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W24100-70LL

Description
128k X 8 cmos static ram
Categorystorage    storage   
File Size169KB,11 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
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W24100-70LL Overview

128k X 8 cmos static ram

W24100-70LL Parametric

Parameter NameAttribute value
MakerWinbond Electronics Corporation
Parts packaging codeDIP
package instructionDIP, DIP32,.6
Contacts32
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time70 ns
I/O typeCOMMON
JESD-30 codeR-PDIP-T32
JESD-609 codee3
length41.91 mm
memory density1048576 bi
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum seat height5.33 mm
Minimum standby current2 V
Maximum slew rate0.07 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMATTE TIN
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
Preliminary W24100
128K
×
8 CMOS STATIC RAM
GENERAL DESCRIPTION
The W24100 is a normal-speed, very low-power CMOS static RAM organized as 131072
×
8 bits that
operates on a single 5-volt power supply. This device is manufactured using Winbond's high
performance CMOS technology.
FEATURES
Low power consumption:
Active: 385 mW (max.)
Access time: 70 nS
Single 5V power supply
Fully static operation
All inputs and outputs directly TTL compatible
Three-state outputs
Battery back-up operation capability
Data retention voltage: 2V (min.)
Packaged in 32-pin 600 mil DIP, 450 mil SOP,
standard type one TSOP (8 mm
×
20 mm) and
small type one TSOP (8 mm
×
13.4 mm)
PIN CONFIGURATIONS
BLOCK DIAGRAM
CLK GEN.
A16
PRECHARGE CKT.
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O1
I/O2
I/O3
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
V
DD
A15
CS2
WE
A13
A8
A9
A11
OE
A10
CS1
I/O 8
I/O 7
I/O 6
I/O5
I/O4
A14
A12
A4
A3
A2
A7
A6
A5
A9
I/O1
:
I/O8
DATA
CNTRL.
CLK
GEN.
WE
CS1
CS2
OE
A15 A13 A8 A1 A0 A11A10
I/O CKT.
COLUMN DECODER
D
E
C
O
D
E
R
R
O
W
CORE CELL ARRAY
1024 ROWS
128 X 8 COLUMNS
32-pin
SOP
25
24
23
22
21
20
19
18
17
PIN DESCRIPTION
SYMBOL
A0−A16
I/O1−I/O8
CS1, CS2
WE
OE
V
DD
V
SS
NC
DESCRIPTION
Address Inputs
Data Inputs/Outputs
Chip Select Input
Write Enable Input
Output Enable Input
Power Supply
Ground
No Connection
A11
A9
A8
A13
WE
CS2
A15
V
DD
NC
A16
A14
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32-pin
TSOP
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CS1
I/O8
I/O7
I/O6
I/O5
I/O4
V
SS
I/O3
I/O2
I/O1
A0
A1
A2
A3
-1-
Publication Release Date: October 1999
Revision A1

W24100-70LL Related Products

W24100-70LL W24100 W24100S-70LL W24100T-70LL W24100T-70L W24100Q-70L W24100Q-70LL W24100-70L W24100S-70L
Description 128k X 8 cmos static ram 128k X 8 cmos static ram 128k X 8 cmos static ram 128k X 8 cmos static ram 128k X 8 cmos static ram 128k X 8 cmos static ram 128k X 8 cmos static ram 128k X 8 cmos static ram 128k X 8 cmos static ram
Maker Winbond Electronics Corporation - Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation - - Winbond Electronics Corporation Winbond Electronics Corporation
Parts packaging code DIP - SOIC TSOP1 TSOP1 TSOP1 TSOP1 DIP SOIC
package instruction DIP, DIP32,.6 - SOP, SOP32,.56 TSOP1, TSSOP32,.8,20 TSOP1, TSSOP32,.8,20 TSOP1, TSSOP32,.56,20 TSOP1, TSSOP32,.56,20 DIP, DIP32,.6 SOP, SOP32,.56
Contacts 32 - 32 32 32 32 32 32 32
Reach Compliance Code unknow - unknow unknow unknow unknow unknow unknow unknow
ECCN code EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 70 ns - 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns
I/O type COMMON - COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDIP-T32 - R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDIP-T32 R-PDSO-G32
JESD-609 code e3 - e3 e3 e3 e3 e3 e3 e3
length 41.91 mm - 20.45 mm 18.4 mm 18.4 mm 11.8 mm 11.8 mm 41.91 mm 20.45 mm
memory density 1048576 bi - 1048576 bi 1048576 bi 1048576 bi 1048576 bi 1048576 bi 1048576 bi 1048576 bi
Memory IC Type STANDARD SRAM - STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 - 8 8 8 8 8 8 8
Number of functions 1 - 1 1 1 1 1 1 1
Number of terminals 32 - 32 32 32 32 32 32 32
word count 131072 words - 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 - 128000 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C - 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 128KX8 - 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
Output characteristics 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP - SOP TSOP1 TSOP1 TSOP1 TSOP1 DIP SOP
Encapsulate equivalent code DIP32,.6 - SOP32,.56 TSSOP32,.8,20 TSSOP32,.8,20 TSSOP32,.56,20 TSSOP32,.56,20 DIP32,.6 SOP32,.56
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V - 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.33 mm - 3 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 5.33 mm 3 mm
Minimum standby current 2 V - 2 V 2 V 2 V 2 V 2 V 2 V 2 V
Maximum slew rate 0.07 mA - 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA
Maximum supply voltage (Vsup) 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V - 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V - 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO - YES YES YES YES YES NO YES
technology CMOS - CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL - COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface MATTE TIN - MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN MATTE TIN
Terminal form THROUGH-HOLE - GULL WING GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm - 1.27 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 2.54 mm 1.27 mm
Terminal location DUAL - DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 15.24 mm - 11.3 mm 8 mm 8 mm 8 mm 8 mm 15.24 mm 11.3 mm
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