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W24100: Description128k X 8 cmos static ram; File Size169KB，11 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W24100 Overview

128k X 8 cmos static ram

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Preliminary W24100

128K

8 CMOS STATIC RAM

GENERAL DESCRIPTION

The W24100 is a normal-speed, very low-power CMOS static RAM organized as 131072

8 bits that

operates on a single 5-volt power supply. This device is manufactured using Winbond's high

performance CMOS technology.

FEATURES

•

Low power consumption:

−

Active: 385 mW (max.)

Access time: 70 nS

Single 5V power supply

Fully static operation

All inputs and outputs directly TTL compatible

Three-state outputs

•

Battery back-up operation capability

Data retention voltage: 2V (min.)

Packaged in 32-pin 600 mil DIP, 450 mil SOP,

standard type one TSOP (8 mm

20 mm) and

small type one TSOP (8 mm

13.4 mm)

PIN CONFIGURATIONS

BLOCK DIAGRAM

CLK GEN.

A16

PRECHARGE CKT.

A16

A14

A12

I/O1

I/O2

I/O3

A15

CS2

A13

A11

A10

CS1

I/O 8

I/O 7

I/O 6

I/O5

I/O4

A14

A12

I/O1

I/O8

DATA

CNTRL.

CLK

GEN.

CS1

CS2

A15 A13 A8 A1 A0 A11A10

I/O CKT.

COLUMN DECODER

CORE CELL ARRAY

1024 ROWS

128 X 8 COLUMNS

32-pin

SOP

PIN DESCRIPTION

SYMBOL

A0−A16

I/O1−I/O8

CS1, CS2

DESCRIPTION

Address Inputs

Data Inputs/Outputs

Chip Select Input

Write Enable Input

Output Enable Input

Power Supply

Ground

No Connection

A11

A13

CS2

A15

A16

A14

A12

32-pin

TSOP

A10

CS1

I/O8

I/O7

I/O6

I/O5

I/O4

I/O3

I/O2

I/O1

-1-

Publication Release Date: October 1999

Revision A1

W24100 Related Products

	W24100	W24100-70LL	W24100S-70LL	W24100T-70LL	W24100T-70L	W24100Q-70L	W24100Q-70LL	W24100-70L	W24100S-70L
Description	128k X 8 cmos static ram	128k X 8 cmos static ram	128k X 8 cmos static ram	128k X 8 cmos static ram	128k X 8 cmos static ram	128k X 8 cmos static ram	128k X 8 cmos static ram	128k X 8 cmos static ram	128k X 8 cmos static ram
Maker	-	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	-	-	Winbond Electronics Corporation	Winbond Electronics Corporation
Parts packaging code	-	DIP	SOIC	TSOP1	TSOP1	TSOP1	TSOP1	DIP	SOIC
package instruction	-	DIP, DIP32,.6	SOP, SOP32,.56	TSOP1, TSSOP32,.8,20	TSOP1, TSSOP32,.8,20	TSOP1, TSSOP32,.56,20	TSOP1, TSSOP32,.56,20	DIP, DIP32,.6	SOP, SOP32,.56
Contacts	-	32	32	32	32	32	32	32	32
Reach Compliance Code	-	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow
ECCN code	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	-	70 ns	70 ns	70 ns	70 ns	70 ns	70 ns	70 ns	70 ns
I/O type	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	-	R-PDIP-T32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDIP-T32	R-PDSO-G32
JESD-609 code	-	e3	e3	e3	e3	e3	e3	e3	e3
length	-	41.91 mm	20.45 mm	18.4 mm	18.4 mm	11.8 mm	11.8 mm	41.91 mm	20.45 mm
memory density	-	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi
Memory IC Type	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	-	8	8	8	8	8	8	8	8
Number of functions	-	1	1	1	1	1	1	1	1
Number of terminals	-	32	32	32	32	32	32	32	32
word count	-	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	-	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	-	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	-	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Output characteristics	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	DIP	SOP	TSOP1	TSOP1	TSOP1	TSOP1	DIP	SOP
Encapsulate equivalent code	-	DIP32,.6	SOP32,.56	TSSOP32,.8,20	TSSOP32,.8,20	TSSOP32,.56,20	TSSOP32,.56,20	DIP32,.6	SOP32,.56
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	IN-LINE	SMALL OUTLINE
Parallel/Serial	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	-	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	5.33 mm	3 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	5.33 mm	3 mm
Minimum standby current	-	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
Maximum slew rate	-	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA
Maximum supply voltage (Vsup)	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	-	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	-	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	-	NO	YES	YES	YES	YES	YES	NO	YES
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	-	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN
Terminal form	-	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	-	2.54 mm	1.27 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	2.54 mm	1.27 mm
Terminal location	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	-	15.24 mm	11.3 mm	8 mm	8 mm	8 mm	8 mm	15.24 mm	11.3 mm

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