BZT52C2V0S - BZT52C39S
SURFACE MOUNT ZENER DIODE
Features
•
•
•
•
•
•
Planar Die Construction
Small Surface Mount Package
Ideally Suited for Automated Assembly Processes
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Notes 3 & 4)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
•
•
•
•
•
•
Case: SOD323
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band
Weight: 0.0049 grams (approximate)
SOD323
Top View
Ordering Information
(Note 5)
Part Number
(Type Number)-7-F*
(Type Number)Q-7-F*
Notes:
Qualification
Commercial
Automotive
Case
SOD323
SOD323
Packaging
3000/Tape & Reel
3000/Tape & Reel
*Add “-7-F” to the appropriate type number in Electrical Characteristics Table, example: 6.2V Zener – BZT52C6V2S-7-F.
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
5. For packaging details, go to our website at http://www.diodes.com.
Marking Information
XX
xx = Product Type Marking Code
(See Electrical Characteristics Table)
BZT52C2V0S - BZT52C39S
Document number: DS30093 Rev. 18 - 2
1 of 4
www.diodes.com
May 2012
© Diodes Incorporated
BZT52C2V0S - BZT52C39S
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Forward Voltage (Note 6)
@ I
F
= 10mA
Symbol
V
F
Value
0.9
Unit
V
Thermal Characteristics
Characteristic
Power Dissipation (Note 7)
Thermal Resistance, Junction to Ambient Air (Note 7)
Operating and Storage Temperature Range
Symbol
P
D
R
θ
JA
T
J
,
T
STG
Value
200
625
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Marking
Code
Zener Voltage
Range (Note 4)
V
Z
@ I
ZT
Nom (V) Min (V)
2.0
1.91
2.4
2.20
2.7
2.5
3.0
2.8
3.3
3.1
3.6
3.4
3.9
3.7
4.3
4.0
4.7
4.4
5.1
4.8
5.6
5.2
6.2
5.8
6.8
6.4
7.5
7.0
8.2
7.7
9.1
8.5
10
9.4
11
10.4
12
11.4
13
12.4
15
13.8
16
15.3
18
16.8
20
18.8
22
20.8
24
22.8
27
25.1
30
28.0
33
31.0
36
34.0
39
37.0
Max (V)
2.09
2.60
2.9
3.2
3.5
3.8
4.1
4.6
5.0
5.4
6.0
6.6
7.2
7.9
8.7
9.6
10.6
11.6
12.7
14.1
15.6
17.1
19.1
21.2
23.3
25.6
28.9
32.0
35.0
38.0
41.0
I
ZT
(mA)
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
2
2
2
2
2
Maximum Zener Impedance
f = 1kHz
Z
ZT
@ I
ZT
Ω
100
100
100
95
95
90
90
90
80
60
40
10
15
15
15
15
20
20
25
30
30
40
45
55
55
70
80
80
80
90
130
600
600
600
600
600
600
600
600
500
480
400
150
80
80
80
100
150
150
150
170
200
200
225
225
250
250
300
300
325
350
350
Z
ZK
@ I
ZK
I
ZK
mA
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.5
0.5
0.5
0.5
0.5
Maximum
Reverse Current
(Note 6)
I
R
uA
150
50
20
10
5
5
3
3
2
1
3
2
1
0.7
0.5
0.2
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
@ V
R
V
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
2.0
4.0
4.0
5.0
5.0
6.0
7.0
8.0
8.0
8.0
10.5
11.2
12.6
14.0
15.4
16.8
18.9
21.0
23.1
25.2
27.3
Temperature
Coefficient of
Zener Voltage
@
I
ZT =
5mA
mV/°C
Min
Max
-3.5
0
-3.5
0
-3.5
0
-3.5
0
-3.5
0
-3.5
0
-3.5
0
-3.5
0
-3.5
0.2
-2.7
1.2
-2.0
2.5
0.4
3.7
1.2
4.5
2.5
5.3
3.2
6.2
3.8
7.0
4.5
8.0
5.4
9.0
6.0
10.0
7.0
11.0
9.2
13.0
10.4
14.0
12.4
16.0
14.4
18.0
16.4
20.0
18.4
-
21.4
-
24.4
-
27.4
-
30.4
-
33.4
-
Type Number
BZT52C2V0S
BZT52C2V4S
BZT52C2V7S
BZT52C3V0S
BZT52C3V3S
BZT52C3V6S
BZT52C3V9S
BZT52C4V3S
BZT52C4V7S
BZT52C5V1S
BZT52C5V6S
BZT52C6V2S
BZT52C6V8S
BZT52C7V5S
BZT52C8V2S
BZT52C9V1S
BZT52C10S
BZT52C11S
BZT52C12S
BZT52C13S
BZT52C15S
BZT52C16S
BZT52C18S
BZT52C20S
BZT52C22S
BZT52C24S
BZT52C27S
BZT52C30S
BZT52C33S
BZT52C36S
BZT52C39S
Notes:
WY
WX
W1
W2
W3
W4
W5
W6
W7
W8
W9
WA
WB
WC
WD
WE
WF
WG
WH
WI
WJ
WK
WL
WM
WN
WO
WP
WQ
WR
WS
WT
6. Short duration pulse test used to minimize self-heating effect.
7. Part mounted on FR-4 PC board with recommended pad layout, as per http://www.diodes.com.
BZT52C2V0S - BZT52C39S
Document number: DS30093 Rev. 18 - 2
2 of 4
www.diodes.com
May 2012
© Diodes Incorporated
BZT52C2V0S - BZT52C39S
300
Note 7
50
T
J
= 25°C
C2V7
C2V0
C3V9
C5V6
C6V8
C3V3
C4V7
P
D
, POWER DISSIPATION (mW)
40
I
Z
, ZENER CURRENT (mA)
C8V2
200
30
20
Test Current I
Z
5.0mA
100
10
0
0
160
120
40
80
T
A
, AMBIENT TEMPERATURE, °C
Fig. 1 Power Derating Curve
T
J
= 25°C
C10
C12
200
0
0
3
4
5
6
8
9 10
7
V
Z
, ZENER VOLTAGE (V)
Fig. 2 Typical Zener Breakdown Characteristics
1
2
30
1,000
T
J
= 25 °C
C
T
, TOTAL CAPACITANCE (pF)
V
R
= 1V
V
R
= 2V
I
Z
, ZENER CURRENT (mA)
20
C15
C18
100
V
R
= 1V
10
Test current I
Z
5mA
C22
C27
C33
C39
C36
V
R
= 2V
0
0
10
20
30
40
V
Z
, ZENER VOLTAGE (V)
Fig. 3 Typical Zener Breakdown Characteristics
10
100
V
Z
, NOMINAL ZENER VOLTAGE (V)
Fig. 4 Typical Total Capacitance vs. Nominal Zener Voltage
10
1
Package Outline Dimensions
C
H
B
A
M
L
K
J
SOD323
Dim
Min
Max
A
0.25
0.35
B
1.20
1.40
C
2.30
2.70
H
1.60
1.80
J
0.00
0.10
K
1.0
1.1
L
0.20
0.40
M
0.10
0.15
0°
8°
α
All Dimensions in mm
BZT52C2V0S - BZT52C39S
Document number: DS30093 Rev. 18 - 2
3 of 4
www.diodes.com
May 2012
© Diodes Incorporated
BZT52C2V0S - BZT52C39S
Suggested Pad Layout
C
X
Y
G
Z
Dimensions Value (in mm)
Z
3.75
G
1.05
X
0.65
Y
1.35
C
2.40
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
BZT52C2V0S - BZT52C39S
Document number: DS30093 Rev. 18 - 2
4 of 4
www.diodes.com
May 2012
© Diodes Incorporated
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