TMP47C460AF datasheet, PDF - EEWORLD Datasheet

TMP47C460AF: DescriptionCMOS 4 BIT MICROCONTROLLER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size290KB，12 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TMP47C460AF Overview

CMOS 4 BIT MICROCONTROLLER

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	QFP
package instruction	QFP,
Contacts	67
Reach Compliance Code	unknow
Has ADC	NO
Address bus width
bit size	4
maximum clock frequency	4.2 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PQFP-G67
JESD-609 code	e0
length	20 mm
Number of I/O lines	57
Number of terminals	67
Maximum operating temperature	70 °C
Minimum operating temperature	-30 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	RECTANGULAR
Package form	FLATPACK
Certification status	Not Qualified
ROM programmability	MROM
Maximum seat height	2.25 mm
Maximum slew rate	6 mA
Maximum supply voltage	6 V
Minimum supply voltage	4.5 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

	TMP47C460AF	TMP47C460AN	TMP47C960A	TMP47C960AE
Description	CMOS 4 BIT MICROCONTROLLER	CMOS 4 BIT MICROCONTROLLER	CMOS 4 BIT MICROCONTROLLER	CMOS 4 BIT MICROCONTROLLER
Is it Rohs certified?	incompatible	incompatible	-	incompatible
Parts packaging code	QFP	DIP	-	DIP
package instruction	QFP,	SDIP,	-	AWSDIP,
Contacts	67	64	-	64
Reach Compliance Code	unknow	unknow	-	unknow
Has ADC	NO	NO	-	NO
bit size	4	4	-	4
DAC channel	NO	NO	-	NO
DMA channel	NO	NO	-	NO
JESD-30 code	R-PQFP-G67	R-PDIP-T64	-	R-PDIP-T64
JESD-609 code	e0	e0	-	e0
length	20 mm	57.5 mm	-	57.5 mm
Number of I/O lines	57	57	-	57
Number of terminals	67	64	-	64
Maximum operating temperature	70 °C	70 °C	-	70 °C
Minimum operating temperature	-30 °C	-30 °C	-	-30 °C
PWM channel	NO	NO	-	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	QFP	SDIP	-	AWSDIP
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	FLATPACK	IN-LINE, SHRINK PITCH	-	IN-LINE, PIGGYBACK, WINDOW, SHRINK PITCH
Certification status	Not Qualified	Not Qualified	-	Not Qualified
Maximum seat height	2.25 mm	5 mm	-	7.07 mm
Maximum supply voltage	6 V	6 V	-	6 V
Minimum supply voltage	4.5 V	4.5 V	-	4.5 V
surface mount	YES	NO	-	NO
technology	CMOS	CMOS	-	CMOS
Temperature level	OTHER	OTHER	-	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	THROUGH-HOLE	-	THROUGH-HOLE
Terminal pitch	0.8 mm	1.778 mm	-	1.778 mm
Terminal location	QUAD	DUAL	-	DUAL
width	14 mm	19.05 mm	-	19.05 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	-	MICROCONTROLLER
Base Number Matches	1	1	-	1

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