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574502B00000

Description
Heat Sink, Foldedback, Aluminum, Black Anodized,
CategoryThermal management products    Heat resisting bracing   
File Size250KB,5 Pages
ManufacturerBoyd Corporation
Download Datasheet Parametric View All

574502B00000 Overview

Heat Sink, Foldedback, Aluminum, Black Anodized,

574502B00000 Parametric

Parameter NameAttribute value
Objectid145144788224
Reach Compliance Codeunknown
YTEOL2
Main materialALUMINUM
colorBLACK
Device is onTRANSISTOR
fin directionFOLDEDBACK
Surface layerBLACK ANODIZED
high0.75 mm
length0.86 mm
Heat Resistant Support Device TypeHEAT SINK
width0.395 mm
TO-220 Heat Sinks
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
5744, 5745, 5746, 5749
Low cost, labor saving, slide on heat sink featuring spring action
FIGURE A
21.08
(0.830)
HOLDING TABS
3.18
(0.125)
9.02
(0.355)
21.84
(0.860)
DITTIN
ø 3.81
(0.150)
4.19
(0.165)
DITTIN
FIGURE B
HOLDING TABS
9.02
(0.355)
21.84
(0.860)
Low cost, labor saving, slide on
heat sink features spring action
to firmly hold the device tab to the
heat sink providing maximum
metal to metal contact and good
thermal conduction. Available with
solderable tabs for horizontal or
vertical mounting to the PC board.
10.03
(0.395)
14.99
11.81 (0.590)
(0.465)
1.57
(0.062)
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
"A"
"A"
14.99
(0.590)
11.81
(0.465)
9.52
(0.375)
9.52
(0.375)
20.57
(0.810)
10.03
(0.395)
1.57
(0.062)
5.33
(0.210)
0
Mounting Surface Temp
Rise Above Ambient—°C
Air Velocity—Feet Per Minute
400
200
600
800
ORDERING INFORMATION
Part Number
574402B00000
574402B03200
574502B00000
574502B03300
574602B00000
574602B03300
574902B00000
574902B03300
Description
Low cost slide on heat sink
With solderable tabs for horizontal mounting
Low cost slide on heat sink
With solderable tabs for vertical mounting
Low cost slide on heat sink
With solderable tabs for vertical mounting
Low cost slide on heat sink
With solderable tabs for vertical mounting
Figure
A
A
B
B
B
B
B
B
“A” Dim
19.05 (0.750)
19.05 (0.750)
19.05 (0.750)
19.05 (0.750)
17.53 (0.690)
17.53 (0.690)
34.92 (1.375)
34.92 (1.375)
Dia of PCB
Plated Thru
Hole for Tabs
80
60
40
20
0
0
1
2
3
4
Heat Dissipated—Watts
Air Velocity—Feet Per Minute
400
600
800
5
16
12
8
4
0
1.91 (0.075)
1.91 (0.075)
574402
574502
1.91 (0.075)
For additional options see page 82
80
60
40
20
0
0
1
2
3
4
Heat Dissipated—Watts
5
16
12
8
4
0
574602
574902
5741
Low cost, labor saving, slide on heat sink featuring spring action
Air Velocity—Feet Per Minute
400
200
600
800
Mounting
Kits
page 99
0
100
Mounting Surface Temp
Rise Above Ambient—°C
80
60
40
20
0
0
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
1000
20
16
12
8
4
0
9.02
(0.355)
21.84
(0.860)
ø 3.81
(0.150)
THRU
14.99
11.81
(0.590)
(0.465)
20.57
(0.810)
19.05
(0.750)
7.62
(0.300)
CLEARANCE
Low cost, labor saving, slide on heat sink
features spring action
to firmly hold the
device tab to the heat sink providing maxi-
mum metal to metal contact and good thermal
conduction. Includes a clearance hole in the
top side to allow the use of optional hardware
to attach device and heat sink to circuit board
or other surface. Also available with solderable
tabs for vertical mounting to the PC board.
ORDERING INFORMATION
Part Number
574102B00000
574102B03300
Description
Low cost slide on heat sink
With solderable tabs
1.91 (0.075)
Dia of PCB
Plated Thru
Hole for Tabs
DITTIN
1
2
3
4
Heat Dissipated—Watts
5
9.52
(0.375)
5.33
(0.210)
10.03
(0.395)
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
1.57
(0.062)
POPULAR OPTIONS:
574102B0 00 00
Base part no.
Position
A
Code
37
Description
Solderable tab with step to limit insertion depth
A
Details
Page 92
For additional options see page 82
AMERICA
EUROPE
www.aavidthermalloy.com
USA
Tel: +1 (603) 224-9988 email: info@aavid.com
Italy
Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom
Tel: +44 1793 401400 email: sales.uk@aavid.com
ASIA
Singapore
Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan
Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
1.91 (0.075)
Mounting Surface Temp
Rise Above Ambient—°C
0
100
200
1000
20
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
100
1000
20
45
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