.
6. Ni barrier with high resistance to
solder creep
FEATURES
1. Low-profile, space-saving design
(pitch: 0.3mm)
The 0.9mm height, 3.0mm depth
contributes to the miniaturization and
thickness reduction of target products.
* The total depth including the lever is 3.2mm.
17
APPLICATIONS
.35
co
nta
cts
)
3.0
2. Compatible with FPC without tabs,
allowing smooth FPC insertion
Compatible with without FPC tabs,
allowing smooth FPC insertion
(Y3FT is compatible with FPC with tabs.)
Compatible with FPC without tabs,
allowing smooth FPC insertion
Compliance with RoHS Directive
Soldering terminals (Metal clips)
resistant to twisting
ORDERING INFORMATION
AYF 3
32: FPC Connector 0.3 mm pitch
(Front lock, ZIF type without FPC tabs)
Number of contacts (2 digits)
Contact direction
1: Bottom contact
Surface treatment (Contact portion / Terminal portion)
5: Au plating/Au flash plating (Ni barrier)
2
1
5
0.9
(51
Compact mobile devices “Cellular
phones, Digital cameras and DVC, etc”
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AYF32
PRODUCT TYPES
Height
Number of contacts
15
17
23
25
27
0.9 mm
29
31
33
35
39
41
45
51
Part number
AYF321515
AYF321715
AYF322315
AYF322515
AYF322715
AYF322915
AYF323115
AYF323315
AYF323515
AYF323915
AYF324115
AYF324515
AYF325115
5,000 pieces
10,000 pieces
Packing
Inner carton
Outer carton
Notes: 1. Order unit;
For mass production: in 1-inner carton (1-reel) units
Samples for mounting check: in 50-connector units. Please contact our sales office.
2. Please contact are sales office for connectors having a number of contacts other than those listed above.
SPECIFICATIONS
1. Characteristics
Item
Rated current
Rated voltage
Insulation resistance
Breakdown voltage
Contact resistance
FPC holding force
Mechanical
characteristics
Contact holding force
Soldering terminal holding
force
Ambient temperature
Storage temperature
Specifications
0.2A/contact
50V AC/DC
Min. 1,000MΩ (initial)
150V AC for 1 min.
Max. 80mΩ
Min. 0.13N/contacts
×
contacts (initial)
Min. 0.2N/contacts
Min. 0.2N/contacts
–55°C to +85°C
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 80mΩ
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 80mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 80mΩ
48 hours,
contact resistance max. 80mΩ
Peak temperature: 260°C or less
300°C within 5 sec. 350°C within 3 sec.
30 times
51-contact type: 0.09 g
Conditions
Electrical
characteristics
Using 250V DC megger (applied for 1 min.)
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Based on the contact resistance measurement method
specified by JIS C 5402.
Measurement of the maximum force applied until the
inserted compatible FPC is pulled out in the insertion axis
direction while the connector lever is closed
Measuring the maximum force.
As the contact is axially pull out.
Measuring the maximum force.
As the soldering terminal is axially pull out.
No freezing at low temperatures. No dew condensation.
Sequence
0
1. –55
−3
°C,
30 minutes
2. ~ , Max. 5 minutes
3. 85
+3
°C,
30 minutes
0
4. ~ , Max. 5 minutes
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwater concentration 5±1%
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Reflow soldering
Soldering iron
Repeated insertion and removal: min. 10 sec./time
Thermal shock resistance
(with FPC inserted)
Environmental
characteristics
Humidity resistance
(with FPC inserted)
Saltwater spray resistance
(with FPC inserted)
H
2
S resistance
(with FPC inserted)
Soldering heat resistance
Lifetime
characteristics
Unit weight
Insertion and removal life
2. Material and surface treatment
Part name
Molded portion
Contact
Soldering terminal portion
Material
Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
Copper alloy
Copper alloy
Surface treatment
—
Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Base: Ni plating, Surface: Au plating
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AYF32
DIMENSIONS
(Unit: mm)
A
0.60±0.10 (Terminal pitch)
°
)
(140
1.12 (Suction area)
(1.50)
When the lever is opened
0.90±0.10
0.30±0.10 (Terminal pitch)
0.60±0.10 (Terminal pitch)
3.20
Terminal
coplanarity
0.1
(Contact and
soldering
terminal)
0.53
Number of contacts/
dimension
15
17
23
25
27
29
31
33
35
39
41
45
A
6.55
7.15
8.95
9.55
10.15
10.75
11.35
11.95
12.55
13.75
14.35
15.55
17.35
B
3.60
4.20
6.00
6.60
7.20
7.80
8.40
9.00
9.60
10.80
11.40
12.60
14.40
C
4.20
4.80
6.60
7.20
7.80
8.40
9.00
9.60
10.20
11.40
12.00
13.20
15.00
D
5.60
6.20
8.00
8.60
9.20
9.80
10.40
11.00
11.60
12.80
13.40
14.60
16.40
0.20
0.30
(2.07)
3.00
(FPC
insertion
depth)
D±0.20
C±0.20
(0.15)
(0.12)
B±0.20
0.30
(0.12)
51
RECOMMENDED FPC DIMENSIONS
(Finished thickness: t = 0.2±0.03)
The conductive parts should be based by Ni plating and then Au plating.
0.30±0.07
0.60±0.02
0.30±0.02
0.20 max.
R
0.
20
A±0.05
B±0.03
0.30
(Contact width)
(0.10)
2.20±0.30
(Exposed part of the conductor)
0.30±0.07
0.20±0.03
3.50 min.
(Reinforcing plate)
+0.04
–0.03
Number of contacts/
dimension
15
17
23
25
27
29
31
33
35
39
41
45
51
A
4.80
5.40
7.20
7.80
8.40
9.00
9.60
10.20
10.80
12.00
12.60
13.80
15.60
B
4.20
4.80
6.60
7.20
7.80
8.40
9.00
9.60
10.20
11.40
12.00
13.20
15.00
C
3.60
4.20
6.00
6.60
7.20
7.80
8.40
9.00
9.60
10.80
11.40
12.60
14.40
1.70±0.15
1.60±0.15
1.50±0.15
1.05±0.15
0.85±0.15
0.60±0.02
0.60±0.07
0.10 max.
0.20±0.02
0.20±0.02
0.30
+0.04
(Contact width)
–0.03
C±0.03
0.60±0.07
EMBOSSED TAPE DIMENSIONS
(Unit: mm) (Common for respective contact type)
• Specifications for taping
(In accordance with JIS C 0806-1990. However, not applied to
the mounting-hole pitch of some connectors.)
Tape I
di
a.
0. 1
0
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape II
di
a.
50
+
0.
Leading direction after packaging
A±0.30
A±0.30
50
+
0.
0. 1
0
(C±1)
Taping reel
Top cover tape
1.
(2.0)
(4.0)
(2.0)
(4.0)
1.
380 dia.
Embossed carrier tape
Embossed mounting-hole
8.0
8.0
(B)
28.40
(1.75)
(B)
(1.75)
• Dimension table
(Unit: mm)
Number of contacts
15 and 17 contacts
23 to 45 contacts
51 contacts
Type of taping
Tape I
Tape I
Tape II
A
16.0
24.0
32.0
B
7.5
11.5
14.2
C
17.4
25.4
33.4
Quantity per reel
5,000
5,000
5,000
panasonic-electric-works.net/ac
AYF32
• Connector orientation with respect to embossed tape feeding direction
Type
Direction
of tape progress
Y3F
NOTES
1. Recommended PC board and metal
mask patterns
Appropriate control of solder amount is
required to minimize solder bridges and
other defects for connectors with 0.3 mm,
0.4 mm or 0.5 mm pitch terminals, which
require high-density mounting. Refer to
the recommended PC board pattern.
Recommended PC board pattern
(Mount pad arrangement pattern)
0.50±0.03
Connector
outline
0.60±0.03
0.40
0.10±0.03
Exposed metal clip area
B±0.05
0.60±0.03
0.30±0.03
Terminal
0.45±0.03
0.70±0.03
0.70±0.03
0.30±0.03
0.60±0.03
C±0.05
D±0.05
Metal clip
2. Precautions for insertion/removal of
FPC
To open the lever, hold its center and turn
it up. A load applied to the lever unevenly
or on only one side may deform and
break the lever. Do not apply an
excessive load to the lever in the opening
direction; otherwise, the terminals may
be deformed. Don’t further apply an
excessive load to the fully opened lever;
otherwise, the lever may be deformed.
Fully open the lever to insert an FPC.
Since this product connects at the
bottom, please insert the FPC so that its
electrode plane is facing the board to
which it will be mounted. Do not insert the
FPC in the reverse direction of the
contact section; otherwise, operation
failures or malfunctions may be caused.
(140°)
Completely insert the FPC horizontally.
An FPC inserted at an excessive angle to
the board may cause the deformation of
metal parts, FPC insertion failures, and
FPC circuit breakages.
FPC
Number of contacts/
dimension
15
17
23
25
27
29
31
33
35
39
41
45
51
B
3.60
4.20
6.00
6.60
7.20
7.80
8.40
9.00
9.60
10.80
11.40
12.60
14.40
C
4.20
4.80
6.60
7.20
7.80
8.40
9.00
9.60
10.20
11.40
12.00
13.20
15.00
D
5.60
6.20
8.00
8.60
9.20
9.80
10.40
11.00
11.60
12.80
13.40
14.60
16.40
Insert the FPC to the full depth of the
connector without altering the angle.
When closing the lever, use the ball(s) of
your finger to push the entire lever or both
sides of it. Be careful. If pressure to the
lever is applied unevenly, such as to an
edge only, it may deform or break. Also,
make sure that the lever is closed
completely. Not doing so will cause a
faulty connection.
Avoid applying an excessive load to the
top of the lever during or after closing the
lever. Otherwise, the terminals may be
deformed.
Remove the FPC at parallel with the lever
fully opened. If the lever is closed, or if
the FPC is forcedly pulled, the molded
part may break.
After an FPC is inserted, carefully handle
it so as not to apply excessive stress to
the base of the FPC.
For other details, please verify with
the product specification sheets.
3.20±0.03
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FPC CONNECTORS COMMON CAUTIONS FOR USE
COMMON CAUTIONS FOR USE
PC board design
Design the recommended foot pattern in
order to secure the mechanical strength
in the soldered areas of the terminal.
FPC and equipment design
Design the FPC based on the
recommended dimensions to ensure the
required connector performance.
In addition, carefully check the equipment
design and take required measures for
the equipment to prevent the FPC from
being removed subsequent to a fall,
vibration, or other impact due to the FPC
size, weight, or the reaction force of the
routed FPC.
Connector mounting
In case the connector is picked up by
chucking during mounting, an excessive
mounter chucking force may deform the
molded or metal part of the connector.
Consult us in advance if chucking is to be
applied.
Soldering
1) Manual soldering.
• Due to the low profile, if an excessive
amount of solder is applied to this
product during manual soldering, the
solder may creep up to near the contact
points, or interference by solder may
cause imperfect contact.
• Make sure that the soldering iron tip is
heated within the temperature and time
limits indicated in the specifications.
• Flux from the solder wire may adhere to
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any flux before use.
• Be aware that a load applied to the
connector terminals while soldering may
displace the contact.
• Thoroughly clean the iron tip.
2) Reflow soldering
• Screen-printing is recommended for
printing paste solder.
Y3FT/Y3F/Y3B
To determine the relationship between
the screen opening area and the PC
board foot pattern area, refer to the
diagrams in the recommended
patterns for PC boards and metal
masks when setting.
Note that excess solder on the
terminals prevents complete insertion
of the FPC, and that excess solder on
the metal clips prevents the lever from
rotating.
Y5S
Note that excess solder inhibits the
slider lock operation.
Terminal
Paste solder
PC board foot pattern
• Screen thickness of 120µm is
recommended for paste solder printing.
• Consult us when using a screen-printing
thickness other than that recommended.
• Depending on the size of the connector
being used, self alignment may not be
possible. Accordingly, carefully position
the terminal with the PC board pattern.
• The recommended reflow temperature
profile is given in the figure below
Recommended reflow temperature
profile
Y3FT/Y3F/Y3B
Upper limit (Soldering heat resistance)
Lower limit (Solder wettability)
Temperature
260°C
230°C
180°C
150°C
60 to 120 sec.
Peak temperature
220°C
200°C
25 sec.
70 sec.
Preheating
Time
• When performing reflow soldering on
the back of the PC board after reflow
soldering the connector, secure the
connector using, for example, an
adhesive. (Double reflow soldering on the
same side is possible)
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use
a soldering iron with a flat tip. Do not add
flux, otherwise, the flux may creep to the
contact parts.
• Use a soldering iron whose tip
temperature is within the temperature
range specified in the specifications.
Do not drop the product or handle
carelessly. Otherwise, the terminals
may become deformed due to
excessive force or the solderability
during reflow soldering may degrade.
Don’t open/close the lever or insert/
remove an FPC until the connector is
soldered. Forcibly applied external
pressure on the terminals can weaken
the adherence of the terminals to the
molded part or cause the terminals to
lose their evenness. In addition, do
not insert an FPC into the connector
before soldering the connector.
When cutting or bending the PC
board after mounting the connector,
be careful that the soldered sections
are subjected to excessive forces.
Do not the soldered areas to be subjected to forces
Y5S
Temperature
250°C
200°C
180°C
150°C
Preheating
60 to 120 sec.
Min. 200°C,
70 sec.
Peak temperature
Time
Y5F
Temperature
260°C
200°C
180°C
150°C
Preheating
60 to 120 sec.
Min. 200°C,
70 sec.
Peak temperature
Other Notes
When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
The connectors are not meant to be used
for switching.
For other details, please verify with
the product specification sheets.
Time
• The temperature is measured on the
surface of the PC board near the
connector terminal.
• Some solder and flux types may cause
serious solder creeping. Take the solder
and flux characteristics into consideration
when setting the reflow soldering
conditions.
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