EEWORLDEEWORLDEEWORLD

Part Number

Search

B0202GA-02-4120-C

Description
Fixed Resistor, Thin Film, 0.25W, 412ohm, 100V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP
CategoryPassive components    The resistor   
File Size381KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

B0202GA-02-4120-C Overview

Fixed Resistor, Thin Film, 0.25W, 412ohm, 100V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP

B0202GA-02-4120-C Parametric

Parameter NameAttribute value
Objectid1579387377
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance412 Ω
Resistor typeFIXED RESISTOR
size code0202
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal shapeONE SURFACE
Tolerance0.25%
Operating Voltage100 V
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
Water lamp problem
I use the C port of PIC microcontroller to connect the light and the D port to the switch. How should I design the program to display the running lights? When the switch is pressed, the light starts f...
sunsyh888 Microchip MCU
Core power supply problem of s3c2440
The datasheet of s3c2440 says that the core power supply is related to the main frequency, but it only says what core power supply should be used for 400m and 300m. If I use 320m main frequency, what ...
春暖花开 Embedded System
Teach you how to implement J-Link batch programming through batch commands
background When you want to use J-Link BASE to burn multiple chips, it is too troublesome to use the command line to burn them step by step. We can use a batch command mode to burn them, which can gre...
MamoYU Real-time operating system RTOS
LPC54102 development platform construction
[i=s]This post was last edited by fyaocn on 2015-4-1 15:47[/i] 1. I received the board a week ago and just figured out the situation. This Xpresso is not the same as the xPresso. Although the material...
fyaocn NXP MCU
Car diagnostics in vernacular
[i=s]This post was last edited by 5525 on 2016-6-9 21:28[/i] [color=#00ff][b][size=4]Onboard Diagnostics[/size][/b][/color] [color=#00ff][b][size=4] [/size][/b][/color] People get sick. When they get ...
5525 Automotive Electronics
Looking for the CD data of Feiling OK335xS-Ⅱ
I'm looking for the CD information of Feiling OK335xS-Ⅱ. I don't know if anyone in the forum has bought it. Can you share the CD?...
ou513 DSP and ARM Processors

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2401  977  1622  324  2500  49  20  33  7  51 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号