Multilayer Ceramic Chip Capacitors
FEATURES
• CLASS II DIELECTRIC, TEMPERATURE STABLE
• EXCELLENT FREQUENCY CHARACTERISTICS, NON-LINEAR
RoHS
CAPACITANCE CHANGE
Compliant
• HIGHER CAPACITANCE THAN NPO
Includes all homogeneous materials
• NICKEL BARRIER TERMINATIONS AND EXCELLENT
MECHANICAL STRENGTH
*See Part Number System for Details
SPECIFICATIONS
NMC Series X7R
47pF ~ 0.82µF (see high CV datasheet for higher capacitance values)
±5% (J), ±10% (K), ±20% (M)
-55°C ~ +125°C
±15%∆ max. over temperature range (with 0 Vdc applied)
10Vdc, 16Vdc, 25Vdc, 35Vdc, 50Vdc (see NMC-H Series for higher voltages)
2.5% max. (50Vdc, 100Vdc); 3.5% max. (16Vdc, 25Vdc) 5% max. (10Vdc)
@ 1.0Vrms and 1KHz, +25°C
insulation Resistance
10,000Megohms min. or 500Megohm/µF min. whichever is less @ +25°C
Dielectric Withstanding Voltage
250% of Rated Voltage for 1 ~ 5 seconds, 50mA maximum current
Test Conditions (EIA-198-2E)
1KHz, 1.0V ±0.2Vrms
Note: Reflow soldering allowed for all case sizes. Contact NIC for wave soldering restrictions.
Typical X7R Temperature Coefficient
% Capacitance Change
% Capacitance Change
Temperature °C
Voltage Coefficient of Capacitance - X7R
Capacitance Range
Capacitance Tolerance
Operating Temperature Range
Temperature Characteristics
Rated Voltages
Dissipation Factor
DC Volts Applied
Minimum Insulation Resistance
vs. Temperature
Impedance vs. Frequency - X7R
% Dissipation Factor
Impedance
Ω
% Dissipation Factor vs. Temperature
Insulation Resistance
(Ω Farads)
10000
1000
100
Frequency (MHz)
Temperature °C
10
10
Temperature °C
25
100 125
PART NUMBER SYSTEM
NMC 0805 X7R 102 K 50 TRP or TRPLP 3K
F
Series
RoHS Compliant
Optional Reel Qty (3K=3,000pcs)
Tape & Reel (Embossed Plastic Carrier)
Tape & Reel (Punched carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF, first 2 digits are
significant, 3rd digit is no. of zeros, “R” indicates
decimal for under 10pF
Temperature Characteristic
Size Code (see chart)
®
1
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
Multilayer Ceramic Chip Capacitors
REEL
B
Taping Specifications
B
C
50 min.
100 ± 1.0
100 ± 1.0
D
21 ± 1.0
T max.
8.4 +1.0/-0
(1812 case size
12.4 +2.0/-0)
REEL DIMENSIONS (mm)
Reel Diameter (A)
7” (178 ± 2.0)
10” (250 ± 2.0)
13” (330 ± 2.0)
13 ± 0.5
A
EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm)
Tape Size
8mm
12mm
W
8.0 ± 0.2
12 ± 0.2
F
3.5 ± 0.05
5.5 ± 0.05
E
1.75 ± 0.10
P
0
4.0 ± 0.1
P
2
2.0 ± 0.5
D
1.5
+0.1-0.0
K max.
3.0
T max.
2.0
4.5
P
4.0 ± 0.1
8.0 ± 0.1
Notes:
1. Specifications are in compliance with EIA RS481-1-A
“Taping of surface Mount Components for Automatic Placement”
2. Dimensions Ao (max.) equals component width dimension plus 0.5mm
3. Dimension Bo (max.) equals component length dimension plus 0.5mm
PUNCHED CARRIER TAPE DIMENSIONS (mm)
Type
A
o
B
o
W
F
E
P1
2.0 ± 0.05
8.0 ± 0.3
3.5 ± 0.05
1.75 ± 0.1
4.0 ± 0.10
01005 0.25 ± 0.04 0.45 ± 0.04
0201 0.37 ± 0.03 0.67 ± 0.05
0402 0.65 ± 0.05 1.15 ± 0.05
0603
1.1 ± 0.2
1.9 ± 0.2
0805 1.65 ± 0.2
2.4 ± 0.2
1206
2.0 ± 0.2
3.6 ± 0.2
®
4
NIC COMPONENTS CORP.
www.niccomp.com
D
C
T
D
t
1
B
o
t
2
A
o
7 INCH REEL QUANTITIES*
Size
Tape Size
Min. Qty
Per Reel
Max. Qty
Per Reel
01005
8mm
0201
8mm
0402
8mm
20,000
20,000
15,000
15,000
10,000
10,000
0603
8mm
4,000
4,000
0805
8mm
4,000
5,000
1206
8mm
4,000
5,000
1210
8mm
2,000
5,000
1812
12mm
1,000
2,000
*Quantity dependent on chip thickness. Contact NIC for reel
quantities on larger diameter reels.
CARRIER TAPE MATERIAL
Parts with a thickness of >1mm will be taped on embossed
plastic carrier. Parts with a thickness of less then 1mm
will be taped on paper carrier
EMBOSSED PLASTIC CARRIER TAPE
T
D
P
o
E
P
2
F
B
o
W
A
o
K
P
See notes 2 & 3 regarding dimensions
Ao and Bo
P0
D0
4.0 ± 0.1
1.5
+0.1/-0.0
T1
max.
0.27
0.45
1.1
T2
max.
0.36
0.80
1.4
Mounting
Hole
Angular
Punch
Hole
PUNCHED CARRIER TAPE
P
o
E
F
W
Component
Pitch
P1
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
Microcontroller MCU
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