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5962-9755801QCX

Description
AS SERIES, 8-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14
Categorylogic    logic   
File Size137KB,5 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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5962-9755801QCX Overview

AS SERIES, 8-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14

5962-9755801QCX Parametric

Parameter NameAttribute value
MakerTexas Instruments
Parts packaging codeDIP
package instructionCERAMIC, DIP-14
Contacts14
Reach Compliance Codecompliant
seriesAS
JESD-30 codeR-GDIP-T14
length19.56 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeNAND GATE
MaximumI(ol)0.02 A
Number of functions1
Number of entries8
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum supply current (ICC)4.9 mA
Prop。Delay @ Nom-Sup5.5 ns
propagation delay (tpd)5.5 ns
Certification statusQualified
Schmitt triggerNO
Filter levelMIL-STD-883
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
Base Number Matches1

5962-9755801QCX Related Products

5962-9755801QCX 5962-9755801Q2X 5962-86837012X
Description AS SERIES, 8-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 AS SERIES, 8-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20 ALS SERIES, 8-INPUT NAND GATE, CQCC20, CERAMIC, CC-20
package instruction CERAMIC, DIP-14 CERAMIC, LCC-20 QCCN,
Reach Compliance Code compliant unknown compliant
series AS AS ALS
JESD-30 code R-GDIP-T14 S-CQCC-N20 S-CQCC-N20
length 19.56 mm 8.89 mm 8.89 mm
Logic integrated circuit type NAND GATE NAND GATE NAND GATE
Number of functions 1 1 1
Number of entries 8 8 8
Number of terminals 14 20 20
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
Package body material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP QCCN QCCN
Package shape RECTANGULAR SQUARE SQUARE
Package form IN-LINE CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
propagation delay (tpd) 5.5 ns 5.5 ns 15 ns
Certification status Qualified Not Qualified Qualified
Filter level MIL-STD-883 MIL-STD-883 MIL-STD-883
Maximum seat height 5.08 mm 2.03 mm 2.03 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO YES YES
technology TTL TTL TTL
Temperature level MILITARY MILITARY MILITARY
Terminal form THROUGH-HOLE NO LEAD NO LEAD
Terminal pitch 2.54 mm 1.27 mm 1.27 mm
Terminal location DUAL QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 8.89 mm 8.89 mm
Base Number Matches 1 1 1
Maker Texas Instruments Texas Instruments -
Parts packaging code DIP QLCC -
Contacts 14 20 -
Load capacitance (CL) 50 pF - 50 pF
MaximumI(ol) 0.02 A - 0.001 A
Maximum supply current (ICC) 4.9 mA - 0.9 mA
Prop。Delay @ Nom-Sup 5.5 ns - 14 ns
Schmitt trigger NO - NO
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