U78-L1126-00121 datasheet, PDF

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U78-L1126-00121: DescriptionTelecom and Datacom Connector; CategoryThe connector The connector; File Size139KB，2 Pages; ManufacturerAmphenol; Websitehttp://www.amphenol.com/

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U78-L1126-00121 Overview

Telecom and Datacom Connector

U78-L1126-00121 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Objectid	1271185558
Reach Compliance Code	unknown
YTEOL	7.57
Other features	EMI SHIELD
Board mount options	PEG
body width	0.972 inch
subject depth	2.5 inch
body length	0.551 inch
Connector type	TELECOM AND DATACOM CONNECTOR
Contact to complete cooperation	GOLD (30)
Contact completed and terminated	Tin/Lead (Sn/Pb)
Contact point gender	FEMALE
Contact material	COPPER ALLOY
contact mode	STAGGERED
Contact resistance	70 mΩ
Contact style	TELCOM, MODULAR
Dielectric withstand voltage	300VAC V
Durability	250 Cycles
empty shell	NO
Filter function	NO
Insulation resistance	1000000000 Ω
insulator material	GLASS FILLED THERMOPLASTIC
JESD-609 code	e0
Mixed contacts	NO
Installation method	RIGHT ANGLE
Installation type	BOARD
PCB row number	8
Number of ports	2
Number of rows loaded	2+2
Maximum operating temperature	85 °C
Minimum operating temperature	-55 °C
Options	GENERAL PURPOSE
PCB contact pattern	STAGGERED
PCB contact row spacing	1.25 mm
Plating thickness	30u inch
Rated current (signal)	0.5 A
Guideline	UL
Terminal length	0.077 inch
Terminal pitch	1.6 mm
Termination type	PRESS FIT
Total number of contacts	20+20
UL Flammability Code	94V-0

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SFP

U77-A4114-2001

U77-A1118-2001

Amphenol’s SFP interconnect system consists of a 20-position connector enclosed in a metal cage mounted

to a host PCB.

Amphenol single port and stacked SFP connectors are rated up to 6 Gbps. They are available in standard

RoHS compliant or non-RoHS compliant versions. The cages have a one-piece construction with enhanced

transceiver mating tabs available in press-ﬁt version and solder tail version. Longer or shorter pins are available

as custom options.

Single Row versions (1xN) consist of SMT connectors used with a separate single row cage (press-ﬁt or solder

tail). Stacked versions (2xN) consist of a 2 row cage with integrated 2 row connectors. The entire assembly is

press-ﬁt compliant pin.

Speciﬁcation Highlights

The interconnect system is comprised of a cage assembly which is used with 20-position

SFP connectors complying with MSA Agreement INF-8074i.

General Characteristics

• RoHS compliant

• Industry standard footprint

• Industry standard EIA-364

Mechanical Characteristics

• Accepts multiple transceivers per INF-8074i

• Compliant press-ﬁt pins or solder tails (1x1 cages)

• Durability: 250 mating cycles minimum

Electrical Characteristics

• Hot swappable

• Operating voltage: 3.3 V

• Operating current: 0.5 A

• Differential impedance: 100

Ω+/-

Ω

• DWV: 300 V AC

• Insulation resistance: 1000 MΩ min

• Contact resistance: 70 mΩ max

• Spring ﬁngers for superior EMI grounding

Packaging

• Tape and reel packaging: connector or 1x1 cage

• Tray packaging: cage of all sizes

• Bulk packaging: dust cover

Materials

• Cage

• Base material: copper alloy

• Plating: nickel or tin

• Light pipe: optical grade polycarbonate

• Heat sink: aluminum alloy

• Heat sink clip: stainless steel

• Dust cover: thermoplastic

• EMI ground tabs: stainless steel

• Connector

• Contact base material: copper alloy

• Contact plating: gold on mating area; gold or matte tin on termination

• Housings: glass reinforced, lead-free solder reﬂow process

compatible thermoplastic, UL94V-0 rated

Temperature Rating

• Operating temperature: -55 °C to +85 °C

• Storage temperature: -55 °C to +105 °C

Configurations

(Rows x Ports per row)

• 1x1

• 1x2

• 1x4

• 2x1

• 2x2

• 2x4

Options

• Light pipes

• Heat sink (standard ﬁn for ﬁnal cage combo)

• Enhanced EMI performance cage

• Dust cover

• 1x6

• 2x6

1x4 SFP cage with heat sinks

U77-E4124-2041

2x2 SFP Combo

U78-B2127-00121

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