TMP47C960AE datasheet, PDF - EEWORLD Datasheet

TMP47C960AE: DescriptionCMOS 4 BIT MICROCONTROLLER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size290KB，12 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TMP47C960AE Overview

CMOS 4 BIT MICROCONTROLLER

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	AWSDIP,
Contacts	64
Reach Compliance Code	unknow
Has ADC	NO
Address bus width
bit size	4
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PDIP-T64
JESD-609 code	e0
length	57.5 mm
Number of I/O lines	57
Number of terminals	64
Maximum operating temperature	70 °C
Minimum operating temperature	-30 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	AWSDIP
Package shape	RECTANGULAR
Package form	IN-LINE, PIGGYBACK, WINDOW, SHRINK PITCH
Certification status	Not Qualified
Maximum seat height	7.07 mm
Maximum supply voltage	6 V
Minimum supply voltage	4.5 V
surface mount	NO
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.778 mm
Terminal location	DUAL
width	19.05 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

	TMP47C960AE	TMP47C460AF	TMP47C460AN	TMP47C960A
Description	CMOS 4 BIT MICROCONTROLLER	CMOS 4 BIT MICROCONTROLLER	CMOS 4 BIT MICROCONTROLLER	CMOS 4 BIT MICROCONTROLLER
Is it Rohs certified?	incompatible	incompatible	incompatible	-
Parts packaging code	DIP	QFP	DIP	-
package instruction	AWSDIP,	QFP,	SDIP,	-
Contacts	64	67	64	-
Reach Compliance Code	unknow	unknow	unknow	-
Has ADC	NO	NO	NO	-
bit size	4	4	4	-
DAC channel	NO	NO	NO	-
DMA channel	NO	NO	NO	-
JESD-30 code	R-PDIP-T64	R-PQFP-G67	R-PDIP-T64	-
JESD-609 code	e0	e0	e0	-
length	57.5 mm	20 mm	57.5 mm	-
Number of I/O lines	57	57	57	-
Number of terminals	64	67	64	-
Maximum operating temperature	70 °C	70 °C	70 °C	-
Minimum operating temperature	-30 °C	-30 °C	-30 °C	-
PWM channel	NO	NO	NO	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	AWSDIP	QFP	SDIP	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	IN-LINE, PIGGYBACK, WINDOW, SHRINK PITCH	FLATPACK	IN-LINE, SHRINK PITCH	-
Certification status	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	7.07 mm	2.25 mm	5 mm	-
Maximum supply voltage	6 V	6 V	6 V	-
Minimum supply voltage	4.5 V	4.5 V	4.5 V	-
surface mount	NO	YES	NO	-
technology	CMOS	CMOS	CMOS	-
Temperature level	OTHER	OTHER	OTHER	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	-
Terminal pitch	1.778 mm	0.8 mm	1.778 mm	-
Terminal location	DUAL	QUAD	DUAL	-
width	19.05 mm	14 mm	19.05 mm	-
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	-
Base Number Matches	1	1	1	-

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