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M-1206M2004JGBS

Description
Fixed Resistor, Metal Glaze/thick Film, 0.33W, 2000000ohm, 100V, 5% +/-Tol, -300,300ppm/Cel, 1206
CategoryPassive components    The resistor   
File Size108KB,5 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

M-1206M2004JGBS Overview

Fixed Resistor, Metal Glaze/thick Film, 0.33W, 2000000ohm, 100V, 5% +/-Tol, -300,300ppm/Cel, 1206

M-1206M2004JGBS Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid7063635324
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginIsrael
ECCN codeEAR99
YTEOL7.65
Other featuresANTI-SULFUR, LASER TRIMMABLE, MIL-PRF-55342
structureRectangular
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-65 °C
Package height0.84 mm
Package length3.2 mm
Package formSMT
Package width1.6 mm
method of packingBULK
Rated power dissipation(P)0.33 W
Rated temperature70 °C
resistance2000000 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient300 ppm/°C
Terminal shapeWRAPAROUND
Tolerance5%
Operating Voltage100 V
M
www.vishay.com
Vishay Dale Thin Film
High Reliability Thick Film Resistor,
Surface-Mount Chip
FEATURES
• High purity alumina substrate for high power
dissipation (2 W max.)
Available
Actual
Size
0502
Utilizing proven expertise in thick and thin film resistors to
satisfy your manufacturing needs, Vishay provides a high rel
chip with the same reliability and stability found in military
grade resistors. These chips are available in the widest
range of sizes, values, and performance characteristics. And
manufactured on the MIL-PRF-55342 qualified controlled
production line. All product is 100 % electrical tested for
tolerance and after thermal shock testing and typically meet
the requirements of group A in MIL-PRF-55342
performance.
• Wraparound terminations featuring a thin film
adhesion layer covered with a leach resistant
nickel barrier layer for +150 °C operating
conditions
• High speed laser trimming for high volume
requirements
• Ruthenium based cermet
dependable performance
• Fired-on glass passivation
thick
film
for
Available
Available
Available
• Tape and reel packaging standard; static-free waffle pack
available
• Active trim and 0
chips
• Sulfur resistant (per ASTM B809-95 humid vapor test)
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
CONSTRUCTION
Resistor
Overglaze
Alumina
Substrate
Inner Electrode
Nickel Barrier
Plated
Solder
TYPICAL PERFORMANCE
ABSOLUTE
TCR
TOL.
100
1
STANDARD ELECTRICAL SPECIFICATIONS
TEST
Material
Resistance Range
TCR: Absolute
Tolerance: Absolute
Stability: Absolute
Stability: Ratio
Voltage Coefficient
Working Voltage
Operating Temperature Range
Storage Temperature Range
Noise
Shelf Life Stability: Absolute
SPECIFICATIONS
Ruthenium
1
to 25 M
± 100 ppm/°C to ± 300 ppm/°C
± 0.5 % to ± 10 %
R
± 0.15 %
-
-
30 V to 200 V
-65 °C to +155 °C
-65 °C to +155 °C
< -35 dB (typical)
-
CONDITIONS
-
-
-55 °C to +125 °C
-
-
-
-
-
-
-
-
-
Revision: 21-Apr-2021
Document Number: 60031
1
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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