Features .................................................................................................................................................................. 1
Other Features ................................................................................................................................................... 6
OHCI Data Transfer ........................................................................................................................................... 8
OHCI Isochronous Data Transfer ...................................................................................................................... 8
Link Core.......................................................................................................................................................... 11
Pin Information ...................................................................................................................................................... 15
Vendor ID Register .......................................................................................................................................... 22
Device ID Register ........................................................................................................................................... 22
PCI Status Register ......................................................................................................................................... 24
Class Code and Revision ID Registers ............................................................................................................ 25
Latency Timer and Cache Line Size Register.................................................................................................. 25
Header Type and BIST Register ...................................................................................................................... 26
OHCI Base Address Register .......................................................................................................................... 26
PCI Power Management Capabilities Pointer Register.................................................................................... 27
Interrupt Line and Pin Register ........................................................................................................................ 28
MIN_GNT and MAX_LAT Register .................................................................................................................. 28
PCI OHCI Control Register .............................................................................................................................. 29
Capability ID and Next Item Pointer Register .................................................................................................. 29
Power Management Capabilities Register ....................................................................................................... 30
Power Management Control and Status Register............................................................................................ 31
Power Management CSR PCI-to-PCI Bridge Support Extensions .................................................................. 32
Power Management Data ................................................................................................................................ 32
OHCI Version Register .................................................................................................................................... 36
GUID ROM Register ........................................................................................................................................ 37
CSR Data Register .......................................................................................................................................... 38
CSR Control Register ...................................................................................................................................... 38
Configuration ROM Header Register ............................................................................................................... 39
Bus Identification Register ............................................................................................................................... 40
Bus Options Register ....................................................................................................................................... 40
GUID High Register ......................................................................................................................................... 41
Posted Write Address High Register ............................................................................................................... 43
Vendor ID Register .......................................................................................................................................... 43
Host Controller Control Register ...................................................................................................................... 44
Fairness Control Register ................................................................................................................................ 55
Link Control Register........................................................................................................................................ 56
Isochronous DMA Control ................................................................................................................................ 68
Link Options ..................................................................................................................................................... 70
Serial EEPROM Interface ...................................................................................................................................... 78
ac Characteristics of Serial EEPROM Interface Signals ....................................................................................... 78
Solder Reflow and Handling .................................................................................................................................. 81
Absolute Maximum Voltage/Temperature Ratings ................................................................................................ 81
Ordering Information .............................................................................................................................................. 85
Table 44. Fairness Control Register Description ................................................................................................... 55
Table 45. Link Control Register Description ......................................................................................................... 56
[align=center]Spending a summer vacation lazily is to accumulate energy for the struggle of the new semester! [/align][align=center](Well, it’s not that we are lazy, we won’t admit it even if we are l...
[i=s]This post was last edited by weizhongc on 2015-11-17 18:04[/i] I saw this on the amo forum, thanks for sharing. I saw this blood glucose meter for only 5.6 yuan before, but I didn't buy it. Today...
CH579M provides 4 independent UARTs. By making good use of this resource, a small MCU can build a powerful system.
Here we use one of them to serially control the MP3 player module.
Since the baud rat...
They are all good ones taken from normally used machines. You can find the information yourself. 3 pieces for only 500 yuan. I don’t even have enough money for the chips. It’s worth the money if you u...
On August 24th, Jin Yuzhi, CEO of Huawei's Intelligent Automotive Solutions BU, announced the first automotive application of Huawei Qiankun's unique Limera technology. This technology eliminates t...[Details]
Abstract:
With the increasing complexity of smart vehicle electrical and electronic architectures, the full lifecycle management of vehicle electronic control components faces multiple challe...[Details]
The mass production process of the new generation of cockpit platform has started, and the smart cockpit market has entered a new bonus cycle of technology iteration and platform upgrade.
...[Details]
New energy pure electric vehicles generally accelerate faster than comparable fuel-powered vehicles, both from a standing start and while accelerating. Many believe this is simply due to the motor'...[Details]
On August 25th, SK Hynix announced that it has completed development and entered mass production of its 321-layer, 2Tb QLC NAND flash memory product. This achievement marks the world's first applic...[Details]
Amidst the wave of intelligent automotive transformation, advanced driver assistance is gradually emerging from cutting-edge technology into the mainstream, becoming a new frontier of industry comp...[Details]
Based on a survey of more than ten intelligent robot companies, this article sorts out and analyzes the current development status of the intelligent industry and the challenges and differences it ...[Details]
Electric vehicles are now widespread, but they've brought with them a host of problems, the most prominent of which is charging. Small electric vehicles (EVs) are a new form of transportation in a ...[Details]
Charging is a familiar process for new energy vehicles, and as a source of battery energy, charging piles are crucial. New energy vehicle charging can be divided into fast charging and slow chargin...[Details]
Learned the following information.
Customer product: industrial computer motherboard
Glue application area: CPU/BGA filling
Glue color requirements: black or t...[Details]
A multilevel inverter converts a DC signal into a multilevel staircase waveform. Instead of a straight positive-negative output waveform, the output waveform of a multilevel inverter alternates in ...[Details]
During daily operation of an R-type power transformer, the voltage used varies as the equipment being used adjusts. This raises the question: can the transformer change voltage at this point? The a...[Details]
On August 22, the Wall Street Journal reported on the 21st local time that the new US government does not plan to acquire equity in semiconductor wafer foundry giant TSMC and Micron, one of the thr...[Details]
According to Nikkei, a survey found that global electric vehicle battery supply is expected to reach more than three times the required quantity due to
cooling
demand for electric vehicles,...[Details]
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Office (USPTO) for a patent for a door anti-collision system that may be used in future Ford vehicl...[Details]